公开(公告)号：US06520895B2

公开(公告)日：2003-02-18

申请号：US09799632

申请日：2001-03-07

申请人： Tatsuya Senga ,  Kazuo Kobayashi ,  Satoru Ide ,  Kiyoshi Tanaka

发明人： Tatsuya Senga ,  Kazuo Kobayashi ,  Satoru Ide ,  Kiyoshi Tanaka

IPC分类号： B23Q3157

CPC分类号： B24B41/068 ,  B24B37/20 ,  B24B37/26 ,  B24B37/30 ,  B24D9/085 ,  Y10T483/10 ,  Y10T483/1736 ,  Y10T483/174 ,  Y10T483/1748 ,  Y10T483/1752

摘要： A polishing device includes a wafer chuck mechanism which retains a wafer while its plane to be polished faces upward, a polishing pad component which possesses a polishing plane which polishes the wafer, a polishing head, and a shift mechanism which enables a relative displacement of said polishing pad component in relation to the wafer. A fixation and retention mechanism fixes and retains said polishing pad component to the polishing head in a detachable fashion while its polishing plane faces downward. The displacement distance of the shift mechanism ranges from the polishing position of the wafer to the exchange position of the polishing pad component, so that the polishing pad component is automatically exchanged.

摘要翻译： 抛光装置包括：晶片夹持机构，其保持待抛光面朝上的晶片;抛光垫部件，其具有抛光晶片的抛光平面;抛光头;以及变换机构，其能够使所述 抛光垫组件相对于晶片。 固定和保持机构将抛光垫组件以可拆卸的方式固定并保持在抛光头上，同时其抛光平面朝下。 换档机构的位移距离范围从晶片的研磨位置到抛光垫部件的更换位置，使得抛光垫部件自动更换。

公开(公告)号：US20110165823A1

公开(公告)日：2011-07-07

申请号：US12748109

申请日：2010-03-26

申请人： Satoru IDE ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

发明人： Satoru IDE ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

IPC分类号： B24B1/00 ,  B24B41/00 ,  B24B7/10

CPC分类号： B24B37/00

摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

摘要翻译： 一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。 一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。 同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。

公开(公告)号：US08366514B2

公开(公告)日：2013-02-05

申请号：US12748109

申请日：2010-03-26

申请人： Satoru Ide ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

发明人： Satoru Ide ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

IPC分类号： B24B1/00 ,  B24B5/02

CPC分类号： B24B37/00

摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

摘要翻译： 一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。 一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。 同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。

公开(公告)号：US08404601B2

公开(公告)日：2013-03-26

申请号：US13494418

申请日：2012-06-12

申请人： Kazuo Kobayashi

发明人： Kazuo Kobayashi

IPC分类号： H01L21/31

摘要： A method of manufacturing a semiconductor device according to the present invention includes the steps of: (a) introducing hydrogen and oxygen on a SiC substrate; and (b) subjecting the hydrogen and the oxygen to a combustion reaction on the SiC substrate to form a gate oxide film being a silicon oxide film on a surface of the SiC substrate by the combustion reaction.

公开(公告)号：US20120081475A1

公开(公告)日：2012-04-05

申请号：US13231216

申请日：2011-09-13

申请人： Koichiro HARA ,  Kazuo Kobayashi

发明人： Koichiro HARA ,  Kazuo Kobayashi

IPC分类号： B41J2/045 ,  B41J2/16

CPC分类号： B41J2/14233

摘要： There is provided a liquid discharging head discharging a liquid, including: a channel unit having a liquid channel including a pressure chamber which has an opening at one surface of the channel unit; a piezoelectric element formed of a piezoelectric material; an intermediate member preventing the liquid in the pressure chamber and the piezoelectric element from making contact with each other; a first adhesive layer composed of a first adhesive and adhering the channel unit and the intermediate member, the first adhesive being a thermo-setting adhesive starting to be cured at a first temperature; and a second adhesive layer composed of a second adhesive and adhering the intermediate member and the piezoelectric element, the second adhesive starting to be cured at a second temperature lower than the first temperature.

