Method and Apparatus for Producing and Measuring Dynamically Focused, Steered, and Shaped Oblique Laser Illumination for Spinning Wafer Inspection System
    3.
    发明申请
    Method and Apparatus for Producing and Measuring Dynamically Focused, Steered, and Shaped Oblique Laser Illumination for Spinning Wafer Inspection System 审中-公开
    用于旋转晶圆检测系统的动态聚焦,转向和形状倾斜激光照明的生产和测量方法和设备

    公开(公告)号:US20150330907A1

    公开(公告)日:2015-11-19

    申请号:US14556231

    申请日:2014-11-30

    IPC分类号: G01N21/88 G01N21/95

    摘要: A method and apparatus for producing high frequency dynamically focused oblique laser illumination for a spinning wafer inspection system. The focus is changed by changing the beam direction incidence angle so as to bring focal spot onto the wafer surface.Disclosed herein is a system and method for automatic beam shaping (i.e., spot size) and steering (i.e., position) for a spinning wafer inspection system, combined into a single module. Also disclosed is a method and system for measuring the beam position/size/shape and angle with sufficient resolution to make corrections using feedback from the monitor.

    摘要翻译: 一种用于生产用于旋转晶片检测系统的高频动态聚焦倾斜激光照明的方法和装置。 通过改变光束方向入射角来改变焦点,以便将焦斑引入晶片表面。 本文公开了一种用于旋转晶片检查系统的自动光束成形(即光点尺寸)和转向(即,位置)的系统和方法,其组合成单个模块。 还公开了一种用于以足够的分辨率测量光束位置/尺寸/形状和角度以使用来自监视器的反馈进行校正的方法和系统。

    Dynamic range extension in surface inspection systems
    4.
    发明授权
    Dynamic range extension in surface inspection systems 有权
    表面检测系统的动态范围扩展

    公开(公告)号:US08134698B1

    公开(公告)日:2012-03-13

    申请号:US12049091

    申请日:2008-03-14

    IPC分类号: G01N21/00

    CPC分类号: G01N21/9501 G01N2201/1241

    摘要: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a scattered radiation collecting assembly that collects radiation scattered from the surface. The radiation targeting assembly generates primary and secondary beams. Data collected from the reflections of the primary and secondary beams may be used in a dynamic range extension routine, alone or in combination with a power attenuation routine.

    摘要翻译: 在一个实施例中,表面分析器系统包括将辐射束对准到表面上的辐射瞄准组件; 以及收集从表面散射的辐射的散射的辐射收集组件。 辐射瞄准组件产生主光束和次光束。 从主波束和次波束的反射中收集的数据可以单独使用或者与功率衰减程序组合在动态范围扩展程序中使用。

    Inspection systems and methods for extending the detection range of an inspection system by forcing the photodetector into the non-linear range
    6.
    发明授权
    Inspection systems and methods for extending the detection range of an inspection system by forcing the photodetector into the non-linear range 有权
    用于通过强制光电探测器进入非线性范围来扩展检查系统的检测范围的检查系统和方法

    公开(公告)号:US07746462B2

    公开(公告)日:2010-06-29

    申请号:US11751293

    申请日:2007-05-21

    IPC分类号: G01N21/00

    摘要: An inspection system and method is provided herein for increasing the detection range of the inspection system. According to one embodiment, the inspection system may include a photodetector having a plurality of stages, which are adapted to convert light scattered from a specimen into an output signal, and a voltage divider network coupled for extending the detection range of the photodetector (and thus, the detection range of the inspection system) by saturating at least one of the stages. This forces the photodetector to operate in a non-linear manner. However, measurement inaccuracies are avoided by calibrating the photodetector output to remove any non-linear effects that may be created by intentionally saturating the at least one of the stages. In one example, a table of values may be generated during a calibration phase to convert the photodetector output into an actual amount of scattered light.

