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    Chip-type electronic component
    1.
    发明申请
    Chip-type electronic component 有权
    片式电子元器件

    公开(公告)号：US20060126264A1

    公开(公告)日：2006-06-15

    申请号：US11295487

    申请日：2005-12-07

    申请人： Akitoshi Yoshii ,  Taisuke Ahiko ,  Shirou Ootsuki ,  Takashi Aoki ,  Akira Goshima ,  Hiroki Houchi

    发明人： Akitoshi Yoshii ,  Taisuke Ahiko ,  Shirou Ootsuki ,  Takashi Aoki ,  Akira Goshima ,  Hiroki Houchi

    IPC分类号： H01G4/00

    CPC分类号： H01G4/30 ,  H01G4/232

    摘要： A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the chip element body. The chip element body has one side face acting as a mounting surface opposing a circuit substrate. The pair of terminal electrodes include an electrode portion formed on the mounting surface. Here, it is assumed that a first direction is a direction orthogonal to the mounting surface, a second direction is a direction along which the pair of terminal electrodes oppose each other on the mounting surface, and a third direction is a direction orthogonal to the first and second directions. A first length of the electrode portion along the second direction from an edge portion of the mounting surface at a center region in the third direction is set longer than a second length of the electrode portion along the second direction from the edge portion of the mounting surface at both end regions in the third direction.

    摘要翻译： 芯片型电子部件包括具有内部电路元件的芯片元件主体和与内部电路元件电连接的一对端子电极。 一对端子电极位于芯片元件本体的各个端部。 芯片元件主体具有作为与电路基板相对的安装面的一个侧面。 一对端子电极包括形成在安装面上的电极部。 这里，假设第一方向是与安装面正交的方向，第二方向是一对端子电极在安装面上彼此相对的方向，第三方向是与第一方向正交的方向 和第二个方向。 电极部分沿着第二方向的第一长度从安装表面的沿第三方向的中心区域的边缘部分的长度设定为比安装表面的边缘部分沿着第二方向的电极部分的第二长度长 在第三方向的两端区域。

    Chip-type electronic component
    2.
    发明授权
    Chip-type electronic component 有权
    片式电子元器件

    公开(公告)号：US07177138B2

    公开(公告)日：2007-02-13

    申请号：US11295487

    申请日：2005-12-07

    申请人： Akitoshi Yoshii ,  Taisuke Ahiko ,  Shirou Ootsuki ,  Takashi Aoki ,  Akira Goshima ,  Hiroki Houchi

    发明人： Akitoshi Yoshii ,  Taisuke Ahiko ,  Shirou Ootsuki ,  Takashi Aoki ,  Akira Goshima ,  Hiroki Houchi

    IPC分类号： H01G4/228

    CPC分类号： H01G4/30 ,  H01G4/232

    摘要： A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the chip element body. The chip element body has one side face acting as a mounting surface opposing a circuit substrate. The pair of terminal electrodes include an electrode portion formed on the mounting surface. Here, it is assumed that a first direction is a direction orthogonal to the mounting surface, a second direction is a direction along which the pair of terminal electrodes oppose each other on the mounting surface, and a third direction is a direction orthogonal to the first and second directions. A first length of the electrode portion along the second direction from an edge portion of the mounting surface at a center region in the third direction is set longer than a second length of the electrode portion along the second direction from the edge portion of the mounting surface at both end regions in the third direction.

    摘要翻译： 芯片型电子部件包括具有内部电路元件的芯片元件主体和与内部电路元件电连接的一对端子电极。 一对端子电极位于芯片元件本体的各个端部。 芯片元件主体具有作为与电路基板相对的安装面的一个侧面。 一对端子电极包括形成在安装面上的电极部。 这里，假设第一方向是与安装面正交的方向，第二方向是一对端子电极在安装面上彼此相对的方向，第三方向是与第一方向正交的方向 和第二个方向。 电极部分沿着第二方向的第一长度从安装表面的沿第三方向的中心区域的边缘部分的长度设定为比安装表面的边缘部分沿着第二方向的电极部分的第二长度长 在第三方向的两端区域。

    Method for manufacturing multilayer electronic component
    5.
    发明申请
    Method for manufacturing multilayer electronic component 审中-公开
    多层电子部件的制造方法

    公开(公告)号：US20090211687A1

    公开(公告)日：2009-08-27

    申请号：US12379175

    申请日：2009-02-13

    申请人： Toshihiro Iguchi ,  Akitoshi Yoshii ,  Akira Goshima ,  Kazuyuki Hasebe

    发明人： Toshihiro Iguchi ,  Akitoshi Yoshii ,  Akira Goshima ,  Kazuyuki Hasebe

    IPC分类号： B32B37/00

    CPC分类号： H01G4/30 ,  H01G13/00 ,  Y10T156/10

    摘要： The present invention aims to provide a method for manufacturing a multilayer electronic component capable to remove a multilayer body very easily from the press mold without breaking the multilayer body when removing a green sheet multilayer body applied with a pressure from the press mold, furthermore has no waste of material, contributes to the environment conservation, and also easy to automate. Among the plurality of green sheets constituting a multilayer body 4a, the adhesive force of at least one of the outer green sheet 14a1 contacting to the lower mold 20 of the press mold 20 is made weaker compared to that of other green sheet 14a2, 10a, 14a3, and 14a4 of which are stacked with said outer green sheet 14a1. Next, a pressure is applied to the multilayer body 4a on the lower mold 20 of the press mold. Then, the press mold 25 is removed from the multilayer body 4a which is applied with the pressure.

