公开(公告)号：US06749714B1

公开(公告)日：2004-06-15

申请号：US09856272

申请日：2001-05-18

申请人： Akira Ishikawa ,  Tatsuya Senga

发明人： Akira Ishikawa ,  Tatsuya Senga

IPC分类号： B24B3700

CPC分类号： B24B37/205 ,  B24B37/26

摘要： The present invention provides a hard polishing pad consisting of a non-foam material which is used in a CMP apparatus. Hard polishing pads consisting of foam resins show good pattern step difference elimination, but tend to cause scratching of the wafer. Furthermore, the polishing rate tends to be lower than that of polishing pads consisting of foam polyurethane. In the polishing pad of the present invention, spiral grooves or concentric circular grooves and lattice-form grooves are combined in the surface of the polishing pad; furthermore, the angles of intersection of the grooves are set at less than 2 degrees, and there are no edge parts with a curvature radius of 50 nm or less in the surface of the polishing pad. Accordingly, since there is no generation of flash, the object of polishing is not scratched, and the polishing rate can be increased.

摘要翻译： 本发明提供一种由CMP装置中使用的非泡沫材料组成的硬抛光垫。 由泡沫树脂组成的硬抛光垫具有良好的图案阶差消除，但倾向于引起晶片划伤。 此外，抛光速率倾向于低于由泡沫聚氨酯组成的抛光垫的抛光速率。 在本发明的研磨垫中，在抛光垫的表面上组合有螺旋槽或同心圆形槽和格子状槽， 此外，凹槽的交叉角度设定在小于2度，并且在抛光垫的表面中没有曲率半径为50nm以下的边缘部分。 因此，由于不产生闪光，因此不会划伤抛光的目的，并且可以提高抛光速率。

公开(公告)号：US07686673B2

公开(公告)日：2010-03-30

申请号：US10470537

申请日：2002-01-15

申请人： Tatsuya Senga ,  Akira Ishikawa ,  Takehiko Ueda

发明人： Tatsuya Senga ,  Akira Ishikawa ,  Takehiko Ueda

IPC分类号： B24B49/00 ,  B24B51/00

CPC分类号： H01L22/26 ,  B24B37/042 ,  B24B49/00 ,  B24B49/04 ,  H01L21/3212

摘要： The relationship between polishing conditions constituting elements and the worked shape (amount of polishing) obtained by way of these polishing conditions is input beforehand into polishing condition determining mechanism along with the type of the object of polishing, and polishing conditions (invariable polishing conditions) that are used in common for the polishing of this object of polishing. The polishing condition determining mechanism determines the polishing conditions on the basis of these conditions. Specifically, the above-mentioned polishing conditions constituting elements are given in a time series, or combinations of the above-mentioned polishing conditions constituting elements are converted into variations in the swinging velocity of the polishing body, and the swinging velocity corresponding to the swinging position is determined. The polishing apparatus control mechanism input the polishing conditions determined by the polishing condition determining mechanism, and control the polishing apparatus so that these polishing conditions are realized. As a result, working conditions for obtaining a specified worked shape in a working apparatus can be simply and accurately determined.

摘要翻译： 抛光条件构成要素之间的关系和通过这些抛光条件获得的加工形状（抛光量）与抛光对象的类型以及抛光条件（不变的抛光条件）预先输入到抛光条件确定机构中， 被普遍用于抛光抛光的目的。 抛光条件确定机构基于这些条件确定抛光条件。 具体地说，以时间序列给出上述构成元件的抛光条件，或者将上述抛光条件构成元件的组合转换为抛光体的摆动速度的变化，并且与摆动位置相对应的摆动速度 决心，决意，决定。 抛光装置控制机构输入由抛光条件确定机构确定的抛光条件，并且控制抛光装置以便实现这些抛光条件。 结果，可以简单且准确地确定在工作装置中获得规定加工形状的工作条件。