摘要翻译： 提供了一种排出液体的液体排放头，包括：通道单元，其具有液体通道，该液体通道包括在通道单元的一个表面上具有开口的压力室; 由压电材料形成的压电元件; 防止压力室中的液体和压电元件彼此接触的中间构件; 第一粘合剂层，由第一粘合剂组成并粘合通道单元和中间构件，第一粘合剂是开始在第一温度下固化的热固性粘合剂; 以及第二粘合剂层，由第二粘合剂组成并粘合所述中间构件和所述压电元件，所述第二粘合剂在比所述第一温度低的第二温度下开始固化。

公开(公告)号：US08071709B2

公开(公告)日：2011-12-06

申请号：US12282664

申请日：2007-03-14

申请人： Mitsuru Kishine ,  Hirofumi Nishibayashi ,  Toshiki Ichisaka ,  Kazuo Kobayashi ,  Ryuji Tachibana ,  Tadashi Okawa ,  Katsumi Kihara

发明人： Mitsuru Kishine ,  Hirofumi Nishibayashi ,  Toshiki Ichisaka ,  Kazuo Kobayashi ,  Ryuji Tachibana ,  Tadashi Okawa ,  Katsumi Kihara

IPC分类号： C08G77/24

CPC分类号： C09K3/1018 ,  C08G77/24 ,  C08L27/16 ,  C08L83/04 ,  C08L2205/22 ,  C08L2666/14 ,  C08L83/00

摘要： The present invention provides a novel fluorine-containing rubber composite material having both of excellent fuel impermeability and excellent cold resistance, a fuel impermeable sealing material comprising the composite material and a process for preparing the composite material. The fluorine-containing rubber composite material comprises crosslinked particles of fluorine-containing silicone rubber dispersed in a fluorine-containing rubber. It is preferable that the fluorine-containing rubber comprises a vinylidene fluoride/tetrafluoroethylene/perfluoro vinyl ether copolymer, and the composite material has cold resistance of not more than −35° C. and fuel permeability of not more than 500 g·mm/m2·day. The fuel impermeable sealing material comprises the composite material. The process for preparing the composite material comprises a step for co-coagulation of a fluorine-containing rubber emulsion and an emulsion of crosslinked fluorine-containing silicone rubber.

摘要翻译： 本发明提供一种具有优异的燃料不渗透性和优异的耐寒性的新型含氟橡胶复合材料，包含该复合材料的燃料不可渗透的密封材料以及该复合材料的制备方法。 含氟橡胶复合材料包含分散在含氟橡胶中的含氟硅橡胶的交联颗粒。 含氟橡胶优选包含偏二氟乙烯/四氟乙烯/全氟乙烯基醚共聚物，复合材料的耐寒性不大于-35℃，燃料渗透率不大于500g·mm / m 2 ·天。 燃料不可渗透的密封材料包括复合材料。 制备复合材料的方法包括使含氟橡胶乳液和交联的含氟硅橡胶的乳液共混的步骤。

公开(公告)号：US07972809B2

公开(公告)日：2011-07-05

申请号：US10511436

申请日：2003-04-28

申请人： Kazuo Kobayashi ,  Yoshinori Kitagawa ,  Toshihiro Komeda ,  Nagako Kawashima ,  Yoshifumi Jigami ,  Yasunori Chiba

发明人： Kazuo Kobayashi ,  Yoshinori Kitagawa ,  Toshihiro Komeda ,  Nagako Kawashima ,  Yoshifumi Jigami ,  Yasunori Chiba

IPC分类号： C12P21/00 ,  C12N15/01

CPC分类号： C12P19/26 ,  C07K16/243 ,  C07K2317/21 ,  C12N1/14 ,  C12N9/0006 ,  C12N9/0008 ,  C12N9/1048 ,  C12N9/1051 ,  C12N9/2488 ,  C12N9/60 ,  C12N9/88 ,  C12N9/93 ,  C12P21/02 ,  C12Y101/01085 ,  C12Y101/03013 ,  C12Y102/01012 ,  C12Y302/01024 ,  C12Y402/01019 ,  C12Y603/02006

摘要： This invention is to provide a process for producing a glycoprotein comprising a mammalian type sugar chain, characterized in that the process comprises introducing an α-1,2-mannosidase gene into a methylotrophic yeast having a mutation of a sugar chain biosynthesizing enzyme gene, so that the α-1,2-mannosidase gene is expressed under the control of a potent promoter in the yeast; culturing in a medium the methylotrophic yeast cells with a heterologous gene transferred thereinto; and obtaining the glycoprotein comprising a mammalian type sugar chain from the culture. Using the newly created methylotrophic yeast having a sugar chain mutation, a neutral sugar chain identical with a high mannose type sugar chain produced by mammalian cells such as human cells, or a glycoprotein comprising such a neutral sugar chain, can be produced in a large amount at a high purity. By introducing a mammalian type sugar chain biosynthesizing gene into the above-described mutant, a mammalian type sugar chain, such as a hybrid or complex, or a protein comprising a mammalian type sugar chain can be efficiently produced.

