摘要:
Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要:
Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要:
Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要:
Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要:
Techniques for improving on data center best practices are provided. In one aspect, an exemplary methodology for analyzing energy efficiency of a data center having a raised-floor cooling system with at least one air conditioning unit is provided. The method comprises the following steps. An initial assessment is made of the energy efficiency of the data center based on one or more power consumption parameters of the data center. Physical parameter data obtained from one or more positions in the data center are compiled into one or more metrics, if the initial assessment indicates that the data center is energy inefficient. Recommendations are made to increase the energy efficiency of the data center based on one or more of the metrics.
摘要:
A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.
摘要:
What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要:
An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要:
An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要:
An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.