公开(公告)号：US08739700B2

公开(公告)日：2014-06-03

申请号：US13019579

申请日：2011-02-02

申请人： Akio Igarashi ,  Makoto Homma ,  Naoaki Hashimoto ,  Tomoyuki Yahagi

发明人： Akio Igarashi ,  Makoto Homma ,  Naoaki Hashimoto ,  Tomoyuki Yahagi

IPC分类号： B41F15/20 ,  B41L13/02

CPC分类号： B41M1/12 ,  B41F15/20 ,  B41F15/24

摘要： In a printing system in which a roll film is rolled out to be printed by a printer and the film is rolled up after printing and drying, there is a possibility that wrinkles of the film are generated when printing, and printed materials are scratched because the printed film is positioned near the printer. Both end side of a suction stage in the film delivery direction are formed in a circular arc shape, and auxiliary stages are provided near the end portions to suck and hold a film, the auxiliary stages are allowed to be moved lower than a surface of the suction stage in the state to closely attach the film to the suction stage while applying tension to the film, and the film is sucked and held on the suction stage in the state to be printed after position adjustment to a surface of a mask.

摘要翻译： 在通过打印机将卷膜卷成印刷并且在印刷和干燥之后卷起薄膜的印刷系统中，印刷时可能会产生皱纹，印刷材料因为 印刷胶片位于打印机附近。 在膜输送方向上的吸入台的两端部形成为圆弧状，在端部附近设置辅助台以吸引和保持膜，辅助台被允许移动到低于 在该状态下，将薄膜紧密地附着在吸附台上，同时向薄膜施加张力，并且在将位置调整到面罩表面之后，将薄膜吸收并保持在待打印状态下的抽吸台上。

公开(公告)号：USD686276S1

公开(公告)日：2013-07-16

申请号：US29429046

申请日：2012-08-07

申请人： Hirokuni Kurihara ,  Takao Kawano ,  Tomoyuki Yahagi ,  Makoto Homma

设计人： Hirokuni Kurihara ,  Takao Kawano ,  Tomoyuki Yahagi ,  Makoto Homma

公开(公告)号：US08921157B2

公开(公告)日：2014-12-30

申请号：US13426687

申请日：2012-03-22

申请人： Noriaki Mukai ,  Masaru Mitsumoto ,  Makoto Homma

发明人： Noriaki Mukai ,  Masaru Mitsumoto ,  Makoto Homma

IPC分类号： H01L21/00 ,  H01L21/44 ,  H05K3/34 ,  H01L21/56 ,  H01L23/00 ,  H05K3/30

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L23/564 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/73104 ,  H01L2224/75272 ,  H01L2224/75281 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8388 ,  H01L2224/83951 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/303 ,  H05K2201/0129 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T156/1304 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/3512 ,  H01L2924/00

摘要： Solder bumps are formed on a plurality of electrode parts of a printed substrate and a semiconductor chip is loaded on the printed substrate via the plurality of solder bumps. In this case, a thermoplastic film is prepared as an underfill that covers a surface of the printed substrate on which the solder bumps are formed. In the film, parts corresponding to the solder bumps are removed and a peripheral edge of a part on which the semiconductor chip will be loaded has a protruded form. After the printed substrate has been covered with the film, the film is bonded onto the board and the semiconductor chip is loaded on the printed substrate and carried into a reflow furnace. In the reflow furnace, heat and pressure are applied to fuse the solder bumps.

摘要翻译： 在印刷基板的多个电极部分上形成焊料凸块，并且通过多个焊料凸块将半导体芯片装载到印刷基板上。 在这种情况下，制备热塑性膜作为覆盖形成有焊锡凸块的印刷基板的表面的底部填充物。 在薄膜中，除去对应于焊料凸点的部分，并且其上将加载半导体芯片的部分的外围边缘具有突出的形状。 在印刷基板被膜覆盖之后，将膜粘合到板上，并将半导体芯片装载在印刷基板上，并携带到回流炉中。 在回流炉中，施加热和压力来熔化焊料凸块。

公开(公告)号：US4362998A

公开(公告)日：1982-12-07

申请号：US7981

申请日：1979-01-31

申请人： Kazuo Watanabe ,  Masanori Ienaka ,  Yasuo Kominami ,  Makoto Homma

发明人： Kazuo Watanabe ,  Masanori Ienaka ,  Yasuo Kominami ,  Makoto Homma

IPC分类号： H03D3/06 ,  H03D1/22 ,  H03D3/14 ,  H03D3/22 ,  H03D13/00

CPC分类号： H03D3/22 ,  H03D3/14 ,  H03D1/229 ,  H03D13/008 ,  H03D2200/0009 ,  H03D2200/0049

摘要： An FM detector is constructed of a phase shift network and an analog multiplier. The analog multiplier includes a differential amplifier circuit and a phase detector circuit. The differential amplifier circuit includes differential pair transistors which are driven by FM intermediate frequency signals. One of the differential pair transistors has another transistor connected thereto which is also driven by the FM intermediate frequency signal. A collector signal of either one of the differential pair transistors is applied to the phase detector circuit through the phase shift network, while a collector signal of the other transistor is directly applied to the phase detector circuit. An emitter of the one transistor and an emitter of the other transistor are connected through resistors, whereby the signal-to-noise ratio of the FM detector is improved.

摘要翻译： FM检波器由相移网络和模拟乘法器构成。 模拟乘法器包括差分放大器电路和相位检测器电路。 差分放大器电路包括由FM中频信号驱动的差分对晶体管。 差分对晶体管中的一个具有连接到其上的另一个晶体管，其也由FM中频信号驱动。 差分对晶体管中的任一个的集电极信号通过​​相移网络施加到相位检测器电路，而另一个晶体管的集电极信号被直接施加到相位检测器电路。 一个晶体管的发射极和另一个晶体管的发射极通过电阻连接，从而提高了FM检测器的信噪比。

公开(公告)号：US4041518A

公开(公告)日：1977-08-09

申请号：US677023

申请日：1976-04-14

申请人： Shinji Shimizu ,  Seiichi Iwamatsu ,  Makoto Homma

发明人： Shinji Shimizu ,  Seiichi Iwamatsu ,  Makoto Homma

IPC分类号： H01L21/033 ,  H01L21/20 ,  H01L21/285 ,  H01L21/3205 ,  H01L21/336 ,  H01L21/8234 ,  H01L21/8236 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/08 ,  H01L29/78 ,  H01L29/04 ,  H01L27/02

CPC分类号： H01L29/66651 ,  H01L21/033 ,  H01L21/28525 ,  H01L21/32055 ,  H01L21/8234 ,  H01L21/8236 ,  H01L21/823814 ,  H01L27/0922 ,  H01L27/0925 ,  H01L29/0847 ,  H01L29/66628 ,  H01L29/78 ,  Y10S148/009 ,  Y10S148/141 ,  Y10S438/969

摘要： A metal-insulator semiconductor (MIS) device is manufactured by initially forming, on a semiconductor substrate, an insulating film having a hole therethrough and depositing silicon on the substrate to form a first monocrystalline silicon film in the hole and a polycrystalline silicon film on the insulating film. Then, a further insulating film is formed on the first silicon film, and a second silicon film is formed on the further insulating film. The second silicon film and the further insulating film are removed, so that the monocrystalline and polycrystalline parts of the first silicon film are exposed at both sides of the remaining part of the second silicon film and the further insulating film. Finally, an impurity is diffused to form a source and a drain region in the monocrystalline silicon film and conductive layers of polycrystalline silicon are disposed contiguous to the source and drain regions.

摘要翻译： 通过在半导体衬底上初始形成具有孔的绝缘膜并在衬底上沉积硅以在孔中形成第一单晶硅膜并在其上形成多晶硅膜来制造金属绝缘体半导体（MIS）器件 绝缘膜。 然后，在第一硅膜上形成另一绝缘膜，在另一绝缘膜上形成第二硅膜。 去除第二硅膜和另外的绝缘膜，使得第一硅膜的单晶和多晶部分暴露在第二硅膜的剩余部分和另外的绝缘膜的两侧。 最后，杂质扩散以在单晶硅膜中形成源极和漏极区域，并且多晶硅的导电层设置成邻接于源极和漏极区域。