公开(公告)号：US09031687B2

公开(公告)日：2015-05-12

申请号：US12749306

申请日：2010-03-29

申请人： Tatsuya Senga ,  Akira Ishikawa ,  Takehiko Ueda

发明人： Tatsuya Senga ,  Akira Ishikawa ,  Takehiko Ueda

IPC分类号： H01L21/66 ,  B24B49/04 ,  B24B37/04 ,  B24B49/00 ,  H01L21/321

CPC分类号： H01L22/26 ,  B24B37/042 ,  B24B49/00 ,  B24B49/04 ,  H01L21/3212

摘要： The relationship between polishing conditions constituting elements and the worked shape (amount of polishing) obtained by means of these polishing conditions is input beforehand into polishing condition determining means along with the type of the object of polishing, and polishing conditions (invariable polishing conditions) that are used in common for the polishing of this object of polishing. The polishing condition determining means determine the polishing conditions on the basis of these conditions. Specifically, the above-mentioned polishing conditions constituting elements are given in a time series, or combinations of the above-mentioned polishing conditions constituting elements are converted into variations in the swinging velocity of the polishing body, and the swinging velocity corresponding to the swinging position is determined. The polishing apparatus control means input the polishing conditions determined by the polishing condition determining means, and control the polishing apparatus so that these polishing conditions are realized. As a result, working conditions for obtaining a specified worked shape in a working apparatus can be simply and accurately determined.

摘要翻译： 抛光条件构成要素与通过这些研磨条件获得的加工形状（抛光量）之间的关系与抛光对象的类型以及抛光条件（不变的抛光条件）预先输入到抛光条件确定装置中， 被普遍用于抛光抛光的目的。 抛光条件确定装置基于这些条件确定抛光条件。 具体地说，以时间序列给出上述构成元件的抛光条件，或者将上述抛光条件构成元件的组合转换为抛光体的摆动速度的变化，并且与摆动位置相对应的摆动速度 决心，决意，决定。 抛光装置控制装置输入由抛光条件确定装置确定的抛光条件，并且控制抛光装置以便实现这些抛光条件。 结果，可以简单且准确地确定在工作装置中获得规定加工形状的工作条件。

公开(公告)号：US07203564B2

公开(公告)日：2007-04-10

申请号：US10924201

申请日：2004-08-24

申请人： Tatsuya Senga ,  Yoshijiro Ushio

发明人： Tatsuya Senga ,  Yoshijiro Ushio

IPC分类号： G06F19/00

CPC分类号： B24B37/042 ,  B24B49/00 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76819 ,  H01L21/7684

摘要： In step S11, quantities that are varied (parameters) are respectively varied in a stepwise manner at a specified pitch, and standard working conditions consisting of combinations of these parameters are determined. For all of the standard working conditions, a working is actually performed, and the treated shapes that are obtained as a result are taken as the standard treated shapes for the respective standard working conditions (step S12). In cases where an appropriate simulation program is available, the standard treated shapes may be determined by simulation without actually performing a working. The standard working conditions and standard treated shapes thus determined are stored in a memory device. When the desired shape that is to be obtained by working is given in step S13, a standard treated shape that is close to the desired shape is sought in step S14. Thus, when a treated shape is given, the working conditions for this treated shape can be determined.

摘要翻译： 在步骤S11中，变化量（参数）分别以指定的间距逐步地变化，并且确定由这些参数的组合组成的标准工作条件。 对于所有标准工作条件，实际执行工作，并将作为结果获得的处理形状作为相应标准工作条件的标准处理形状（步骤S12）。 在适当的仿真程序可用的情况下，标准处理的形状可以通过仿真来确定，而不实际执行工作。 由此确定的标准工作条件和标准处理形状被存储在存储装置中。 当在步骤S13中给出期望的通过加工获得的形状时，在步骤S14中寻求接近所需形状的标准处理形状。 因此，当给出处理形状时，可以确定该处理形状的工作条件。

公开(公告)号：US20050176348A1

公开(公告)日：2005-08-11

申请号：US10924201

申请日：2004-08-24

申请人： Tatsuya Senga ,  Yoshijiro Ushio

发明人： Tatsuya Senga ,  Yoshijiro Ushio

IPC分类号： B24B37/04 ,  B24B49/00 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768

CPC分类号： B24B37/042 ,  B24B49/00 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76819 ,  H01L21/7684

摘要： In step S11, quantities that are varied (parameters) are respectively varied in a stepwise manner at a specified pitch, and standard working conditions consisting of combinations of these parameters are determined. For all of the standard working conditions, a working is actually performed, and the treated shapes that are obtained as a result are taken as the standard treated shapes for the respective standard working conditions (step S12). In cases where an appropriate simulation program is available, the standard treated shapes may be determined by simulation without actually performing a working. The standard working conditions and standard treated shapes thus determined are stored in a memory device. When the desired shape that is to be obtained by working is given in step S13, a standard treated shape that is close to the desired shape is sought in step S14. Thus, when a treated shape is given, the working conditions for this treated shape can be determined.

