摘要:
A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
摘要:
A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
摘要:
A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
摘要:
The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.
摘要:
The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.
摘要:
A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes multiple heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes one or more swivel joints, each configured to provide one or more fluid paths between the cooling door and the frame. The cooling door assembly includes separate and independent fluid paths, where fluid is separately provided to each independent fluid path. Different groups of heat exchangers are coupled to each independent fluid path. In the event of failure of one of the independent fluid paths, the other independent fluid path(s) remain operational.
摘要:
The present invention provides methods and apparatuses which achieve high heat transfer in a fluid cooling system, and which do so with a small pressure drop across the system. The present invention teaches the use of wall features on the fins of a heat exchanger to cool fluid in a fluid cooling system. The present invention also discloses high aspect ratio, high surface area structures applicable in micro-heat exchangers for fluid cooling systems and cost effective methods for manufacturing the same.
摘要:
Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要:
A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.
摘要:
A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.