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公开(公告)号：US06472459B2
公开(公告)日：2002-10-29
申请号：US09764615
申请日：2001-01-16
IPC分类号： C08K308
CPC分类号： B22F1/0018 , B22F3/1275 , B22F2003/1046 , B28B1/14 , B28B7/342 , B82Y10/00 , B82Y30/00 , B82Y40/00 , C04B35/111 , C04B35/2658 , C04B35/622 , G03F7/00 , G03F7/0002 , Y10S977/777 , Y10S977/887 , Y10S977/888 , Y10S977/893
摘要： A method is provided for fabricating metallic microstructures, i.e., microcomponents of micron or submicron dimensions. A molding composition is prepared containing an optional binder and nanometer size (1 to 1000 nm in diameter) metallic particles. A mold, such as a lithographically patterned mold, preferably a LIGA or a negative photoresist mold, is filled with the molding composition and compressed. The resulting microstructures are then removed from the mold and the resulting metallic microstructures so provided are then sintered.
摘要翻译： 提供了用于制造金属微结构的方法，即微米或亚微米尺寸的微组件。 制备含有任选的粘合剂和纳米尺寸（1至1000nm直径）金属颗粒的模制组合物。 模具，例如光刻图案的模具，优选LIGA或负型光致抗蚀剂模具，用模塑组合物填充并压缩。 然后将所得微结构从模具中取出，然后将如此提供的所得金属微结构烧结。
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公开(公告)号：US07390377B1
公开(公告)日：2008-06-24
申请号：US11234607
申请日：2005-09-22
申请人： Thomas I. Wallow , Marion C. Hunter , Karen Lee Krafcik , Alfredo M. Morales , Blake A. Simmons , Linda A. Domeier
发明人： Thomas I. Wallow , Marion C. Hunter , Karen Lee Krafcik , Alfredo M. Morales , Blake A. Simmons , Linda A. Domeier
CPC分类号： C09J5/02 , B29C65/02 , B29C65/4815 , B29C65/482 , B29C65/4825 , B29C65/4835 , B29C65/4845 , B29C65/5042 , B29C65/523 , B29C66/1122 , B29C66/324 , B29C66/53461 , B29C66/71 , B29C66/73921 , B29C66/83221 , B29C66/954 , B29C66/9592 , B29L2031/756 , B81B2201/058 , B81C3/001 , C08J5/121 , C08J5/122 , C09J2400/226 , B29K2023/38
摘要： We demonstrate a new method for joining patterned thermoplastic parts into layered structures. The method takes advantage of case-II permeant diffusion to generate dimensionally controlled, activated bonding layers at the surfaces being joined. It is capable of producing bonds characterized by cohesive failure while preserving the fidelity of patterned features in the bonding surfaces. This approach is uniquely suited to production of microfluidic multilayer structures, as it allows the bond-forming interface between plastic parts to be precisely manipulated at micrometer length scales. The bond enhancing procedure is easily integrated in standard process flows and requires no specialized equipment.
摘要翻译： 我们展示了一种将图案化热塑性部件接合到分层结构中的新方法。 该方法利用壳II透过物扩散在连接的表面上产生尺寸受控的激活的结合层。 它能够产生以粘结破坏为特征的粘结，同时保持粘合表面中的图案特征的保真度。 该方法独特地适用于微流体多层结构的生产，因为它允许塑料部件之间的结合形成界面以微米的长度尺度被精确地操纵。 粘结增强程序很容易集成到标准工艺流程中，不需要专门的设备。
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公开(公告)号：US06422528B1
公开(公告)日：2002-07-23
申请号：US09765078
申请日：2001-01-17
IPC分类号： B22D2504
CPC分类号： C25D1/10 , B29C33/3857 , B29C33/52 , B29C2045/0094 , Y10T29/49984 , Y10T29/49988
摘要： A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.
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公开(公告)号：US06477225B1
公开(公告)日：2002-11-05
申请号：US09636002
申请日：2000-08-09
申请人： Alfredo M. Morales , Dawn M. Skala
发明人： Alfredo M. Morales , Dawn M. Skala
IPC分类号： G21K500
CPC分类号： B29C33/3842 , G03F7/0017
摘要： The present invention describes a method for fabricating an x-ray mask tool which can achieve pattern features having lateral dimension of less than 1 micron. The process uses a thin photoresist and a standard lithographic mask to transfer an trace image pattern in the surface of a silicon wafer by exposing and developing the resist. The exposed portion of the silicon substrate is then anisotropically etched to provide an etched image of the trace image pattern consisting of a series of channels in the silicon having a high depth-to-width aspect ratio. These channels are then filled by depositing a metal such as gold to provide an inverse image of the trace image and thereby providing a robust x-ray mask tool.
