公开(公告)号：US09711446B2

公开(公告)日：2017-07-18

申请号：US15363166

申请日：2016-11-29

Applicant: Ajinomoto Co., Inc.

Inventor： Shigeo Nakamura ,  Kazuhiko Tsurui ,  Shiro Tatsumi

IPC: H05K7/00 ,  H01L23/498 ,  H01L21/48 ,  C08K7/18 ,  C08K3/36

CPC classification number: H01L23/49894 ,  C08K3/36 ,  C08K7/18 ,  C08K9/06 ,  C08K2201/003 ,  C08K2201/006 ,  C08L63/00 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/49822

Abstract: Resin compositions containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler in which the content of (C) the inorganic filler is 55% by mass or higher with respect to 100% by mass of a non-volatile component within the resin composition, the average particle diameter of (C) the inorganic filler is 0.05 to 0.35 μm, the product of the specific surface area (m2/g) of (C) the inorganic filler and the true density of (C) the inorganic filler is 1 to 77 m2/g and the moisture permeation of a cured product obtained by thermally cured the resin composition is 0.05 to 2.8 g·mm/m2·24 h are useful for making printed wiring boards.

公开(公告)号：US08912279B2

公开(公告)日：2014-12-16

申请号：US14087113

申请日：2013-11-22

Applicant: Ajinomoto Co., Inc.

Inventor： Shigeo Nakamura ,  Kazuhiko Tsurui ,  Masanori Yoda

IPC: C08G67/02 ,  C08K5/5415 ,  C09J11/06 ,  H05K3/38 ,  H01L23/14 ,  C08K3/00 ,  C08L63/00 ,  H05K1/03 ,  H01L23/29

CPC classification number: C09J11/06 ,  C08G77/14 ,  C08J5/24 ,  C08K3/00 ,  C08K5/5415 ,  C08L63/00 ,  C08L83/08 ,  C09D183/08 ,  C09J183/08 ,  H01L23/145 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K3/381 ,  Y10T428/24802 ,  H01L2924/00 ,  C08K9/04

Abstract: Resin compositions which contain an epoxy resin, an alkoxy oligomer, and an inorganic filler provide insulating layers that have a surface with not only low arithmetic mean roughness but also low root mean square roughness in a wet roughening step and that are capable of forming thereon a plated conductive layer having a sufficient peel strength that can be formed while maintaining the glass transition temperature and thermal expansion coefficient.

Abstract translation: 含有环氧树脂，烷氧基低聚物和无机填料的树脂组合物提供绝缘层，其具有在湿法粗糙化步骤中不仅具有低算术平均粗糙度，而且还具有低均方根粗糙度的表面，并且能够在其上形成 在保持玻璃化转变温度和热膨胀系数的同时可以形成足够的剥离强度的镀层导电层。

公开(公告)号：US12120827B2

公开(公告)日：2024-10-15

申请号：US16924796

申请日：2020-07-09

Applicant: AJINOMOTO CO., INC.

Inventor： Kazuhiko Tsurui

IPC: H05K3/00 ,  C23C14/20 ,  C23C14/34

CPC classification number: H05K3/0044 ,  C23C14/20 ,  C23C14/34 ,  H05K2203/0221 ,  H05K2203/0264 ,  H05K2203/107 ,  H05K2203/125

Abstract: Provided is a technique that can achieve an insulating layer with small surface undulations and can suppress a haloing phenomenon in manufacturing a printed wiring board even when using a thin resin composition layer. Specifically, provided is a method for manufacturing a printed wiring board that includes the steps of: (A) preparing a resin sheet with an inorganic layer including (i) a support with an inorganic layer including an inorganic layer, a support in contact with the inorganic layer, and a release layer and (ii) a resin composition layer in contact with the release layer of the support with an inorganic layer; (B) laminating the resin sheet with an inorganic layer onto an internal layer substrate so that the resin composition layer of the resin sheet with an inorganic layer is in contact with the internal layer substrate; (C) curing the resin composition layer to form an insulating layer; and (D) perforating the insulating layer.

公开(公告)号：US20140087152A1

公开(公告)日：2014-03-27

申请号：US14087113

申请日：2013-11-22

Applicant: Ajinomoto Co., Inc.

Inventor： Shigeo Nakamura ,  Kazuhiko Tsurui ,  Masanori Yoda

IPC: C09J11/06

CPC classification number: C09J11/06 ,  C08G77/14 ,  C08J5/24 ,  C08K3/00 ,  C08K5/5415 ,  C08L63/00 ,  C08L83/08 ,  C09D183/08 ,  C09J183/08 ,  H01L23/145 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K3/381 ,  Y10T428/24802 ,  H01L2924/00 ,  C08K9/04

Abstract: Resin compositions which contain an epoxy resin, an alkoxy oligomer, and an inorganic filler provide insulating layers that have a surface with not only low arithmetic mean roughness but also low root mean square roughness in a wet roughening step and that are capable of forming thereon a plated conductive layer having a sufficient peel strength that can be formed while maintaining the glass transition temperature and thermal expansion coefficient.

Abstract translation: 含有环氧树脂，烷氧基低聚物和无机填料的树脂组合物提供绝缘层，其具有在湿法粗糙化步骤中不仅具有低算术平均粗糙度，而且还具有低均方根粗糙度的表面，并且能够在其上形成 在保持玻璃化转变温度和热膨胀系数的同时可以形成足够的剥离强度的镀层导电层。