公开(公告)号：US11588470B2

公开(公告)日：2023-02-21

申请号：US16794112

申请日：2020-02-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ching-Han Huang ,  Kuo-Hua Lai ,  Hui-Chung Liu

IPC: H03L1/04 ,  H03H9/10 ,  H03H9/24 ,  H03H3/007 ,  H03H9/08 ,  H03H9/05 ,  H03L1/02

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US11296651B2

公开(公告)日：2022-04-05

申请号：US17074618

申请日：2020-10-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ching-Han Huang ,  Hui-Chung Liu ,  Kuo-Hua Lai ,  Cheng-Ling Huang

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

公开(公告)号：US12184266B2

公开(公告)日：2024-12-31

申请号：US18112464

申请日：2023-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ching-Han Huang ,  Kuo-Hua Lai ,  Hui-Chung Liu

IPC: H03L1/04 ,  H03H3/007 ,  H03H9/05 ,  H03H9/08 ,  H03H9/10 ,  H03H9/24 ,  H03L1/02

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US10812017B1

公开(公告)日：2020-10-20

申请号：US16530710

申请日：2019-08-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ching-Han Huang ,  Hui-Chung Liu ,  Kuo-Hua Lai ,  Cheng-Ling Huang

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.