    摘要翻译: 本文提供了一种用于增加检查系统的检测范围的检查系统和方法。 根据一个实施例,检查系统可以包括具有多个级的光电检测器,其适于将从样本散射的光转换成输出信号,以及耦合的用于扩展光电检测器的检测范围的分压器网络 ,检查系统的检测范围)通过饱和至少一个级。 这迫使光电探测器以非线性方式工作。 然而,通过校准光电检测器输出以消除可能通过故意饱和至少一个级而产生的任何非线性效应来避免测量不准确。 在一个示例中,可以在校准阶段期间生成值表,以将光电检测器输出转换成实际的散射光量。

    Inspection Systems and Methods for Extending the Detection Range of an Inspection System by Forcing the Photodetector into the Non-Linear Range
    7.
    发明申请
    Inspection Systems and Methods for Extending the Detection Range of an Inspection System by Forcing the Photodetector into the Non-Linear Range 有权
    检测系统和方法通过强制光检测器进入非线性范围来扩展检测系统的检测范围

    公开(公告)号:US20080291454A1

    公开(公告)日:2008-11-27

    申请号:US11751293

    申请日:2007-05-21

    IPC分类号: G01N21/55

    摘要: An inspection system and method is provided herein for increasing the detection range of the inspection system. According to one embodiment, the inspection system may include a photodetector having a plurality of stages, which are adapted to convert light scattered from a specimen into an output signal, and a voltage divider network coupled for extending the detection range of the photodetector (and thus, the detection range of the inspection system) by saturating at least one of the stages. This forces the photodetector to operate in a non-linear manner. However, measurement inaccuracies are avoided by calibrating the photodetector output to remove any non-linear effects that may be created by intentionally saturating the at least one of the stages. In one example, a table of values may be generated during a calibration phase to convert the photodetector output into an actual amount of scattered light.

    摘要翻译: 本文提供了一种用于增加检查系统的检测范围的检查系统和方法。 根据一个实施例,检查系统可以包括具有多个级的光电检测器,其适于将从样本散射的光转换成输出信号,以及耦合的用于扩展光电检测器的检测范围的分压器网络 ,检查系统的检测范围)通过饱和至少一个级。 这迫使光电探测器以非线性方式工作。 然而,通过校准光电检测器输出以消除可能通过故意饱和至少一个级而产生的任何非线性效应来避免测量不准确。 在一个示例中,可以在校准阶段期间生成值表,以将光电检测器输出转换成实际的散射光量。

    Extended defect sizing range for wafer inspection
    8.
    发明授权
    Extended defect sizing range for wafer inspection 有权
    晶圆检查扩展缺陷尺寸范围

    公开(公告)号:US09091666B2

    公开(公告)日:2015-07-28

    申请号:US13369294

    申请日:2012-02-09

    IPC分类号: G01N21/88 G01N21/95

    CPC分类号: G01N21/9501

    摘要: Various embodiments for extended defect sizing range for wafer inspection are provided. One inspection system includes an illumination subsystem configured to direct light to the wafer. The system also includes an image sensor configured to detect light scattered from wafer defects and to generate output responsive to the scattered light. The image sensor is also configured to not have an anti-blooming feature such that when a pixel in the image sensor reaches full well capacity, excess charge flows from the pixel to one or more neighboring pixels in the image sensor. The system further includes a computer subsystem configured to detect the defects on the wafer using the output and to determine a size of the defects on the wafer using the output generated by a pixel and any neighboring pixels of the pixel to which the excess charge flows.

    摘要翻译: 提供了用于晶片检查的扩展缺陷尺寸范围的各种实施例。 一个检查系统包括配置成将光引导到晶片的照明子系统。 该系统还包括图像传感器,其被配置为检测从晶片缺陷散射的光并且响应于散射光产生输出。 图像传感器还被配置为不具有防喷射特征,使得当图像传感器中的像素达到满井容量时,过量电荷从图像传感器中的像素流向一个或多个相邻像素。 该系统还包括被配置为使用输出来检测晶片上的缺陷的计算机子系统,并且使用由像素和多余电荷流过的像素的任何相邻像素产生的输出来确定晶片上的缺陷的尺寸。