RESIN SHEET
    9.
    发明公开
    RESIN SHEET 审中-公开

    公开(公告)号:US20240034874A1

    公开(公告)日:2024-02-01

    申请号:US18466987

    申请日:2023-09-14

    发明人: Shu IKEHIRA

    摘要: A resin sheet including a support and a resin composition layer formed on the support, in which the resin composition layer contains (A) an epoxy resin, (B) an organic solvent, (C) an inorganic filler, and (D) a stress relaxing material, in which a content of an aromatic solvent having a boiling point of lower than 120° C. in the (B) component is in the range of 0 to 9% by mass relative to 100% by mass of total of the (B) component, can suppress an irregularity after lamination and a warpage after curing.