公开(公告)号：US08739700B2

公开(公告)日：2014-06-03

申请号：US13019579

申请日：2011-02-02

申请人： Akio Igarashi ,  Makoto Homma ,  Naoaki Hashimoto ,  Tomoyuki Yahagi

发明人： Akio Igarashi ,  Makoto Homma ,  Naoaki Hashimoto ,  Tomoyuki Yahagi

IPC分类号： B41F15/20 ,  B41L13/02

CPC分类号： B41M1/12 ,  B41F15/20 ,  B41F15/24

摘要： In a printing system in which a roll film is rolled out to be printed by a printer and the film is rolled up after printing and drying, there is a possibility that wrinkles of the film are generated when printing, and printed materials are scratched because the printed film is positioned near the printer. Both end side of a suction stage in the film delivery direction are formed in a circular arc shape, and auxiliary stages are provided near the end portions to suck and hold a film, the auxiliary stages are allowed to be moved lower than a surface of the suction stage in the state to closely attach the film to the suction stage while applying tension to the film, and the film is sucked and held on the suction stage in the state to be printed after position adjustment to a surface of a mask.

摘要翻译： 在通过打印机将卷膜卷成印刷并且在印刷和干燥之后卷起薄膜的印刷系统中，印刷时可能会产生皱纹，印刷材料因为 印刷胶片位于打印机附近。 在膜输送方向上的吸入台的两端部形成为圆弧状，在端部附近设置辅助台以吸引和保持膜，辅助台被允许移动到低于 在该状态下，将薄膜紧密地附着在吸附台上，同时向薄膜施加张力，并且在将位置调整到面罩表面之后，将薄膜吸收并保持在待打印状态下的抽吸台上。

公开(公告)号：US20100272884A1

公开(公告)日：2010-10-28

申请号：US12765129

申请日：2010-04-22

申请人： Akio IGARASHI ,  Noriaki Mukai ,  Makoto Honma ,  Naoaki Hashimoto

发明人： Akio IGARASHI ,  Noriaki Mukai ,  Makoto Honma ,  Naoaki Hashimoto

IPC分类号： B05D5/12 ,  B05C5/00

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L24/742 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H05K3/3478 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides a solder ball printing apparatus and a solder ball printing method in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask.A solder ball shaking and discharging unit includes a solder ball feeding unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached so as to surround a solder ball shaking and discharging port of the solder ball feeding unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball loading members, each of which is arranged in the front and rear of the wire member in a convex shape to load the solder balls into an opening area of a mask.

摘要翻译： 本发明提供了一种焊球印刷设备和焊球印刷方法，其中焊球均匀地分散在掩模表面上并被装载到掩模的开口区域中。 焊球摇动和放电单元包括焊球供给单元，其从焊球储存单元接收焊球，凸形的线构件，其被附接以包围焊球的震动和焊球的进给端口 单元，并且其中多个线构件以预定间隔布置，以及焊球加载构件，其中每个被布置在线构件的前部和后部为凸形，以将焊球加载到开口区域中 面具。

公开(公告)号：US20100270357A1

公开(公告)日：2010-10-28

申请号：US12756314

申请日：2010-04-08

申请人： Makoto HONMA ,  Akio Igarashi ,  Naoaki Hashimoto ,  Noriaki Mukai

发明人： Makoto HONMA ,  Akio Igarashi ,  Naoaki Hashimoto ,  Noriaki Mukai

IPC分类号： B23K3/06

CPC分类号： B23K3/0623 ,  B23K1/0016 ,  B23K2101/40 ,  H01L2224/742 ,  H05K3/3478 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/0557

摘要： The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask.A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.

