公开(公告)号：US09711446B2

公开(公告)日：2017-07-18

申请号：US15363166

申请日：2016-11-29

Applicant: Ajinomoto Co., Inc.

Inventor： Shigeo Nakamura ,  Kazuhiko Tsurui ,  Shiro Tatsumi

IPC: H05K7/00 ,  H01L23/498 ,  H01L21/48 ,  C08K7/18 ,  C08K3/36

CPC classification number: H01L23/49894 ,  C08K3/36 ,  C08K7/18 ,  C08K9/06 ,  C08K2201/003 ,  C08K2201/006 ,  C08L63/00 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/49822

Abstract: Resin compositions containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler in which the content of (C) the inorganic filler is 55% by mass or higher with respect to 100% by mass of a non-volatile component within the resin composition, the average particle diameter of (C) the inorganic filler is 0.05 to 0.35 μm, the product of the specific surface area (m2/g) of (C) the inorganic filler and the true density of (C) the inorganic filler is 1 to 77 m2/g and the moisture permeation of a cured product obtained by thermally cured the resin composition is 0.05 to 2.8 g·mm/m2·24 h are useful for making printed wiring boards.

公开(公告)号：US10512161B2

公开(公告)日：2019-12-17

申请号：US16286237

申请日：2019-02-26

Applicant: Ajinomoto Co., Inc.

Inventor： Shigeo Nakamura ,  Shiro Tatsumi ,  Ikumi Sawa

IPC: H05K1/03 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498 ,  H05K3/00 ,  H05K3/22 ,  H05K3/40 ,  H05K3/46 ,  B32B27/00 ,  C08L63/00 ,  H01L23/14 ,  C08G59/62 ,  C08G59/68

Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties.

公开(公告)号：US10257928B2

公开(公告)日：2019-04-09

申请号：US15472684

申请日：2017-03-29

Applicant: Ajinomoto Co., Inc.

Inventor： Shigeo Nakamura ,  Shiro Tatsumi ,  Ikumi Sawa

IPC: H05K1/03 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498 ,  H05K3/00 ,  H05K3/22 ,  H05K3/40 ,  H05K3/46

Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties.