摘要:
The present invention provides a method of forming a thin film containing a metal oxide as the main component, the film thickness of which is relatively uniform, at a high film deposition rate over a wide area and over a long time. The present invention is a method for forming a thin film containing a metal oxide as the main component on a substrate using a mixed gas stream containing a metal chloride, an oxidizing material, and hydrogen chloride, by a thermal decomposition method at a film deposition rate of 4500 nm/min. or greater, performing at least one selected from: 1) prior to mixing the metal chloride and the oxidizing material in the mixed gas stream, contacting hydrogen chloride with at least one selected from the metal chloride and the oxidizing material, and 2) forming a buffer layer in advance on a surface of the substrate on which the thin film containing a metal oxide as the main component is to be formed.
摘要:
The present invention provides a method of forming a thin film containing a metal oxide as the main component, the film thickness of which is relatively uniform, at a high film deposition rate over a wide area and over a long time. The present invention is a method for forming a thin film containing a metal oxide as the main component on a substrate using a mixed gas stream containing a metal chloride, an oxidizing material, and hydrogen chloride, by a thermal decomposition method at a film deposition rate of 4500 nm/min. or greater, performing at least one selected from: 1) prior to mixing the metal chloride and the oxidizing material in the mixed gas stream, contacting hydrogen chloride with at least one selected from the metal chloride and the oxidizing material, and 2) forming a buffer layer in advance on a surface of the substrate on which the thin film containing a metal oxide as the main component is to be formed.
摘要:
The present invention provides a method of forming a thin film containing a metal oxide as the main component, the film thickness of which is relatively uniform, at a high film deposition rate over a wide area and over a long time. The present invention is a method for forming a thin film containing a metal oxide as the main component on a substrate using a mixed gas stream containing a metal chloride, an oxidizing material, and hydrogen chloride, by a thermal decomposition method at a film deposition rate of 4500 nm/min. or greater, performing at least one selected from: 1) prior to mixing the metal chloride and the oxidizing material in the mixed gas stream, contacting hydrogen chloride with at least one selected from the metal chloride and the oxidizing material, and 2) forming a buffer layer in advance on a surface of the substrate on which the thin film containing a metal oxide as the main component is to be formed.
摘要:
The present invention provides a thin film-forming method by which, even when a thin film containing a crystalline metal oxide as the main component is formed over a wide area within a short time utilizing a thermal decomposition method, the thickness of the thin film becomes relatively uniform. A thin film-forming method of the present invention includes forming a thin film using a raw material containing a chloride of a metal, and prior to the forming of the thin film, 1) disposing metal-containing particles on the substrate, or 2) forming, at a film deposition rate slower than a film deposition rate for the thin film, a metal-containing thin film on the substrate, and wherein, in the case of the step 2), the thin film containing the metal oxide as the main component is directly formed on the metal-containing thin film.
摘要:
The present invention provides a thin film-forming method by which, even when a thin film containing a crystalline metal oxide as the main component is formed over a wide area within a short time utilizing a thermal decomposition method, the thickness of the thin film becomes relatively uniform. A thin film-forming method of the present invention includes forming a thin film using a raw material containing a chloride of a metal, and prior to the forming of the thin film, 1) disposing metal-containing particles on the substrate, or 2) forming, at a film deposition rate slower than a film deposition rate for the thin film, a metal-containing thin film on the substrate, and wherein, in the case of the step 2), the thin film containing the metal oxide as the main component is directly formed on the metal-containing thin film.
摘要:
A transparent conductive film wherein the height number distribution of projections present on the surface is expressed by a distribution function of χ2 type having a degree of freedom of 3.5 to 15 when the unit of the horizontal axis is a nanometer, the height/width ratio number distribution is expressed by a distribution function of χ2 type having a degree of freedom of 10-35χ2, the projections having a height of 50-350 nm account for 70% of more, and the projections having a height/width ratio of 0.25-1.02 account for 90% or more.
摘要:
A transparent conductive film wherein the height number distribution of projections present on the surface is expressed by a distribution function of χ2 type having a degree of freedom of 3.5 to 15 when the unit of the horizontal axis is a nanometer, the height/width ratio number distribution is expressed by a distribution function of χ2 type having a degree of freedom of 10-35χ2, the projections having a height of 50-350 nm account for 70% of more, and the projections having a height/width ratio of 0.25-1.02 account for 90% or more.
摘要:
A transparent conductive film wherein the height number distribution of projections present on the surface is expressed by a distribution function of X2 type having a degree of freedom of 3.5 to 15 when the unit of the horizontal axis is a nanometer, the height/width ratio number distribution is expressed by a distribution function of X2 type having a degree of freedom of 10-35X2, the projections having a height of 50-350 nm account for 70% of more, and the projections having a height/width ratio of 0.25-1.02 account for 90% or more.
摘要:
On a glass sheet, undercoating layers and a transparent conductive film containing tin oxide as the main component are formed in this order. The surface of the transparent conductive film is provided with roughness including convex portions and concave portions. The convex portions have a mean diameter in a range between 0.05 &mgr;m and 0.3 &mgr;m and include five convex portions or less with diameters of at least 0.5 &mgr;m per 100 &mgr;m2 of the surface. On the transparent conductive film, a photovoltaic unit and a back electrode are formed, thus obtaining a photoelectric conversion device.
摘要翻译:在玻璃板上,依次形成底涂层和含有氧化锡作为主要成分的透明导电膜。 透明导电膜的表面设置有包括凸部和凹部的粗糙度。 凸部的平均直径在0.05μm〜0.3μm之间的范围内,并且包括表面的直径为至少0.5μm/ m 2的五个凸部或更小的直径。 在透明导电膜上形成光电单元和背面电极,从而获得光电转换装置。
摘要:
A transparent substrate, a transparent conductive film, photoelectric conversion units, and a back electrode are stacked sequentially from a side on which light is incident. Further, intermediate films are formed between the transparent substrate and the transparent conductive film. The intermediate films are formed so that the relationship of R1