SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE

    公开(公告)号:US20220230946A1

    公开(公告)日:2022-07-21

    申请号:US17151062

    申请日:2021-01-15

    Abstract: A substrate structure and a semiconductor package structure are provided. The substrate structure includes a first dielectric layer, a pad and a conductive structure. The first dielectric layer has a first surface and a second surface opposite to the first surface. The pad is adjacent to the first surface and at least partially embedded in the first dielectric layer. The first dielectric layer has an opening exposing the pad, and a width of the opening is less than a width of the pad. The conductive structure is disposed on the pad and composed of a first portion outside the opening of the first dielectric layer and a second portion embedded in the opening of the first dielectric layer. The first portion has an aspect ratio exceeding 1.375.

    PACKAGE STRUCTURE
    4.
    发明公开
    PACKAGE STRUCTURE 审中-公开

    公开(公告)号:US20230197600A1

    公开(公告)日:2023-06-22

    申请号:US17555227

    申请日:2021-12-17

    CPC classification number: H01L23/5226 H01L23/31 H01L23/12

    Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

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