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1.发明授权Method of manufacturing a semiconductor device with trench isolation between two regions having different gate insulating films 失效在具有不同栅极绝缘膜的两个区域之间制造具有沟槽隔离的半导体器件的方法公开(公告)号：US06969660B2
公开(公告)日：2005-11-29
申请号：US11007462
申请日：2004-12-09
IPC分类号： H01L27/115 , H01L21/762 , H01L21/8234 , H01L21/8246 , H01L27/105 , H01L21/336
CPC分类号： H01L27/11568 , H01L21/76232 , H01L21/823462 , H01L21/823481 , H01L27/105 , H01L27/11573
摘要： The major surface of a semiconductor substrate of a semiconductor device includes first and second regions and a boundary area therebetween. A first gate insulating film and a first gate electrode are formed in the first region. A second gate insulating film different from the first gate insulating film and a second gate electrode are formed in the second region. A device isolation region is formed in the boundary area. This device isolation region includes a trench formed in the major surface, and an insulating layer having a portion buried in the trench and a portion projecting upward from the major surface. The bottom of the trench has depths different with portions.
摘要翻译： 半导体器件的半导体衬底的主表面包括第一和第二区域以及它们之间的边界区域。 第一栅极绝缘膜和第一栅电极形成在第一区域中。 在第二区域中形成与第一栅极绝缘膜和第二栅极电极不同的第二栅极绝缘膜。 在边界区域形成器件隔离区。 该器件隔离区域包括形成在主表面中的沟槽，以及绝缘层，其具有埋在沟槽中的部分和从主表面向上突出的部分。 沟槽的底部具有与部分不同的深度。
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2.发明申请Method of manufactoring a semiconductor device with trench isolation between two regions having different gate insulating films 失效在具有不同栅极绝缘膜的两个区域之间制造具有沟槽隔离的半导体器件的方法公开(公告)号：US20050133874A1
公开(公告)日：2005-06-23
申请号：US11007462
申请日：2004-12-09
IPC分类号： H01L27/115 , H01L21/762 , H01L21/8234 , H01L21/8246 , H01L27/105 , H01L29/76
CPC分类号： H01L27/11568 , H01L21/76232 , H01L21/823462 , H01L21/823481 , H01L27/105 , H01L27/11573
摘要： The major surface of a semiconductor substrate of a semiconductor device includes first and second regions and a boundary area therebetween. A first gate insulating film and a first gate electrode are formed in the first region. A second gate insulating film different from the first gate insulating film and a second gate electrode are formed in the second region. A device isolation region is formed in the boundary area. This device isolation region includes a trench formed in the major surface, and an insulating layer having a portion buried in the trench and a portion projecting upward from the major surface. The bottom of the trench has depths different with portions.
摘要翻译： 半导体器件的半导体衬底的主表面包括第一和第二区域以及它们之间的边界区域。 第一栅极绝缘膜和第一栅电极形成在第一区域中。 在第二区域中形成与第一栅极绝缘膜和第二栅极电极不同的第二栅极绝缘膜。 在边界区域形成器件隔离区。 该器件隔离区域包括形成在主表面中的沟槽，以及绝缘层，其具有埋在沟槽中的部分和从主表面向上突出的部分。 沟槽的底部具有与部分不同的深度。
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3.发明授权Semiconductor device with trench isolation between two regions having different gate insulating films 失效在具有不同栅极绝缘膜的两个区域之间具有沟槽隔离的半导体器件公开(公告)号：US06844590B2
公开(公告)日：2005-01-18
申请号：US10180328
申请日：2002-06-27
IPC分类号： H01L27/115 , H01L21/762 , H01L21/8234 , H01L21/8246 , H01L27/105 , H01L29/792
CPC分类号： H01L27/11568 , H01L21/76232 , H01L21/823462 , H01L21/823481 , H01L27/105 , H01L27/11573
摘要： The major surface of a semiconductor substrate of a semiconductor device includes first and second regions and a boundary area therebetween. A first gate insulating film and a first gate electrode are formed in the first region. A second gate insulating film different from the first gate insulating film and a second gate electrode are formed in the second region. A device isolation region is formed in the boundary area. This device isolation region includes a trench formed in the major surface, and an insulating layer having a portion buried in the trench and a portion projecting upward from the major surface. The bottom of the trench has depths different with portions.