摘要翻译： 本发明提供了一种焊球印刷设备，其中焊球均匀地分散在掩模表面上并被装载到掩模的开口区域中。 焊球摇动和放电单元包括焊球接收单元，其从焊球储存单元接收焊球，凸形的线构件，其被附接以围绕焊球围绕焊球的震动和放电端口的摇动和放电 单元，其中多个线构件以预定间隔布置，以及焊球旋转和收集机构，其以凸形的形式在线构件上扫掠并收集焊球。

公开(公告)号：US07896223B2

公开(公告)日：2011-03-01

申请号：US12543585

申请日：2009-08-19

申请人： Makoto Honma ,  Noriaki Mukai ,  Shinichiro Kawabe ,  Akio Igarashi ,  Naoaki Hashimoto

发明人： Makoto Honma ,  Noriaki Mukai ,  Shinichiro Kawabe ,  Akio Igarashi ,  Naoaki Hashimoto

IPC分类号： B23K31/02

CPC分类号： H01L24/11 ,  B23K3/0623 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01016 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/181 ,  H05K3/3478 ,  H05K2203/0139 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00

摘要： Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy.Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.

摘要翻译： 形成在半导体芯片的电极部上的焊料凸块近来小型化，并且当使用焊球进行印刷时，焊球也小型化。 因此，需要准确地印刷用于印刷的焊球。 代替常规的刮板，在打印头部分设置包括多个半螺旋线材的焊球加载部件，用于印刷焊球，并且通过以预定的按压力将焊球加载部件按压到掩模表面， 焊球的转动力由线材形成的空间加入。 因此，焊球适度地分散，并且被挤压到掩模的开口部分。

公开(公告)号：US08038050B2

公开(公告)日：2011-10-18

申请号：US12756314

申请日：2010-04-08

申请人： Makoto Honma ,  Akio Igarashi ,  Naoaki Hashimoto ,  Noriaki Mukai

发明人： Makoto Honma ,  Akio Igarashi ,  Naoaki Hashimoto ,  Noriaki Mukai

IPC分类号： B23K3/06

CPC分类号： B23K3/0623 ,  B23K1/0016 ,  B23K2101/40 ,  H01L2224/742 ,  H05K3/3478 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/0557

摘要： The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.

摘要翻译： 本发明提供了一种焊球印刷设备，其中焊球均匀地分散在掩模表面上并被装载到掩模的开口区域中。 焊球摇动和放电单元包括焊球接收单元，其从焊球储存单元接收焊球，凸形的线构件，其被附接以围绕焊球围绕焊球的震动和放电端口的摇动和放电 单元，其中多个线构件以预定间隔布置，以及焊球旋转和收集机构，其以凸形的形式在线构件上扫掠并收集焊球。

公开(公告)号：US09394280B2

公开(公告)日：2016-07-19

申请号：US13598253

申请日：2012-08-29

申请人： Satoshi Seo ,  Satoko Shitagaki ,  Miyako Morikubo ,  Naoaki Hashimoto ,  Takahiro Ishisone ,  Kyoko Takeda ,  Hiromi Seo

发明人： Satoshi Seo ,  Satoko Shitagaki ,  Miyako Morikubo ,  Naoaki Hashimoto ,  Takahiro Ishisone ,  Kyoko Takeda ,  Hiromi Seo

IPC分类号： H01L51/50 ,  C07D403/14 ,  C07D409/14 ,  H05B33/14 ,  C09K11/06 ,  H01L51/00

CPC分类号： H01L51/0072 ,  C07D403/14 ,  C07D409/14 ,  C09K11/025 ,  C09K11/06 ,  C09K2211/1007 ,  C09K2211/1044 ,  C09K2211/185 ,  H01L51/006 ,  H01L51/0071 ,  H01L51/0074 ,  H01L51/0085 ,  H01L51/5012 ,  H01L51/5016 ,  H01L51/5024 ,  H01L51/5076 ,  H05B33/14

摘要： To provide a novel heterocyclic compound that can be used as a host material in which a light-emitting substance of a light-emitting layer is dispersed. A heterocyclic compound comprising a dibenzo[f,h]quinoxaline ring and two hole-transport skeletons, where the dibenzo[f,h]quinoxaline ring and the two hole-transport skeletons are bonded to an aromatic hydrocarbon group. A heterocyclic compound represented by the following general formula (G1) is provided. Note that in the formula, A1 and A2 each independently represent any of a substituted or unsubstituted carbazole skeleton, a substituted or unsubstituted dibenzofuran skeleton, and a substituted or unsubstituted dibenzothiophen skeleton; B represents a substituted or unsubstituted dibenzo[f,h]quinoxaline skeleton; and Ar represents an arene skeleton having 6 to 13 carbon atoms. A light-emitting element including the heterocyclic compound is provided.