公开(公告)号：US06237484B1

公开(公告)日：2001-05-29

申请号：US09199169

申请日：1998-11-25

申请人： Makoto Homma ,  Mitsuhiko Sato ,  Isao Abe ,  Noriaki Mukai

发明人： Makoto Homma ,  Mitsuhiko Sato ,  Isao Abe ,  Noriaki Mukai

IPC分类号： B41F3500

CPC分类号： B41F35/005 ,  B41P2235/246

摘要： A screen printing apparatus 199, 169 has a roll paper vibrating device which vibrates roll paper in contact with the lower surface of a screen mask in a direction perpendicular to a moving direction of the roll paper while the roll paper is being moved in contact with the lower surface of the screen mask. Thereby, the roll paper in contact with the lower surface of the screen mask is moved in a waveform-shape pattern. Therefore, the cumulative contact area of the roll paper on the lower surface of the mask is increased, and it is possible to efficiently remove residue, such as paste attached onto the lower surface of the screen mask of the printing apparatus and paste attached inside pattern openings of the screen mask, to maintain a good printing performance.

摘要翻译： 丝网印刷装置199,169具有卷纸振动装置，其在与卷纸的移动方向垂直的方向上振动与丝网掩模的下表面接触的卷纸，同时使卷纸与纸幅移动接触 屏幕面的下表面。 由此，与屏幕掩模的下表面接触的卷纸以波形形状移动。 因此，掩模的下表面上的卷纸的累积接触面积增加，并且可以有效地除去附着在印刷装置的屏幕掩模的下表面上的糊状物和附着在图案内的糊状物 打开屏幕面罩，保持良好的打印性能。

公开(公告)号：US5309011A

公开(公告)日：1994-05-03

申请号：US960848

申请日：1992-10-14

申请人： Masanori Tazunoki ,  Hiromitsu Mishimagi ,  Makoto Homma ,  Toshiyuki Sakuta ,  Hisashi Nakamura ,  Keiji Sasaki ,  Minoru Enomoto ,  Toshihiko Satoh ,  Kunizo Sahara ,  Shigeo Kuroda ,  Kanji Otsuka ,  Masao Kawamura ,  Hinoko Kurosawa ,  Kazuya Ito

发明人： Masanori Tazunoki ,  Hiromitsu Mishimagi ,  Makoto Homma ,  Toshiyuki Sakuta ,  Hisashi Nakamura ,  Keiji Sasaki ,  Minoru Enomoto ,  Toshihiko Satoh ,  Kunizo Sahara ,  Shigeo Kuroda ,  Kanji Otsuka ,  Masao Kawamura ,  Hinoko Kurosawa ,  Kazuya Ito

IPC分类号： H01L23/14 ,  H01L23/32 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L27/02 ,  H01L27/10 ,  H01L27/15

CPC分类号： H01L23/147 ,  H01L23/32 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/073 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025

摘要： To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.

摘要翻译： 为了实现全尺寸晶片存储器或晶片级积分存储器系统的更高的封装密度和一个晶片级，晶片以预定的间隔彼此垂直堆叠。 改进了封装技术，使得可以精确地实现存储器系统布局并且可以形成精确的通孔。 此外，其他芯片固定在晶片上，从而进一步实现高封装密度。

公开(公告)号：US5176078A

公开(公告)日：1993-01-05

申请号：US887794

申请日：1992-05-26

申请人： Makoto Homma ,  Norio Beppu

发明人： Makoto Homma ,  Norio Beppu

IPC分类号： B41F15/08 ,  B41F15/12 ,  B41F15/26 ,  B41F15/36 ,  B41F15/40 ,  B41F33/00 ,  H05K3/12

CPC分类号： B41F15/12 ,  B41F33/0081 ,  H05K3/1216

摘要： A screen printing machine comprises a conveyor for conveying a substrate to a positioning station, an XY.theta. table on which the substrate is to be put, and a printing device for printing a pattern onto the substrate in a printing station. The XY.theta. table is movable in an XY.theta. plane in the positioning station and also movable along a Z-direction perpendicular to the XY.theta. plane. The machine further comprises a device for moving the printing device between the printing station and a waiting station, an image processing device and a driving device for the XY.theta. table. The image processing device recognizes a position of the substrate and calculates the respective amount of movement of the XY.theta. table in the XY.theta. plane necessary for making the predetermined relative positional relation between the printing device and the substrate. The driving device moves the XY.theta. table, based on the amounts of movement calculated by the image processing device.

