公开(公告)号：US07349090B2

公开(公告)日：2008-03-25

申请号：US09956849

申请日：2001-09-20

申请人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

发明人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

IPC分类号： G01J4/00

CPC分类号： G03F7/70616 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a property of a specimen prior to, during, or subsequent to lithography. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，该系统可以被配置为确定样品的多个性质，包括但不限于在光刻之前，期间或之后的样品的性质。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US07130029B2

公开(公告)日：2006-10-31

申请号：US09956850

申请日：2001-09-20

申请人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

发明人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

IPC分类号： G01N21/88

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, an adhesion characteristic and a thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US08179530B2

公开(公告)日：2012-05-15

申请号：US12830408

申请日：2010-07-05

申请人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

发明人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

IPC分类号： G01B11/00 ,  G01B11/30 ,  G01B11/14 ,  G01B11/28

CPC分类号： G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位; 缺陷和薄膜特性; 临界尺寸和缺陷; 临界尺寸和薄膜特性; 临界尺寸，薄膜特性和缺陷; 宏观缺陷和微缺陷; 平整度，薄膜特性和缺陷; 重叠错位和平整度; 植入物特征和缺陷; 附着力和厚度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US20100271621A1

公开(公告)日：2010-10-28

申请号：US12830408

申请日：2010-07-05

申请人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

发明人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

IPC分类号： G01N21/00 ,  G01B11/14 ,  G01B11/00

CPC分类号： G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位; 缺陷和薄膜特性; 临界尺寸和缺陷; 临界尺寸和薄膜特性; 临界尺寸，薄膜特性和缺陷; 宏观缺陷和微缺陷; 平整度，薄膜特性和缺陷; 重叠错位和平整度; 植入物特征和缺陷; 附着力和厚度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US07006235B2

公开(公告)日：2006-02-28

申请号：US09956835

申请日：2001-09-20

申请人： Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Gary Bultman ,  Dan Wack ,  John Fielden

发明人： Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Gary Bultman ,  Dan Wack ,  John Fielden

IPC分类号： G01B11/30 ,  G01B11/24 ,  G01B11/00 ,  G01N21/00

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, overlay and flatness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US06917433B2

公开(公告)日：2005-07-12

申请号：US09956847

申请日：2001-09-20

申请人： Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

发明人： Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

IPC分类号： G01N21/21 ,  G01N21/47 ,  G01N21/55 ,  G01N21/63 ,  G01N21/64 ,  G01N21/95 ,  G03F7/20 ,  H01J37/317 ,  H01L21/02 ,  H01L21/265 ,  H01L21/66 ,  G01B11/28

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a property of a specimen prior to, during, or subsequent to an etch process. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于在蚀刻工艺之前，之中或之后的样品的性质。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US06829559B2

公开(公告)日：2004-12-07

申请号：US09957450

申请日：2001-09-20

申请人： Gary Bultman ,  Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

发明人： Gary Bultman ,  Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

IPC分类号： G01B1500

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro and micro defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US07139083B2

公开(公告)日：2006-11-21

申请号：US09956834

申请日：2001-09-20

申请人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

发明人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

IPC分类号： G01B11/28

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a composition and a thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US07106425B1

公开(公告)日：2006-09-12

申请号：US09956845

申请日：2001-09-20

申请人： Gary Bultman ,  Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

发明人： Gary Bultman ,  Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

IPC分类号： G01N21/88

CPC分类号： G01N21/9501 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N2021/646 ,  G01N2021/8825

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of defects on the specimen and a thin film characteristic of the specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于在样本上存在缺陷和样本的薄膜特性。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US06950196B2

公开(公告)日：2005-09-27

申请号：US09956841

申请日：2001-09-20

申请人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

发明人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

IPC分类号： G01N21/21 ,  G01N21/47 ,  G01N21/55 ,  G01N21/63 ,  G01N21/64 ,  G01N21/95 ,  G03F7/20 ,  H01J37/317 ,  H01L21/02 ,  H01L21/265 ,  H01L21/66 ,  G01B11/28 ,  G01N21/00

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a thickness of a structure on a specimen and at least one additional property of the specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于样本上的结构的厚度和样本的至少一个附加特性。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。