摘要翻译： 在步骤S11中，分别以规定间距逐步地改变（参数）的量，并且确定由这些参数的组合组成的标准工作条件。 对于所有标准工作条件，实际执行工作，并将作为结果获得的处理形状作为相应标准工作条件的标准处理形状（步骤S12）。 在适当的仿真程序可用的情况下，标准处理的形状可以通过仿真来确定，而不实际执行工作。 由此确定的标准工作条件和标准处理形状被存储在存储装置中。 当在步骤S13中给出期望的通过加工获得的形状时，在步骤S14中寻求接近所需形状的标准处理形状。 因此，当给出处理形状时，可以确定该处理形状的工作条件。

公开(公告)号：US06520895B2

公开(公告)日：2003-02-18

申请号：US09799632

申请日：2001-03-07

申请人： Tatsuya Senga ,  Kazuo Kobayashi ,  Satoru Ide ,  Kiyoshi Tanaka

发明人： Tatsuya Senga ,  Kazuo Kobayashi ,  Satoru Ide ,  Kiyoshi Tanaka

IPC分类号： B23Q3157

CPC分类号： B24B41/068 ,  B24B37/20 ,  B24B37/26 ,  B24B37/30 ,  B24D9/085 ,  Y10T483/10 ,  Y10T483/1736 ,  Y10T483/174 ,  Y10T483/1748 ,  Y10T483/1752

摘要： A polishing device includes a wafer chuck mechanism which retains a wafer while its plane to be polished faces upward, a polishing pad component which possesses a polishing plane which polishes the wafer, a polishing head, and a shift mechanism which enables a relative displacement of said polishing pad component in relation to the wafer. A fixation and retention mechanism fixes and retains said polishing pad component to the polishing head in a detachable fashion while its polishing plane faces downward. The displacement distance of the shift mechanism ranges from the polishing position of the wafer to the exchange position of the polishing pad component, so that the polishing pad component is automatically exchanged.

摘要翻译： 抛光装置包括：晶片夹持机构，其保持待抛光面朝上的晶片;抛光垫部件，其具有抛光晶片的抛光平面;抛光头;以及变换机构，其能够使所述 抛光垫组件相对于晶片。 固定和保持机构将抛光垫组件以可拆卸的方式固定并保持在抛光头上，同时其抛光平面朝下。 换档机构的位移距离范围从晶片的研磨位置到抛光垫部件的更换位置，使得抛光垫部件自动更换。

公开(公告)号：US06458014B1

公开(公告)日：2002-10-01

申请号：US09846339

申请日：2001-05-02

申请人： Akira Ihsikawa ,  Tatsuya Senga ,  Akira Miyaji ,  Yoshijiro Ushio

发明人： Akira Ihsikawa ,  Tatsuya Senga ,  Akira Miyaji ,  Yoshijiro Ushio

IPC分类号： B24B4900

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/04 ,  B24B49/12

摘要： After a hole is formed in a polishing pad, a transparent window plate is inserted into the hole. Here, a gap is left between the upper surface of the transparent window plate and the outermost surface constituting the working surface of the polishing pad. During polishing, the polishing head holding the wafer applies a load to the polishing pad by means of a load-applying mechanism, so that the polishing pad and transparent window plate are compressed. In this case, the system is arranged so that the gap remains constant, and so that a dimension equal to or greater than a standard value is maintained. Since the upper surface of the transparent window plate is recessed from the upper surface of the polishing pad, there is no scratching of the surface of the transparent window plate during dressing. Accordingly, the polishing pad has a long useful life.

摘要翻译： 在抛光垫中形成孔之后，将透明窗板插入孔中。 这里，在透明窗板的上表面和构成抛光垫的工作面的最外表面之间留有间隙。 在抛光期间，保持晶片的研磨头通过负载施加机构向抛光垫施加负载，使得抛光垫和透明窗板被压缩。 在这种情况下，系统被布置成使得间隙保持恒定，并且维持等于或大于标准值的尺寸。 由于透明窗板的上表面从抛光垫的上表面凹陷，因此在修整期间不会刮擦透明窗板的表面。 因此，抛光垫的使用寿命长。