摘要翻译： 丝网印刷机包括用于将基材输送到定位台的输送机，待放置基板的XYθ台，以及用于在印刷台中将图案印刷到基板上的印刷装置。 XYθ台可在定位台中的XYθ平面中移动，并且也可以沿着垂直于XYθ平面的Z方向移动。 该机器还包括用于在打印站和等待站之间移动打印装置的装置，用于XYθ台的图像处理装置和驱动装置。 图像处理装置识别基板的位置，并计算在制作打印装置和基板之间的预定相对位置关系所需的XYθ平面中的XYθ表的相应移动量。 驱动装置基于由图像处理装置计算的移动量移动XYθ表。

公开(公告)号：US4392747A

公开(公告)日：1983-07-12

申请号：US199976

申请日：1980-10-23

申请人： Akio Kumada ,  Takahiko Ihochi ,  Makoto Homma ,  Masashi Tanaka

发明人： Akio Kumada ,  Takahiko Ihochi ,  Makoto Homma ,  Masashi Tanaka

IPC分类号： H04R17/10 ,  G04G13/02 ,  G09F27/00 ,  G10K9/12 ,  G10K9/122 ,  G10K13/00 ,  G04C23/02 ,  G04C21/16

CPC分类号： G10K13/00 ,  G04G13/021

摘要： A display device structure comprising a casing, a display panel placed in the casing, a transparent covering and vibrating plate member on the front side of the display panel and an actuator for the plate member. The covering and vibrating plate member is carried on the casing through an elastic member interposed between the peripheral portion of the plate member and the casing. By this arrangement the plate member is capable of effectively generating sound outward upon reception of vibrating force from the actuator.

摘要翻译： 一种显示装置结构，包括壳体，放置在壳体中的显示面板，在显示面板的前侧上的透明覆盖物和振动板构件以及用于板构件的致动器。 覆盖振动板构件通过插入在板构件的周边部分和壳体之间的弹性构件承载在壳体上。 通过这种布置，板构件能够在从致动器接收到振动力时有效地产生声音。

公开(公告)号：US20120244666A1

公开(公告)日：2012-09-27

申请号：US13426687

申请日：2012-03-22

申请人： Noriaki MUKAI ,  Masaru Mitsumoto ,  Makoto Homma

发明人： Noriaki MUKAI ,  Masaru Mitsumoto ,  Makoto Homma

IPC分类号： H01L21/56 ,  B23K37/00 ,  B32B38/04

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L23/564 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/73104 ,  H01L2224/75272 ,  H01L2224/75281 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8388 ,  H01L2224/83951 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/303 ,  H05K2201/0129 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T156/1304 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/3512 ,  H01L2924/00

摘要： Solder bumps are formed on a plurality of electrode parts of a printed substrate and a semiconductor chip is loaded on the printed substrate via the plurality of solder bumps. In this case, a thermoplastic film is prepared as an underfill that covers a surface of the printed substrate on which the solder bumps are formed. In the film, parts corresponding to the solder bumps are removed and a peripheral edge of a part on which the semiconductor chip will be loaded has a protruded form. After the printed substrate has been covered with the film, the film is bonded onto the board and the semiconductor chip is loaded on the printed substrate and carried into a reflow furnace. In the reflow furnace, heat and pressure are applied to fuse the solder bumps.

摘要翻译： 在印刷基板的多个电极部分上形成焊料凸块，并且通过多个焊料凸块将半导体芯片装载到印刷基板上。 在这种情况下，制备热塑性膜作为覆盖形成有焊锡凸块的印刷基板的表面的底部填充物。 在薄膜中，除去对应于焊料凸点的部分，并且其上将加载半导体芯片的部分的外围边缘具有突出的形状。 在印刷基板被膜覆盖之后，将膜粘合到板上，并将半导体芯片装载在印刷基板上，并携带到回流炉中。 在回流炉中，施加热和压力来熔化焊料凸块。