摘要翻译： 半导体器件的半导体衬底的主表面包括第一和第二区域以及它们之间的边界区域。 第一栅极绝缘膜和第一栅电极形成在第一区域中。 在第二区域中形成与第一栅极绝缘膜和第二栅极电极不同的第二栅极绝缘膜。 在边界区域形成器件隔离区。 该器件隔离区域包括形成在主表面中的沟槽，以及绝缘层，其具有埋在沟槽中的部分和从主表面向上突出的部分。 沟槽的底部具有与部分不同的深度。
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公开(公告)号：US20070187749A1
公开(公告)日：2007-08-16
申请号：US11733488
申请日：2007-04-10
申请人： Kikuko Sugimae , Hiroyuki Kutsukake , Masayuki Ichige , Michiharu Matsui , Yuji Takeuchi , Riichiro Shirota
发明人： Kikuko Sugimae , Hiroyuki Kutsukake , Masayuki Ichige , Michiharu Matsui , Yuji Takeuchi , Riichiro Shirota
IPC分类号： H01L29/788
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524 , H01L27/11529
摘要： A semiconductor device comprises a memory cell array portion and peripheral circuit portion, wherein a first insulation film including elements as main components other than nitrogen fills between the memory cell gate electrodes of the memory cell array portion, the first insulation film is formed as a liner on a sidewall of a peripheral gate electrode of the peripheral circuit portion simultaneously with the memory cell portion, and a second insulation film including nitrogen as the main component is formed on the sidewall of the peripheral gate electrode via the first insulation film, thus enabling not only the formation of the memory cell portion having high reliability, but also the formation of a peripheral circuit with good efficiency, simultaneously, and avoiding gate offset of a peripheral gate.
摘要翻译： 半导体器件包括存储单元阵列部分和外围电路部分，其中包括作为除氮之外的主要成分的元素的第一绝缘膜填充在存储单元阵列部分的存储单元栅电极之间，第一绝缘膜形成为衬垫 在周边电路部分的外围栅电极的侧壁上与存储单元部分同时，并且通过第一绝缘膜在外围栅电极的侧壁上形成包括氮作为主要成分的第二绝缘膜，从而不能 仅形成具有高可靠性的存储单元部分，而且形成具有良好效率的周边电路，同时避免了外围栅极的栅极偏移。
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公开(公告)号：US20070152261A1
公开(公告)日：2007-07-05
申请号：US11687019
申请日：2007-03-16
IPC分类号： H01L29/788
CPC分类号： H01L27/11526 , H01L21/76229 , H01L27/105 , H01L27/115 , H01L27/11519 , H01L27/11521 , H01L27/11524 , H01L27/11529 , H01L27/11531 , H01L27/11543 , H01L29/7887
摘要： Disclosure is semiconductor device of a selective gate region, comprising a semiconductor layer, a first insulating film formed on the semiconductor layer, a first electrode layer formed on the first insulating layer, an element isolating region comprising an element isolating insulating film formed to extend through the first electrode layer and the first insulating film to reach an inner region of the semiconductor layer, the element isolating region isolating a element region and being self-aligned with the first electrode layer, a second insulating film formed on the first electrode layer and the element isolating region, an open portion exposing a surface of the first electrode layer being formed in the second insulating film, and a second electrode layer formed on the second insulating film and the exposed surface of the first electrode layer, the second electrode layer being electronically connected to the first electrode layer via the open portion.
