公开(公告)号：US20240145319A1

公开(公告)日：2024-05-02

申请号：US18402661

申请日：2024-01-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L21/50 ,  H01L23/00 ,  H01L23/04 ,  H01L23/053 ,  H01L33/48

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L23/04 ,  H01L23/053 ,  H01L24/48 ,  H01L33/486 ,  G01L19/14 ,  H01L24/16 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/1659 ,  H01L2924/17151

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20180190553A1

公开(公告)日：2018-07-05

申请号：US15844276

申请日：2017-12-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L23/053 ,  H01L23/00

CPC classification number: H01L23/10 ,  G01L19/14 ,  H01L21/50 ,  H01L23/04 ,  H01L23/053 ,  H01L24/16 ,  H01L24/48 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/1659 ,  H01L2924/17151 ,  H01L2224/45099 ,  H01L2224/13099

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20220208623A1

公开(公告)日：2022-06-30

申请号：US17695757

申请日：2022-03-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L23/00 ,  H01L23/053 ,  H01L21/50 ,  H01L33/48 ,  H01L23/04

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20200243408A1

公开(公告)日：2020-07-30

申请号：US16851006

申请日：2020-04-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L23/00 ,  H01L23/053 ,  H01L21/50 ,  H01L33/48 ,  H01L23/04

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20180190629A1

公开(公告)日：2018-07-05

申请号：US15396079

申请日：2016-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung-Wei HSU ,  Hsin-Ying HO ,  Hsun-Wei CHAN

IPC: H01L25/16 ,  H01L31/14 ,  H01L31/0216 ,  H01L33/62 ,  H01L31/02

Abstract: An electronic device comprises a carrier, an emitter, a detector, a separation wall and a light shielding layer. The emitter is disposed on a first portion of the top surface of the carrier. The detector is disposed on a second portion of the top surface of the carrier. The separation wall is disposed on the top surface of the carrier between the emitter and the detector. The light shielding layer disposed adjacent to the top surface of the carrier and extends from the separation wall to the second portion of the carrier.