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    Techniques for Data Center Cooling
    3.
    发明申请
    Techniques for Data Center Cooling 有权
    数据中心冷却技术

    公开(公告)号：US20080285232A1

    公开(公告)日：2008-11-20

    申请号：US11750322

    申请日：2007-05-17

    申请人： Alan Claassen ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James Andrew Lacey ,  Yves C. Martin ,  Roger R. Schmidt ,  Theodore Gerard Van Kessel

    发明人： Alan Claassen ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James Andrew Lacey ,  Yves C. Martin ,  Roger R. Schmidt ,  Theodore Gerard Van Kessel

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20754 ,  H05K7/20736 ,  H05K7/20745

    摘要： Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

    摘要翻译： 提供了数据中心冷却技术。 在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口，以及一个或多个：安装到计算机设备机架上的空气入口管道，其围绕空气入口的至少一部分，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸 并且长度小于计算机设备机架的长度，以及安装在围绕至少一部分排气出口的计算机设备机架上的排气管，排气管具有接近侧向尺寸的横向尺寸 计算机设备机架的长度小于计算机设备机架的长度。

    Techniques for Data Center Cooling
    4.
    发明申请
    Techniques for Data Center Cooling 失效
    数据中心冷却技术

    公开(公告)号：US20110279967A1

    公开(公告)日：2011-11-17

    申请号：US13189515

    申请日：2011-07-24

    申请人： Alan Claassen ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James Andrew Lacey ,  Yves C. Martin ,  Roger R. Schmidt ,  Theodore Gerard van Kessel

    发明人： Alan Claassen ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James Andrew Lacey ,  Yves C. Martin ,  Roger R. Schmidt ,  Theodore Gerard van Kessel

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20754 ,  H05K7/20736 ,  H05K7/20745

    摘要： Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

    摘要翻译： 提供了数据中心冷却技术。 在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口; 以及一个或多个：安装到围绕至少一部分空气入口的计算机设备机架的进气管道，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸和较小的长度 比计算机设备机架的长度以及安装到围绕至少一部分排气出口的计算机设备机架的排气管道，排气管道具有接近计算机设备机架的横向尺寸的横向尺寸和 长度小于计算机设备机架的长度。

    Techniques for data center cooling
    5.
    发明授权
    Techniques for data center cooling 有权
    数据中心冷却技术

    公开(公告)号：US08009430B2

    公开(公告)日：2011-08-30

    申请号：US11750322

    申请日：2007-05-17

    申请人： Alan Claassen ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James Andrew Lacey ,  Yves C. Martin ,  Roger R. Schmidt ,  Theodore Gerard van Kessel

    发明人： Alan Claassen ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James Andrew Lacey ,  Yves C. Martin ,  Roger R. Schmidt ,  Theodore Gerard van Kessel

    IPC分类号： H05K7/20 ,  H05K5/00 ,  A47B81/00

    CPC分类号： H05K7/20754 ,  H05K7/20736 ,  H05K7/20745

    摘要： Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

    摘要翻译： 提供了数据中心冷却技术。 在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口，以及一个或多个：安装到计算机设备机架上的空气入口管道，其围绕空气入口的至少一部分，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸 并且长度小于计算机设备机架的长度，以及安装在围绕至少一部分排气出口的计算机设备机架上的排气管，排气管具有接近侧向尺寸的横向尺寸 计算机设备机架的长度小于计算机设备机架的长度。

    Dynamically limiting energy consumed by cooling apparatus
    6.
    发明授权
    Dynamically limiting energy consumed by cooling apparatus 有权
    动力限制冷却装置消耗的能量

    公开(公告)号：US09043035B2

    公开(公告)日：2015-05-26

    申请号：US13305967

    申请日：2011-11-29

    申请人： Timothy J. Chainer ,  Milnes P. David ,  Madhusudan K. Iyengar ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark D. Schultz

    发明人： Timothy J. Chainer ,  Milnes P. David ,  Madhusudan K. Iyengar ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark D. Schultz

    IPC分类号： G06F19/00 ,  G05D7/06 ,  G06F1/20 ,  G11B33/14 ,  H05K7/20 ,  G06F1/32

    CPC分类号： G05D7/0635 ,  G06F1/20 ,  G06F1/206 ,  G06F1/3206 ,  G11B33/144 ,  H05K7/20281 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836 ,  Y02D10/16

    摘要： Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.

    摘要翻译： 提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元 以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。 控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量 由N个可控部件消耗，其中Z≥1。

    Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
    7.
    发明授权
    Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权
    将电子卡耦合到冷却剂冷却结构的热转印结构

    公开(公告)号：US08913384B2

    公开(公告)日：2014-12-16

    申请号：US13527947

    申请日：2012-06-20

    申请人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

    发明人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

    IPC分类号： H05K7/20 ,  H05K13/00

    CPC分类号： H05K7/20745 ,  H05K7/2079 ,  H05K13/00

    摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

    摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

    Data center cooling control
    8.
    发明授权
    Data center cooling control 有权
    数据中心冷却控制

    公开(公告)号：US08880225B2

    公开(公告)日：2014-11-04

    申请号：US13276247

    申请日：2011-10-18

    申请人： Madhusudan K. Iyengar ,  Roger R. Schmidt

    发明人： Madhusudan K. Iyengar ,  Roger R. Schmidt

    IPC分类号： G05D23/19 ,  H05K7/20

    CPC分类号： H05K7/20836 ,  G05D23/1932

    摘要： A method, system, and computer program product for controlling data center cooling. In an example embodiment the method includes calculating, using a processor, an over-provisioning factor, where the over-provisioning factor is a function of a ratio of a rated cooling power to a calculated cooling power of a set of cooling units, the set of cooing units comprising at least one cooling unit. The method proceeds by adjusting the data-center cooling until the over-provisioning factor is substantially equal to a target over-provisioning factor.

    摘要翻译： 一种用于控制数据中心冷却的方法，系统和计算机程序产品。 在示例实施例中，该方法包括使用处理器计算过度供应因子，其中过度供应因子是额定冷却功率与一组冷却单元的计算的冷却功率的比率的函数，该组 包括至少一个冷却单元的冷却单元。 该方法通过调整数据中心冷却来进行，直到过度供应因子基本上等于目标过度供应因子。