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公开(公告)号：US06927449B2
公开(公告)日：2005-08-09
申请号：US10991521
申请日：2004-11-19
IPC分类号： H01L21/8247 , H01L27/10 , H01L27/105 , H01L27/115 , H01L29/788 , H01L29/792
CPC分类号： H01L27/11526 , H01L21/76229 , H01L27/105 , H01L27/115 , H01L27/11519 , H01L27/11521 , H01L27/11524 , H01L27/11529 , H01L27/11531 , H01L27/11543 , H01L29/7887
摘要： A semiconductor device of a selective gate region having a semiconductor layer, a first insulating film formed on the semiconductor layer, a first electrode layer formed on the first insulating film, and an element isolating region including an element isolating insulating film formed to extend through the first electrode layer and the first insulating film to reach an inner region of the semiconductor layer. The element isolating region isolates an element region and is self-aligned with the first electrode layer, a second insulating film is formed on the first electrode layer and the element isolating region, and an open portion exposes a surface of the first electrode layer and is formed in the second insulating film. A second electrode layer is formed on the second insulating film and the exposed surface of the first electrode layer, the second electrode layer being electrically connected to the first electrode layer via the open portion.
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7.发明授权公开(公告)号：US06853029B2
公开(公告)日：2005-02-08
申请号：US10155086
申请日：2002-05-28
申请人： Masayuki Ichige , Yuji Takeuchi , Michiharu Matsui , Atsuhiro Sato , Kikuko Sugimae , Riichiro Shirota
发明人： Masayuki Ichige , Yuji Takeuchi , Michiharu Matsui , Atsuhiro Sato , Kikuko Sugimae , Riichiro Shirota
IPC分类号： G11C16/04 , H01L21/8247 , H01L27/115 , H01L29/788
CPC分类号： H01L27/11521 , G11C16/0483 , H01L27/115 , H01L27/11524 , H01L27/11526 , H01L27/11529
摘要： A semiconductor device includes a semiconductor substrate, source and drain regions, a channel region, a gate insulating film, a charge storage layer, and a control gate electrode. The source and drain regions include first impurities of a first conductivity type. The channel region includes second impurities of a second conductivity type. The gate insulating film includes the second impurities in a region thereof located immediately above at least a portion of the channel region. The charge storage layer is formed on the gate insulating film. The control gate electrode is provided on the charge storage layer. The control gate electrode is formed on the charge storage layer and is electrically connected to the charge storage layer by a connection portion provided on a part of the charge storage layer, which is located immediately above at least a part of the region of the gate insulating film including the second impurities.
摘要翻译： 半导体器件包括半导体衬底，源极和漏极区，沟道区，栅极绝缘膜，电荷存储层和控制栅电极。 源区和漏区包括第一导电类型的第一杂质。 沟道区域包括第二导电类型的第二杂质。 栅极绝缘膜包括位于沟道区域的至少一部分正上方的区域中的第二杂质。 电荷存储层形成在栅极绝缘膜上。 控制栅电极设置在电荷存储层上。 控制栅电极形成在电荷存储层上，并且通过设置在电荷存储层的一部分上的连接部分电连接到电荷存储层，所述连接部位于栅极绝缘区域的至少一部分的正上方 膜包括第二杂质。
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8.发明授权Method of manufacturing an electrically erasable programmable read-only memory (EEPROM) 有权制造电可擦除可编程只读存储器（EEPROM）的方法公开(公告)号：US07504294B2
公开(公告)日：2009-03-17
申请号：US10881180
申请日：2004-07-01
申请人： Kikuko Sugimae , Hiroyuki Kutsukake , Masayuki Ichige , Michiharu Matsui , Yuji Takeuchi , Riichiro Shirota
发明人： Kikuko Sugimae , Hiroyuki Kutsukake , Masayuki Ichige , Michiharu Matsui , Yuji Takeuchi , Riichiro Shirota
IPC分类号： H01L21/8238
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524 , H01L27/11529
摘要： A semiconductor device comprises a memory cell array portion and peripheral circuit portion, wherein a first insulation film including elements as main components other than nitrogen fills between the memory cell gate electrodes of the memory cell array portion, the first insulation film is formed as a liner on a sidewall of a peripheral gate electrode of the peripheral circuit portion simultaneously with the memory cell portion, and a second insulation film including nitrogen as the main component is formed on the sidewall of the peripheral gate electrode via the first insulation film, thus enabling not only the formation of the memory cell portion having high reliability, but also the formation of a peripheral circuit with good efficiency, simultaneously, and avoiding gate offset of a peripheral gate.
