Patterning device cooling systems in a lithographic apparatus

    公开(公告)号:US10281830B2

    公开(公告)日:2019-05-07

    申请号:US15742179

    申请日:2016-06-17

    IPC分类号: G03F7/20

    摘要: A lithographic apparatus (100) includes a patterning device support structure (104) configured to support a patterning device (110), a gas inlet (116) configured to provide a gas flow (114) across a surface of the patterning device, and a temperature conditioning device (134) configured to condition the temperature of the gas flow based on a set point. The apparatus also includes a sensor (132) configured to measure a parameter indicative of an amount of heat added to at least one of the patterning device and a volume (126) between the patterning device and a lens (124) of a projection system (106) during operational use of the lithographic system. Further, the apparatus includes a controller (130) operatively coupled to the sensor and configured to adjust the set point based on the parameter measured by the sensor to control a temperature of the patterning device.

    Patterning device cooling apparatus

    公开(公告)号:US10990025B2

    公开(公告)日:2021-04-27

    申请号:US16289875

    申请日:2019-03-01

    IPC分类号: G03F7/20

    摘要: An apparatus and method for controlling temperature of a patterning device in a lithographic apparatus, by flowing gas across the patterning device. A patterning apparatus includes: a patterning device support structure configured to support a patterning device; a patterning device conditioning system including a first gas outlet configured to provide a gas flow over a surface of the patterning device and a second gas outlet configured to provide a gas flow over a part of a surface of the patterning device support structure not supporting the patterning device; and a control system configured to separately control the temperature of the gas exiting the first and second gas outlets such that the gas exiting the second gas outlet is at a higher temperature than the gas exiting the first gas outlet and/or to separately control the temperature and gas flow rate of the gas exiting the first and second gas outlets.