    摘要翻译： 本发明的目的在于提供一种多层电子部件的制造方法，其能够在从压模中施加压力的生坯片层叠体移除时，能够从压模中非常容易地除去多层体，而不破坏多层体， 浪费材料，有助于环境保护，也易于自动化。 在构成多层体4a的多个生片中，与其他生片14a2,10a相比，与模压模20的下模20接触的外生片14a1中的至少一个的粘合力变弱， 14a3和14a4与所述外部生片14a1堆叠。 接下来，对压模的下模具20上的多层体4a施加压力。 然后，从施加有压力的多层体4a取出压模25。

    Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components
    7.
    发明授权
    Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components 有权
    陶瓷电子部件，陶瓷电子部件的制造方法以及陶瓷电子部件的包装方法

    公开(公告)号：US08179225B2

    公开(公告)日：2012-05-15

    申请号：US12350528

    申请日：2009-01-08

    申请人： Toshihiro Iguchi ,  Akitoshi Yoshii ,  Akira Goshima ,  Kazuyuki Hasebe

    发明人： Toshihiro Iguchi ,  Akitoshi Yoshii ,  Akira Goshima ,  Kazuyuki Hasebe

    IPC分类号： H01C7/10 ,  H01C1/012

    CPC分类号： H01G4/30 ,  H01G2/24 ,  H01G4/002 ,  H05K1/0269 ,  H05K3/303 ,  H05K2201/10636 ,  H05K2203/161 ,  H05K2203/168 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/435

    摘要： A ceramic electronic component has a chip element body having a conductor arranged inside, external electrodes, and a discrimination layer. The chip element body has first and second end faces facing each other, first and second side faces being perpendicular to the first and second end faces and facing each other, and third and fourth side faces being perpendicular to the first and second end faces and to the first and second side faces and facing each other. The external electrodes are formed on the first and second end faces, respectively, of the chip element body. The discrimination layer is provided on at least one side face out of the first side face and the second side face in the chip element body. The chip element body is comprised of a first ceramic. The discrimination layer is comprised of a second ceramic different from the first ceramic and has a color different from that of the third and fourth side faces.

    摘要翻译： 陶瓷电子部件具有芯片元件主体，其具有布置在内部的导体，外部电极和鉴别层。 芯片元件主体具有彼此相对的第一和第二端面，第一和第二侧面垂直于第一和第二端面并面对彼此，第三和第四侧面垂直于第一和第二端面，并且 第一和第二侧面并面对彼此。 外部电极分别形成在芯片元件主体的第一和第二端面上。 识别层设置在芯片元件主体中的第一侧面和第二侧面之外的至少一个侧面。 芯片元件主体由第一陶瓷构成。 识别层由不同于第一陶瓷的第二陶瓷构成，并且具有与第三和第四侧面不同的颜色。

    Ceramic electronic component
    9.
    发明授权
    Ceramic electronic component 有权
    陶瓷电子元件

    公开(公告)号：US07751176B2

    公开(公告)日：2010-07-06

    申请号：US12137810

    申请日：2008-06-12

    申请人： Toshihiro Iguchi ,  Akitoshi Yoshii ,  Akira Goshima ,  Kazuyuki Hasebe

    发明人： Toshihiro Iguchi ,  Akitoshi Yoshii ,  Akira Goshima ,  Kazuyuki Hasebe

    IPC分类号： H01G4/06

    CPC分类号： H01G4/1227 ,  H01G4/30

    摘要： A ceramic electronic component includes a ceramic body and an internal electrode layers disposed within the ceramic body. The ceramic body is covered with a diffusion layer, wherein said diffusion layer is an oxide layer into which at least a part of elements contained in the ceramic body are diffused and is located closer to a surface of the ceramic body than an outermost internal electrode layer.

    摘要翻译： 陶瓷电子部件包括陶瓷体和设置在陶瓷体内的内部电极层。 陶瓷体覆盖有扩散层，其中所述扩散层是氧化物层，陶瓷体中包含的至少一部分元素扩散到其中，并且位于比最外部电极层更靠近陶瓷体的表面的位置 。

    CERAMIC ELECTRONIC COMPONENT
    10.
    发明申请
    CERAMIC ELECTRONIC COMPONENT 有权
    陶瓷电子元件

    公开(公告)号：US20090009927A1

    公开(公告)日：2009-01-08

    申请号：US12137810

    申请日：2008-06-12

    申请人： Toshihiro Iguchi ,  Akitoshi Yoshii ,  Akira Goshima ,  Kazuyuki Hasebe

    发明人： Toshihiro Iguchi ,  Akitoshi Yoshii ,  Akira Goshima ,  Kazuyuki Hasebe

    IPC分类号： H01G4/06

    CPC分类号： H01G4/1227 ,  H01G4/30

    摘要： A ceramic electronic component includes a ceramic body and an internal electrode layers disposed within the ceramic body. The ceramic body is covered with a diffusion layer, wherein said diffusion layer is an oxide layer into which at least a part of elements contained in the ceramic body are diffused and is located closer to a surface of the ceramic body than an outermost internal electrode layer.

    摘要翻译： 陶瓷电子部件包括陶瓷体和设置在陶瓷体内的内部电极层。 陶瓷体覆盖有扩散层，其中所述扩散层是氧化物层，陶瓷体中包含的至少一部分元素扩散到其中，并且位于比最外部电极层更靠近陶瓷体的表面的位置 。