摘要翻译： 半导体器件包括存储单元阵列部分和外围电路部分，其中包括作为除氮之外的主要成分的元素的第一绝缘膜填充在存储单元阵列部分的存储单元栅电极之间，第一绝缘膜形成为衬垫 在周边电路部分的外围栅电极的侧壁上与存储单元部分同时，并且通过第一绝缘膜在外围栅电极的侧壁上形成包括氮作为主要成分的第二绝缘膜，从而不能 仅形成具有高可靠性的存储单元部分，而且形成具有良好效率的周边电路，同时避免了外围栅极的栅极偏移。
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公开(公告)号：US07417281B2
公开(公告)日：2008-08-26
申请号：US11733488
申请日：2007-04-10
申请人： Kikuko Sugimae , Hiroyuki Kutsukake , Masayuki Ichige , Michiharu Matsui , Yuji Takeuchi , Riichiro Shirota
发明人： Kikuko Sugimae , Hiroyuki Kutsukake , Masayuki Ichige , Michiharu Matsui , Yuji Takeuchi , Riichiro Shirota
IPC分类号： H01L29/94
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524 , H01L27/11529
摘要： A semiconductor device comprises a memory cell array portion and peripheral circuit portion, wherein a first insulation film including elements as main components other than nitrogen fills between the memory cell gate electrodes of the memory cell array portion, the first insulation film is formed as a liner on a sidewall of a peripheral gate electrode of the peripheral circuit portion simultaneously with the memory cell portion, and a second insulation film including nitrogen as the main component is formed on the sidewall of the peripheral gate electrode via the first insulation film, thus enabling not only the formation of the memory cell portion having high reliability, but also the formation of a peripheral circuit with good efficiency, simultaneously, and avoiding gate offset of a peripheral gate.
摘要翻译： 半导体器件包括存储单元阵列部分和外围电路部分，其中包括作为除氮之外的主要成分的元素的第一绝缘膜填充在存储单元阵列部分的存储单元栅电极之间，第一绝缘膜形成为衬垫 在周边电路部分的外围栅电极的侧壁上与存储单元部分同时，并且通过第一绝缘膜在外围栅电极的侧壁上形成包括氮作为主要成分的第二绝缘膜，从而不能 仅形成具有高可靠性的存储单元部分，而且形成具有良好效率的周边电路，同时避免了外围栅极的栅极偏移。
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公开(公告)号：US08421143B2
公开(公告)日：2013-04-16
申请号：US13421248
申请日：2012-03-15
IPC分类号： H01L29/788
CPC分类号： H01L27/11548 , H01L27/115 , H01L27/11519 , H01L27/11526 , H01L27/11529 , H01L29/788
摘要： Disclosure is semiconductor device of a selective gate region, comprising a semiconductor layer, a first insulating film formed on the semiconductor layer, a first electrode layer formed on the first insulating layer, an element isolating region comprising an element isolating insulating film formed to extend through the first electrode layer and the first insulating film to reach an inner region of the semiconductor layer, the element isolating region isolating a element region and being self-aligned with the first electrode layer, a second insulating film formed on the first electrode layer and the element isolating region, an open portion exposing a surface of the first electrode layer being formed in the second insulating film, and a second electrode layer formed on the second insulating film and the exposed surface of the first electrode layer, the second electrode layer being electronically connected to the first electrode layer via the open portion.
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