公开(公告)号：US20240404897A1

公开(公告)日：2024-12-05

申请号：US18676665

申请日：2024-05-29

Applicant: Advanced Micro Devices, Inc.

Inventor： Deepak Vasant KULKARNI ,  Raja SWAMINATHAN ,  Mihir PANDYA ,  Liwei WANG ,  Samuel NAFFZIGER

IPC: H01L23/13 ,  H01L23/00 ,  H01L23/498 ,  H01L25/18

Abstract: A chip complex is provided that includes at least a first IC die present in a first common tier, a passive interposer, and a plurality of IC dies present in a second common tier. The passive interposer includes an interconnect formed in a back end of the line (BEOL) region. The first IC die present in the first common tier are hybrid bonded to a top side of the passive interposer. The plurality of IC dies present in the second common tier are also hybrid bonded to a bottom side of the passive interposer.

公开(公告)号：US20250070031A1

公开(公告)日：2025-02-27

申请号：US18944757

申请日：2024-11-12

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Gabriel H LOH ,  Raja SWAMINATHAN ,  Rahul AGARWAL ,  Brett P. WILKERSON

IPC: H01L23/538 ,  G05F1/575 ,  H01L25/065 ,  H01L27/06

Abstract: A semiconductor package includes a package substrate having a first surface and an opposing second surface, and further includes an integrated circuit (IC) die disposed at the second surface and having a third surface facing the second surface and an opposing fourth surface. The IC die has a first region comprising one or more metal layers and circuit components for one or more functions of the IC die and a second region offset from the first region in a direction parallel with the third and fourth surfaces. The semiconductor package further includes a voltage regulator disposed at the fourth surface in the second region and having an input configured to receive a supply voltage and an output configured to provide a regulated voltage, and also includes a conductive path coupling the output of the voltage regulator to a voltage input of circuitry of the IC die.

公开(公告)号：US20240371714A1

公开(公告)日：2024-11-07

申请号：US18644958

申请日：2024-04-24

Applicant: Advanced Micro Devices, Inc.

Inventor： Deepak Vasant KULKARNI ,  Raja SWAMINATHAN ,  Sri Ranga Sai BOYAPATI ,  Brett P. WILKERSON

IPC: H01L23/15 ,  H01L21/683 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

Abstract: A chip package having a package substrate including a top surface. A first chip module and a second chip module are mounted above the top surface of the package substrate. A first interposer is disposed between the package substrate and the first and second chip modules and includes a glass interposer. The first interposer couples the first and second chip modules to the package substrate. An interconnect bridge is disposed in a cavity of the glass interposer. The interconnect bridge includes circuitry that connects a circuitry of the first chip module to a circuitry of the second chip module.

公开(公告)号：US20240234304A1

公开(公告)日：2024-07-11

申请号：US18402688

申请日：2024-01-02

Applicant: Advanced Micro Devices, Inc. ,  ATI Technologies ULC

Inventor： Deepak Vasant KULKARNI ,  Samuel NAFFZIGER ,  Raja SWAMINATHAN ,  Matthew STRAAYER ,  Justin Michael BURKHART ,  Sri Ranga Sai BOYAPATI ,  Hemanth Kumar DHAVALESWARAPU ,  Alexander Helmut PFEIFFENBERGER ,  Manjunath D. HARITSA

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/5227 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/29 ,  H01L25/0652 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2224/29009 ,  H01L2224/29025 ,  H01L2924/1206 ,  H01L2924/1427 ,  H01L2924/1431 ,  H01L2924/15311

Abstract: Chip packages are described herein that includes chiplets embedded in a core of a substrate of the chip package, such as a package substrate or an interposer. In one example, the chiplet includes voltage regulation circuitry that is coupled through a substrate core embedded inductor to an integrated circuit (IC) die mounted to the substrate.