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公开(公告)号：US08120055B2
公开(公告)日：2012-02-21
申请号：US12426768
申请日：2009-04-20
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a light source are disclosed herein. An embodiment of the light source comprises a first terminal and a second terminal. The first terminal comprises a first terminal first portion and a first terminal second portion, wherein at least a portion of the first terminal second portion is located on a first plane, the first terminal second portion comprising at least two contacts separated by a space. A second terminal comprises a second terminal first portion and a second terminal second portion. The second terminal first portion is located proximate the first terminal first portion. The second terminal second portion is located substantially on the first plane and in the space. A light emitter is affixed to the first terminal first portion, the light emitter is electrically connected to the first terminal first portion. A connection exists between the light emitter and the second terminal first portion.
摘要翻译： 本文公开了光源的实施例。 光源的实施例包括第一端子和第二端子。 第一端子包括第一端子第一部分和第一端子第二部分，其中第一端子第二部分的至少一部分位于第一平面上，第一端子第二部分包括由空间分开的至少两个触点。 第二端子包括第二端子第一部分和第二端子第二部分。 第二端子第一部分位于第一端子第一部分附近。 第二端子第二部分基本上位于第一平面上并在该空间中。 光发射器固定到第一端子第一部分，光发射器电连接到第一端子第一部分。 光发射器和第二端子第一部分之间存在连接。
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公开(公告)号：US08115385B2
公开(公告)日：2012-02-14
申请号：US12871704
申请日：2010-08-30
IPC分类号： H01J1/62
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译： 公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。 主体包括顶表面，底表面和多个侧表面。 引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。 第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。 每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。 第一部分的第一突起提供改善的热传递。
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公开(公告)号：US20100320485A1
公开(公告)日：2010-12-23
申请号：US12871704
申请日：2010-08-30
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译： 公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。 主体包括顶表面，底表面和多个侧表面。 引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。 第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。 每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。 第一部分的第一突起提供改善的热传递。
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公开(公告)号：US20100264450A1
公开(公告)日：2010-10-21
申请号：US12426768
申请日：2009-04-20
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a light source are disclosed herein. An embodiment of the light source comprises a first terminal and a second terminal. The first terminal comprises a first terminal first portion and a first terminal second portion, wherein at least a portion of the first terminal second portion is located on a first plane, the first terminal second portion comprising at least two contacts separated by a space. A second terminal comprises a second terminal first portion and a second terminal second portion. The second terminal first portion is located proximate the first terminal first portion. The second terminal second portion is located substantially on the first plane and in the space. A light emitter is affixed to the first terminal first portion, the light emitter is electrically connected to the first terminal first portion. A connection exists between the light emitter and the second terminal first portion.
摘要翻译： 本文公开了光源的实施例。 光源的实施例包括第一端子和第二端子。 第一端子包括第一端子第一部分和第一端子第二部分，其中第一端子第二部分的至少一部分位于第一平面上，第一端子第二部分包括由空间分开的至少两个触点。 第二端子包括第二端子第一部分和第二端子第二部分。 第二端子第一部分位于第一端子第一部分附近。 第二端子第二部分基本上位于第一平面上并在该空间中。 光发射器固定到第一端子第一部分，光发射器电连接到第一端子第一部分。 光发射器和第二端子第一部分之间存在连接。
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公开(公告)号：US20110044062A1
公开(公告)日：2011-02-24
申请号：US12544140
申请日：2009-08-19
IPC分类号： F21V21/00
CPC分类号： F21K9/00 , F21Y2113/13 , F21Y2115/10
摘要： An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.
摘要翻译： 光源的实施例包括第一引线和第二引线。 第一引线包括第一安装表面，其中第一光发射器可连接到第一安装表面，附接到第一安装表面的支撑构件，附接到支撑构件的导体部分和从第一安装面延伸的至少一个突出部 表面，所述至少一个突片用于在制造期间保持第一引线。 第二引线是位于第一引线附近的第二引线，并且包括第二安装表面，其中第二光发射器可连接到第二安装表面，附接到第二安装表面的至少两个支撑构件和连接到第二安装表面的导体部分 支持成员。
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公开(公告)号：US20080170391A1
公开(公告)日：2008-07-17
申请号：US11622753
申请日：2007-01-12
IPC分类号： F21S4/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译： 公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。 主体包括顶表面，底表面和多个侧表面。 引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。 第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。 每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。 第一部分的第一突起提供改善的热传递。
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公开(公告)号：US07800304B2
公开(公告)日：2010-09-21
申请号：US11622753
申请日：2007-01-12
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译： 公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。 主体包括顶表面，底表面和多个侧表面。 引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。 第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。 每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。 第一部分的第一突起提供改善的热传递。
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公开(公告)号：US08356917B2
公开(公告)日：2013-01-22
申请号：US12544140
申请日：2009-08-19
IPC分类号： F21V21/00
CPC分类号： F21K9/00 , F21Y2113/13 , F21Y2115/10
摘要： An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.
摘要翻译： 光源的实施例包括第一引线和第二引线。 第一引线包括第一安装表面，其中第一光发射器可连接到第一安装表面，附接到第一安装表面的支撑构件，附接到支撑构件的导体部分和从第一安装面延伸的至少一个突出部 表面，所述至少一个突片用于在制造期间保持第一引线。 第二引线是位于第一引线附近的第二引线，并且包括第二安装表面，其中第二光发射器可连接到第二安装表面，附接到第二安装表面的至少两个支撑构件和连接到第二安装表面的导体部分 支持成员。
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公开(公告)号：US07547583B2
公开(公告)日：2009-06-16
申请号：US12044904
申请日：2008-03-07
申请人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
发明人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/495 , H01L23/34 , H01L31/0203
CPC分类号： H01L23/49568 , H01L24/48 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要翻译： 公开了一种用于封装集成电路的封装电路和方法。 封装电路具有引线框，集成电路芯片和封装层。 引线框架具有第一和第二部分，第一部分包括横向部分，芯片安装区域和第一延伸部分。 集成电路芯片安装在芯片安装区域并与芯片安装区域热接触。 封装层具有顶部，底部以及第一和第二侧表面。 第一延伸部被弯曲以提供从芯片安装区域到底部表面的第一热路径。 热路将热芯片安装区域连接到底面而不通过第一和第二侧表面，并且提供比通过横向部分或第二部分的热路径具有更小热阻的热路径。
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公开(公告)号：US20080153190A1
公开(公告)日：2008-06-26
申请号：US12044904
申请日：2008-03-07
申请人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
发明人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
IPC分类号： H01L33/00
CPC分类号： H01L23/49568 , H01L24/48 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要翻译： 公开了一种用于封装集成电路的封装电路和方法。 封装电路具有引线框，集成电路芯片和封装层。 引线框架具有第一和第二部分，第一部分包括横向部分，芯片安装区域和第一延伸部分。 集成电路芯片安装在芯片安装区域并与芯片安装区域热接触。 封装层具有顶部，底部以及第一和第二侧表面。 第一延伸部被弯曲以提供从芯片安装区域到底部表面的第一热路径。 热路将热芯片安装区域连接到底面而不通过第一和第二侧表面，并且提供比通过横向部分或第二部分的热路径热阻小的热路径。
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