摘要翻译： 本发明提供一种生产包含哺乳动物型糖链的糖蛋白的方法，其特征在于该方法包括将α-1,2-甘露糖苷酶基因导入具有糖链生物合成酶基因突变的甲基营养酵母中，因此 α-1,2-甘露糖苷酶基因在酵母中有效启动子的控制下表达; 在介质中培养具有转移到其中的异源基因的甲基营养酵母细胞; 从培养物中获得包含哺乳动物型糖链的糖蛋白。 使用新制造的具有糖链突变的甲基营养酵母，可以大量生产与由哺乳动物细胞如人细胞产生的高甘露糖型糖链或包含这种中性糖链的糖蛋白相同的中性糖链 纯度高。 通过将哺乳动物型糖链生物合成基因导入到上述突变体中，可以有效地制备哺乳动物型糖链，例如杂合体或复合物，或包含哺乳动物型糖链的蛋白质。

公开(公告)号：US07882635B2

公开(公告)日：2011-02-08

申请号：US12232880

申请日：2008-09-25

申请人： Hiroaki Wakayama ,  Kazuo Kobayashi

发明人： Hiroaki Wakayama ,  Kazuo Kobayashi

IPC分类号： B23P17/00 ,  B41J2/045

CPC分类号： B41J2/1646 ,  B41J2/161 ,  B41J2/1625 ,  B41J2/1626 ,  B41J2/1642 ,  B41J2202/03 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49401

摘要： A method for producing an ink-jet head includes forming a buffer layer on an upper surface of a vibration plate, and forming a piezoelectric precursor layer on an entire upper surface of a surface layer, the piezoelectric precursor layer being converted into a piezoelectric sheet. The buffer layer is formed of a material with which mutual diffusion between the piezoelectric precursor layer and the buffer layer is hardly caused as compared with mutual diffusion between the piezoelectric precursor layer and the vibration plate with which no buffer layer is provided. A stack, in which the buffer layer and the piezoelectric precursor layer are formed, is heated at a predetermined temperature, and the piezoelectric precursor layer is calcinated to form the piezoelectric sheet. It is possible to suppress the deterioration of the performance of the piezoelectric member.

摘要翻译： 一种喷墨头的制造方法，其特征在于，在振动板的上表面形成缓冲层，在表面层的整个上表面形成压电前体层，将压电体前体层转换为压电片。 与压电前体层和没有设置缓冲层的振动板之间的相互扩散相比，缓冲层由与压电前体层和缓冲层之间的相互扩散难以引起的材料形成。 在其中形成缓冲层和压电前体层的叠层在预定温度下被加热，并且将压电前体层煅烧以形成压电片。 可以抑制压电部件的性能的劣化。

公开(公告)号：US07790806B2

公开(公告)日：2010-09-07

申请号：US12127057

申请日：2008-05-27

申请人： Katsuhide Ohtani ,  Tsuyoshi Ono ,  Haruhisa Masuda ,  Ron Klein ,  Masakazu Irie ,  Kazuo Kobayashi ,  Igor Chorvath ,  Tatyana Collins ,  Lauren Tonge

发明人： Katsuhide Ohtani ,  Tsuyoshi Ono ,  Haruhisa Masuda ,  Ron Klein ,  Masakazu Irie ,  Kazuo Kobayashi ,  Igor Chorvath ,  Tatyana Collins ,  Lauren Tonge

IPC分类号： C08L27/18

CPC分类号： C08L27/18 ,  C08L83/04 ,  C08L2666/14

摘要： The present invention relates to a fluorine-containing resin composition for molding comprising a fluorine-containing resin (A) and a hydrofluoric acid scavenger (B), in which the hydrofluoric acid scavenger (B) is organopolysiloxane. According to the present invention, a fluorine-containing resin composition which can reduce an amount of hydrofluoric acid released from a fluorine-containing resin and inhibits corrosiveness can be provided.

摘要翻译： 本发明涉及含氟树脂（A）和氢氟酸清除剂（B）的含氟树脂组合物，其中氢氟酸清除剂（B）为有机聚硅氧烷。 根据本发明，可以提供一种可以减少由含氟树脂释放的氢氟酸的量并抑制腐蚀性的含氟树脂组合物。

公开(公告)号：US20090203299A1

公开(公告)日：2009-08-13

申请号：US12356793

申请日：2009-01-21

申请人： Moriyuki KASHIWA ,  Etsuo Fujita ,  Kazuo Kobayashi ,  Tomio Kubo

发明人： Moriyuki KASHIWA ,  Etsuo Fujita ,  Kazuo Kobayashi ,  Tomio Kubo

IPC分类号： B24B41/04 ,  B24B7/20 ,  B24B41/00

CPC分类号： B24B7/228 ,  B24B41/047

摘要： To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

摘要翻译： 为了提供高刚性的平面研磨装置，基板平面磨削装置具有三个具有运动联接的紧固板提升和降低机构以及将紧固板向上或向下移动的气缸杆。 作为紧固板6的负载也是进行研磨的磨石14的载荷的高刚性研磨装置，即使是半导体基板，也可以获得所获得的基板的厚度分布的偏转小 具有450mm的大的基材直径。