公开(公告)号：US20100243133A1

公开(公告)日：2010-09-30

申请号：US12796688

申请日：2010-06-09

申请人： Tatsuo KUNISHI ,  Yoshihiko TAKANO ,  Shigeyuki KURODA ,  Akihiro MOTOKI ,  Hideyuki KASHIO ,  Takashi NOJI

发明人： Tatsuo KUNISHI ,  Yoshihiko TAKANO ,  Shigeyuki KURODA ,  Akihiro MOTOKI ,  Hideyuki KASHIO ,  Takashi NOJI

IPC分类号： B32B38/00 ,  B32B38/10

CPC分类号： C25D3/12 ,  C25D5/02 ,  C25D7/00 ,  C25D21/10 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49163 ,  Y10T29/49204

摘要： A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.

摘要翻译： 制备层叠体，其中相邻的内部电极在内部电极暴露的端面处彼此电绝缘，在绝缘层的厚度方向上测量的相邻内部电极之间的空间为约10μm 相邻的内部电极与端面的退出距离为1μm以下。 在电镀步骤中，沉积在相邻内部电极的端部上的电镀沉积物彼此连接。

公开(公告)号：US20080151470A1

公开(公告)日：2008-06-26

申请号：US12043225

申请日：2008-03-06

申请人： Akihiro MOTOKI ,  Makoto OGAWA ,  Tatsuo KUNISHI ,  Jun NISHIKAWA ,  Yoshihiko TAKANO ,  Shigeyuki KURODA

发明人： Akihiro MOTOKI ,  Makoto OGAWA ,  Tatsuo KUNISHI ,  Jun NISHIKAWA ,  Yoshihiko TAKANO ,  Shigeyuki KURODA

IPC分类号： H01G4/005

CPC分类号： H01G4/30 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/232 ,  Y10T29/435

摘要： A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.

摘要翻译： 进行层叠电子部件的制造方法，使得将防水剂施加到内部电极的端部露出的端面，以在绝缘层和内部电极之间的界面填充空间。 接着，进行研磨工序，使内部电极在端面充分露出，从其中除去多余的防水剂，使得能够在端面上直接形成镀膜。

公开(公告)号：US20080225462A1

公开(公告)日：2008-09-18

申请号：US12109371

申请日：2008-04-25

申请人： Akihiro MOTOKI ,  Kenichi KAWASAKI ,  Makoto OGAWA ,  Shigeyuki KURODA ,  Tatsuo KUNISHI

发明人： Akihiro MOTOKI ,  Kenichi KAWASAKI ,  Makoto OGAWA ,  Shigeyuki KURODA ,  Tatsuo KUNISHI

IPC分类号： H01G4/232 ,  H01G7/00

CPC分类号： H01G4/2325 ,  H01G4/30 ,  Y10T29/435

摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.

摘要翻译： 例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后， 通过喷砂法或刷子抛光法。 外部电极由通过电镀或无电镀形成的镀膜限定。

公开(公告)号：US20110287176A1

公开(公告)日：2011-11-24

申请号：US13105926

申请日：2011-05-12

申请人： Junichi SAITO ,  Toshihiko KOBAYASHI ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Kenichi KAWASAKI ,  Tatsuo KUNISHI

发明人： Junichi SAITO ,  Toshihiko KOBAYASHI ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Kenichi KAWASAKI ,  Tatsuo KUNISHI

IPC分类号： B05D5/12 ,  B05D1/38 ,  B05D3/00 ,  B05D1/36

CPC分类号： H01G2/103 ,  B05D1/38 ,  B05D5/12 ,  B05D7/14 ,  H01G4/224

摘要： In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

摘要翻译： 为了防止水分进入陶瓷电子部件的部件主体的空隙部，至少陶瓷电子部件的部件主体使用防水剂赋予防水性。 将防水剂溶解在超临界流体如超临界CO 2流体中作为溶剂，以至少提供组分主体的防水性。 在提供拒水性之后，除去组分主体外表面上的防水剂。 作为防水剂，可以使用硅烷偶联剂。

公开(公告)号：US20100149724A1

公开(公告)日：2010-06-17

申请号：US12631924

申请日：2009-12-07

申请人： Makoto OGAWA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA ,  Tatsuo KUNISHI

发明人： Makoto OGAWA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA ,  Tatsuo KUNISHI

IPC分类号： H01G4/06 ,  B32B37/04 ,  C25D5/02 ,  C25D17/00

CPC分类号： H01G4/00 ,  C23C18/1632 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/00 ,  C25D1/10 ,  H01G4/232 ,  H01G4/30 ,  H01G13/006 ,  Y10T29/43

摘要： A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

摘要翻译： 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。

公开(公告)号：US20080145551A1

公开(公告)日：2008-06-19

申请号：US12041889

申请日：2008-03-04

申请人： Tatsuo KUNISHI ,  Makoto OGAWA ,  Akihiro MOTOKI

发明人： Tatsuo KUNISHI ,  Makoto OGAWA ,  Akihiro MOTOKI

IPC分类号： B05D1/18 ,  B05D5/12

CPC分类号： H01G4/2325 ,  H01G4/12 ,  H01G4/30 ,  H01G13/006

摘要： An electroless plating step for forming external electrodes includes preparing a plating solution including a reducing agent and metal ions having a more electochemically positive deposition potential than the oxidation-reduction potential of the reducing agent, placing a laminate for a multilayer electronic component together with a conductive medium having catalytic activity for an oxidation reaction of the reducing agent in a vessel, and stirring the laminate and the conductive medium in the plating solution by rotation, shaking, inclination, or vibration. Electroless plating proceeds to connect each other plating deposits deposited on the ends of a plurality of internal electrodes.