摘要翻译： 提供可用作分散发光层的发光物质的主体材料的新型杂环化合物。 包含二苯并[f，h]喹喔啉环和两个空穴传输骨架的杂环化合物，其中二苯并[f，h]喹喔啉环和两个空穴传输骨架与芳族烃基键合。 提供由以下通式（G1）表示的杂环化合物。 注意，在该式中，A1和A2各自独立地表示取代或未取代的咔唑骨架，取代或未取代的二苯并呋喃骨架和取代或未取代的二苯并噻吩骨架中的任意一种; B代表取代或未取代的二苯并[f，h]喹喔啉骨架; Ar表示碳原子数6〜13的芳烃骨架。 提供了包含杂环化合物的发光元件。

公开(公告)号：US20130082591A1

公开(公告)日：2013-04-04

申请号：US13598253

申请日：2012-08-29

申请人： Satoshi Seo ,  Satoko Shitagaki ,  Miyako Morikubo ,  Naoaki Hashimoto ,  Takahiro Ishisone ,  Kyoko Takeda ,  Hiromi Seo

发明人： Satoshi Seo ,  Satoko Shitagaki ,  Miyako Morikubo ,  Naoaki Hashimoto ,  Takahiro Ishisone ,  Kyoko Takeda ,  Hiromi Seo

IPC分类号： C07D403/14 ,  C07D409/14 ,  H05B33/14

CPC分类号： H01L51/0072 ,  C07D403/14 ,  C07D409/14 ,  C09K11/025 ,  C09K11/06 ,  C09K2211/1007 ,  C09K2211/1044 ,  C09K2211/185 ,  H01L51/006 ,  H01L51/0071 ,  H01L51/0074 ,  H01L51/0085 ,  H01L51/5012 ,  H01L51/5016 ,  H01L51/5024 ,  H01L51/5076 ,  H05B33/14

摘要： To provide a novel heterocyclic compound that can be used as a host material in which a light-emitting substance of a light-emitting layer is dispersed. A heterocyclic compound comprising a dibenzo[f,h]quinoxaline ring and two hole-transport skeletons, where the dibenzo[f,h]quinoxaline ring and the two hole-transport skeletons are bonded to an aromatic hydrocarbon group. A heterocyclic compound represented by the following general formula (G1) is provided. Note that in the formula, A1 and A2 each independently represent any of a substituted or unsubstituted carbazole skeleton, a substituted or unsubstituted dibenzofuran skeleton, and a substituted or unsubstituted dibenzothiophen skeleton; B represents a substituted or unsubstituted dibenzo[f,h]quinoxaline skeleton; and Ar represents an arene skeleton having 6 to 13 carbon atoms. A light-emitting element including the heterocyclic compound is provided.

摘要翻译： 提供可用作分散发光层的发光物质的主体材料的新型杂环化合物。 包含二苯并[f，h]喹喔啉环和两个空穴传输骨架的杂环化合物，其中二苯并[f，h]喹喔啉环和两个空穴传输骨架与芳族烃基键合。 提供由以下通式（G1）表示的杂环化合物。 注意，在该式中，A1和A2各自独立地表示取代或未取代的咔唑骨架，取代或未取代的二苯并呋喃骨架和取代或未取代的二苯并噻吩骨架中的任意一种; B代表取代或未取代的二苯并[f，h]喹喔啉骨架; Ar表示碳原子数6〜13的芳烃骨架。 提供了包含杂环化合物的发光元件。