公开(公告)号：US20110272817A1

公开(公告)日：2011-11-10

申请号：US13188124

申请日：2011-07-21

申请人： Akira TOJO ,  Tomoyuki KITANI ,  Kazuhito HIGUCHI ,  Masako FUKUMITSU ,  Tomohiro IGUCHI ,  Hideo NISHIUCHI ,  Kyoko KATO

发明人： Akira TOJO ,  Tomoyuki KITANI ,  Kazuhito HIGUCHI ,  Masako FUKUMITSU ,  Tomohiro IGUCHI ,  Hideo NISHIUCHI ,  Kyoko KATO

IPC分类号： H01L23/48

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/03 ,  H01L24/48 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a first electrode and a second electrode of a semiconductor element, the first electrode and the second electrode being configured on a first surface and a second surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, the surface portion being other than regions, each of the regions connecting with the first second electrodes, each of inner electrodes being connected with the first or the second electrodes, a thickness of the inner electrode from the first surface or the second surface being the same thickness as the encapsulating material from the first surface or the second surface, respectively, outer electrodes, each of the outer electrodes being formed on the encapsulating material and connected with the inner electrode, a width of the outer electrode being at least wider than a width of the semiconductor chip, and outer plating materials, each of the outer plating materials covering five surfaces of the outer electrode other than one surface of the outer electrode being connected with the inner electrode.

摘要翻译： 根据本发明的一个方面，提供一种半导体器件，包括半导体芯片，该半导体芯片包括第一电极和半导体元件的第二电极，第一电极和第二电极被配置在第一表面和第二表面上 半导体芯片的封装材料，封装半导体芯片的封装材料，表面部分不同于区域，每个区域与第一第二电极连接，每个内部电极与第一或第二电极连接，厚度为 来自第一表面或第二表面的内部电极分别与来自第一表面或第二表面的密封材料的厚度相同，外部电极，每个外部电极形成在封装材料上并与内部电极连接， 外部电极的宽度至少比半导体ch的宽度宽 ip和外部电镀材料，覆盖外部电极的除了外部电极的一个表面之外的五个表面的每个外部电镀材料与内部电极连接。

公开(公告)号：US20120074608A1

公开(公告)日：2012-03-29

申请号：US13240090

申请日：2011-09-22

申请人： Satoru ASAGIRI ,  Kyoko KATO ,  Yasuyuki ITO

发明人： Satoru ASAGIRI ,  Kyoko KATO ,  Yasuyuki ITO

IPC分类号： B29C70/68 ,  B29C69/02 ,  B29C71/00 ,  B29C43/18 ,  B29C45/14

CPC分类号： B29C43/18 ,  B29C39/10 ,  B29C70/70 ,  B29C2043/181 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/00

摘要： In one embodiment, a control module manufacturing method includes disposing a board, on which electronic components are mounted, in a case includes a top opening, injecting a filler into the case, pressing the filler from the surface side thereof by means of a jig, which comprises an upwardly convex hollow portion corresponding to taller ones of the electronic components with respect to the board and covers the opening and curing the filler.

摘要翻译： 在一个实施例中，一种控制模块的制造方法包括：在包括顶部开口的情况下布置安装有电子部件的板，将填料注入到壳体中，通过夹具从其表面侧挤压填料， 其包括对应于相对于板的较高电子部件的向上凸起的中空部分并且覆盖开口并固化填料。

公开(公告)号：US20120246125A1

公开(公告)日：2012-09-27

申请号：US13422993

申请日：2012-03-16

申请人： Kyoko KATO

发明人： Kyoko KATO

IPC分类号： G06F17/30

CPC分类号： G06F17/30067 ,  G06F17/30156

摘要： A duplicate file detection device 100 has a storage unit 101, a calculation unit 102, and a detection unit 103. The storage unit 101 stores calculation information that defines data used in the calculation of the hash values of files in association with the extensions of the files. The calculation unit 102 acquires the calculation information associated with the extension of each file to be examined from the storage unit 101 and uses the acquired calculation information to calculate the hash value of each file to be examined. The detection unit 103 detects duplicated files by comparing the hash values of the files to be examined that are calculated by the calculation unit 102.

摘要翻译： 复制文件检测装置100具有存储单元101，计算单元102和检测单元103.存储单元101存储计算信息，该计算信息定义用于计算文件的哈希值的数据， 文件。 计算单元102从存储单元101获取与要检查的每个文件的扩展相关联的计算信息，并使用所获取的计算信息来计算要检查的每个文件的哈希值。 检测单元103通过比较由计算单元102计算的要检查的文件的散列值来检测重复的文件。

公开(公告)号：US20070108441A1

公开(公告)日：2007-05-17

申请号：US11561596

申请日：2006-11-20

申请人： Nobuyuki SEKINE ,  Haruo KAWAKAMI ,  Hisato KATO ,  Keisuke YAMASHIRO ,  Kyoko KATO ,  Masami KURODA

发明人： Nobuyuki SEKINE ,  Haruo KAWAKAMI ,  Hisato KATO ,  Keisuke YAMASHIRO ,  Kyoko KATO ,  Masami KURODA

IPC分类号： H01L29/08 ,  C07D487/00 ,  C08G61/04

CPC分类号： H01L51/0591 ,  B82Y10/00 ,  G02F1/1365 ,  G02F2202/02 ,  H01L51/0052 ,  H01L51/0062 ,  H01L51/0065 ,  H01L51/0067 ,  H01L51/0068 ,  H01L51/0071 ,  H01L51/0073 ,  H01L51/0074 ,  H01L51/0595

摘要： A switching device is discloses that exhibits two stable resistance values to a voltage applied between electrodes. The switching device comprises thin films of a first electrode layer, an organic bistable material layer and a second electrode layer sequentially formed on a substrate, and the organic bistable material is a specified quinone compound.

摘要翻译： 公开了对电极之间施加的电压呈现两个稳定的电阻值的开关装置。 开关器件包括依次形成在衬底上的第一电极层，有机双稳态材料层和第二电极层的薄膜，有机双稳态材料是指定的醌化合物。