摘要翻译： 用于形成外部电极的化学镀步骤包括制备包含还原剂的电镀溶液和具有比还原剂的氧化还原电位更具有电化学正的沉积电位的金属离子，将多层电子部件的层压体与导电 具有对容器中还原剂的氧化反应的催化活性的介质，通过旋转，摇动，倾斜或振动来搅拌电镀液中的层压体和导电介质。 化学镀继续连接沉积在多个内部电极的端部上的彼此沉积的镀敷沉积物。

公开(公告)号：US20110252629A1

公开(公告)日：2011-10-20

申请号：US13167751

申请日：2011-06-24

申请人： Tatsuo KUNISHI ,  Junichi SAITO ,  Yoshinori UEDA ,  Akihiro MOTOKI

发明人： Tatsuo KUNISHI ,  Junichi SAITO ,  Yoshinori UEDA ,  Akihiro MOTOKI

IPC分类号： H05K13/00

CPC分类号： H01G4/105 ,  H01G4/1209 ,  H01G4/30 ,  H01L41/273 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002

摘要： Provided is a method for producing a ceramic body, which is capable of preventing the ingress of moisture into a void between a conductor and the ceramic body more effectively in the ceramic body including the conductor therein. Ingress of a supercritical fluid containing an oxide sol precursor is achieved into a void between an internal electrode layer and a ceramic laminate. After that, the oxide sol is turned into a gel, and subjected to a heat treatment, thereby filling the void between the internal electrode layer and the ceramic laminate with an oxide.

摘要翻译： 提供一种陶瓷体的制造方法，其能够防止在包含导体的陶瓷体中更有效地将水分进入导体和陶瓷体之间的空隙。 含有氧化物溶胶前体的超临界流体的入口被实现为内部电极层和陶瓷层压体之间的空隙。 之后，将氧化物溶胶变成凝胶，进行热处理，从而用氧化物填充内部电极层和陶瓷层叠体之间的空隙。

公开(公告)号：US20090303656A1

公开(公告)日：2009-12-10

申请号：US12405405

申请日：2009-03-17

申请人： Makoto OGAWA ,  Akihiro MOTOKI ,  Tatsuo KUNISHI ,  Shunsuke TAKEUCHI ,  Kenichi KAWASAKI

发明人： Makoto OGAWA ,  Akihiro MOTOKI ,  Tatsuo KUNISHI ,  Shunsuke TAKEUCHI ,  Kenichi KAWASAKI

IPC分类号： H01G4/30

CPC分类号： H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  Y10T29/435

摘要： A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.

摘要翻译： 单片陶瓷电子部件包括层压体，其包括多个层叠的陶瓷层和在陶瓷层之间延伸的多个内部电极，并且还包括设置在层叠体上的外部电极。 内部电极部分地暴露在层压体的表面处并且与外部电极彼此电连接。 外部电极包括第一镀层和第二镀层。 第一镀层与内部电极直接接触。 第二镀层位于第一镀层的外侧，并含有分散在其中的玻璃粒子。

公开(公告)号：US20110020603A1

公开(公告)日：2011-01-27

申请号：US12897161

申请日：2010-10-04

申请人： Tatsuo KUNISHI ,  Junichi Saito ,  Daisuke Megumi ,  Yoshinori Ueda ,  Yasuaki Kainuma ,  Mikiya Kobayashi ,  Shinji Otani

发明人： Tatsuo KUNISHI ,  Junichi Saito ,  Daisuke Megumi ,  Yoshinori Ueda ,  Yasuaki Kainuma ,  Mikiya Kobayashi ,  Shinji Otani

IPC分类号： H01G9/042 ,  H01G4/008 ,  B32B3/26 ,  B32B3/30 ,  B05D5/12 ,  C23C28/00 ,  C25D5/10

CPC分类号： H01G9/0032 ,  H01G9/012 ,  H01G9/048 ,  H01G9/055 ,  H01G9/07 ,  H01G9/15 ,  Y10T428/24355 ,  Y10T428/26

摘要： Disclosed is a capacitor which has a high capacitance and a low equivalent series resistance. The capacitor includes a conductive base material composed of a plating film having a specific surface area of 100 mm2/mm3 or more, a dielectric film on a surface of the conductive base material, and an opposed conductor formed so as to be opposed to the conductive base material with the dielectric film interposed therebetween. The plating film constituting the conductive base material is formed by electrolytic plating or electroless plating, and may have a porous form, wire-like form or broccoli-like form.

摘要翻译： 公开了具有高电容和低等效串联电阻的电容器。 电容器包括由比表面积为100mm 2 / mm 3以上的镀膜构成的导电性基材，导电性基材的表面上的电介质膜和形成为与导电性基体材料相对的相对导体 其间插入有电介质膜的基材。 构成导电性基材的镀膜通过电解电镀或无电镀形成，可以是多孔形状，线状或花椰菜状。