-
公开(公告)号：US20080151470A1
公开(公告)日：2008-06-26
申请号：US12043225
申请日：2008-03-06
申请人： Akihiro MOTOKI , Makoto OGAWA , Tatsuo KUNISHI , Jun NISHIKAWA , Yoshihiko TAKANO , Shigeyuki KURODA
发明人： Akihiro MOTOKI , Makoto OGAWA , Tatsuo KUNISHI , Jun NISHIKAWA , Yoshihiko TAKANO , Shigeyuki KURODA
IPC分类号： H01G4/005
CPC分类号： H01G4/30 , H01G4/0085 , H01G4/012 , H01G4/232 , Y10T29/435
摘要： A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.
摘要翻译： 进行层叠电子部件的制造方法，使得将防水剂施加到内部电极的端部露出的端面，以在绝缘层和内部电极之间的界面填充空间。 接着，进行研磨工序，使内部电极在端面充分露出，从其中除去多余的防水剂，使得能够在端面上直接形成镀膜。
-
公开(公告)号：US20100243133A1
公开(公告)日：2010-09-30
申请号：US12796688
申请日：2010-06-09
申请人： Tatsuo KUNISHI , Yoshihiko TAKANO , Shigeyuki KURODA , Akihiro MOTOKI , Hideyuki KASHIO , Takashi NOJI
发明人： Tatsuo KUNISHI , Yoshihiko TAKANO , Shigeyuki KURODA , Akihiro MOTOKI , Hideyuki KASHIO , Takashi NOJI
CPC分类号： C25D3/12 , C25D5/02 , C25D7/00 , C25D21/10 , H01G4/2325 , H01G4/30 , Y10T29/435 , Y10T29/49126 , Y10T29/49147 , Y10T29/49163 , Y10T29/49204
摘要： A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.
摘要翻译： 制备层叠体，其中相邻的内部电极在内部电极暴露的端面处彼此电绝缘，在绝缘层的厚度方向上测量的相邻内部电极之间的空间为约10μm 相邻的内部电极与端面的退出距离为1μm以下。 在电镀步骤中，沉积在相邻内部电极的端部上的电镀沉积物彼此连接。
-
公开(公告)号：US20080225462A1
公开(公告)日：2008-09-18
申请号：US12109371
申请日：2008-04-25
CPC分类号： H01G4/2325 , H01G4/30 , Y10T29/435
摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
摘要翻译： 例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后， 通过喷砂法或刷子抛光法。 外部电极由通过电镀或无电镀形成的镀膜限定。
-
公开(公告)号：US20130095233A1
公开(公告)日：2013-04-18
申请号：US13439916
申请日：2012-04-05
IPC分类号： B05D5/12
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译： 一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘 并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤 在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。
-
5.发明申请公开(公告)号：US20110162180A1
公开(公告)日：2011-07-07
申请号：US13051013
申请日：2011-03-18
申请人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
发明人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译： 层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤， 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。
-
公开(公告)号：US20080210564A1
公开(公告)日：2008-09-04
申请号：US12110484
申请日：2008-04-28
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component, includes the steps of preparing a laminate including a plurality of insulating layers laminated to each other and a plurality of internal electrodes formed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface so as to electrically connect the edges of the internal electrodes, which are exposed at the predetermined surface of the laminate. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface of the laminate which is prepared in the step of preparing a laminate and by performing plating growth of the plating deposits so as to be connected to each other, and a heat treatment step of performing a heat treatment on the laminate provided with the plating film formed thereon at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译： 一种多层电子部件的制造方法，其特征在于，包括以下步骤：层叠多个绝缘层的层叠体，以及沿着所述绝缘层的界面形成的多个内部电极，以预定的方式露出所述内部电极的边缘 表面，并且在预定表面上形成外部电极，以便电连接在层压体的预定表面处暴露的内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在制备层压体的步骤中制备的层压体的预定表面处暴露在内部电极的边缘上沉积电镀沉积物形成连续的镀膜，并进行电镀 电镀沉积物的生长以彼此连接;以及热处理步骤，对形成在其上的镀膜的层压体在氧分压为约5ppm以下，温度为 约600℃以上。
-
7.发明申请公开(公告)号：US20080239617A1
公开(公告)日：2008-10-02
申请号：US12055372
申请日：2008-03-26
申请人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
发明人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译： 层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤， 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.024 秒)