摘要翻译： 本发明描述了一种可以实现具有小于1微米的横向尺寸的图案特征的X射线掩模工具的制造方法。 该方法使用薄的光致抗蚀剂和标准光刻掩模，通过曝光和显影抗蚀剂来转移硅晶片的表面中的迹线图案。 然后对硅衬底的暴露部分进行各向异性蚀刻，以提供由具有高深度至宽度纵横比的硅中的一系列通道组成的迹像图案的蚀刻图像。 然后通过沉积诸如金的金属来填充这些通道以提供迹线图像的逆图像，从而提供鲁棒的x射线掩模工具。
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公开(公告)号：US06798862B2
公开(公告)日：2004-09-28
申请号：US10262039
申请日：2002-10-01
申请人： Alfredo M. Morales , Dawn M. Skala
发明人： Alfredo M. Morales , Dawn M. Skala
IPC分类号： G21K100
CPC分类号： B29C33/3842 , G03F7/0017
摘要： The present invention describes a method for fabricating an x-ray mask tool which can achieve pattern features having lateral dimension of less than 1 micron. The process uses a thin photoresist and a standard lithographic mask to transfer an trace image pattern in the surface of a silicon wafer by exposing and developing the resist. The exposed portion of the silicon substrate is then anisotropically etched to provide an etched image of the trace image pattern consisting of a series of channels in the silicon having a high depth-to-width aspect ratio. These channels are then filled by depositing a metal such as gold to provide an inverse image of the trace image and thereby providing a robust x-ray mask tool.
摘要翻译： 本发明描述了一种可以实现具有小于1微米的横向尺寸的图案特征的X射线掩模工具的制造方法。 该方法使用薄的光致抗蚀剂和标准光刻掩模，通过曝光和显影抗蚀剂来转移硅晶片的表面中的迹线图案。 然后对硅衬底的暴露部分进行各向异性蚀刻，以提供由具有高深度至宽度纵横比的硅中的一系列通道组成的迹像图案的蚀刻图像。 然后通过沉积诸如金的金属来填充这些通道以提供迹线图像的逆图像，从而提供鲁棒的x射线掩模工具。
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公开(公告)号：US06679471B2
公开(公告)日：2004-01-20
申请号：US10052948
申请日：2002-01-17
IPC分类号： B22D2540
CPC分类号： C25D1/10 , B29C33/3857 , B29C33/52 , B29C2045/0094 , Y10T29/49984 , Y10T29/49988
摘要： A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold. Upon casting and demolding, the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool. The plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate, which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved, leaving the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.
摘要翻译： 提供具有可电镀背衬的牺牲塑料模具，其方法是通过经由多孔金属基材（片材，筛网，网孔或泡沫）注入浇注液体制剂而制成这种模具的方法，并且进入微尺度主体的特征 模子。 在铸造和脱模时，将多孔金属基材嵌入浇注配方中并投射具有由模具确定的特征的塑料结构。 塑料结构提供了机械地结合到多孔金属基底上的牺牲塑料模具，其提供适于电镀连续或不连续金属重复的导电支撑件。 在电镀和研磨之后，牺牲塑料可以溶解，留下所需的金属结构结合到多孔金属基底上。 任选地，电镀结构可以通过多孔基材或其上的涂层的选择性溶解从多孔基材脱粘。
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公开(公告)号：US07465419B1
公开(公告)日：2008-12-16
申请号：US11440867
申请日：2006-05-24
申请人： Alfredo M. Morales , Linda A. Domeier , Marcela G. Gonzales , Patrick N. Keifer , Terry J. Garino
发明人： Alfredo M. Morales , Linda A. Domeier , Marcela G. Gonzales , Patrick N. Keifer , Terry J. Garino
IPC分类号： B29C33/00
CPC分类号： C25D1/10 , B29C33/3857 , B29C33/52 , B29C2045/0094 , Y10T29/49984 , Y10T29/49988
摘要： A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.
摘要翻译： 提供了符合标准的悬臂三维微镜。 柔性悬臂微型适用于复制悬臂微型零件，大大简化了这种悬臂零件的复制。 柔性悬臂微型金属可用于使用铸造或电铸技术制造微型材料。 当柔性微型金属用于制造电铸悬臂部件时，微型金属还将包括由多孔金属基底形成的导电基底，该多孔金属基底嵌入柔性悬臂式微型显微镜。 还提供了制造柔性悬臂微型金刚石的方法以及使用柔性悬臂微型重复复制悬臂微型零件的方法。
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公开(公告)号：US06929733B2
公开(公告)日：2005-08-16
申请号：US10134060
申请日：2002-04-24
CPC分类号： C25D1/10 , B29C33/3857 , B29C33/52 , B29C2045/0094 , Y10T29/49984 , Y10T29/49988
摘要： A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.
摘要翻译： 提供具有电镀背衬的牺牲塑料模具。 一个实施方案包括通过多孔金属基材（片，筛，网或泡沫）将软化或熔融的热塑性塑料注入到与多孔金属基底接触的微尺度模制工具的特征中。 在脱模时，多孔金属基材将嵌入热塑性塑料中，并且将塑造具有由模具确定的特征的塑料结构。 这种塑料结构反过来又提供了机械地结合到多孔金属基底上的牺牲性塑料模具，其提供适于电镀连续或不连续金属重复的导电支撑体。 在电镀和研磨之后，牺牲塑料可以溶解以留下结合到多孔金属基底的所需金属结构。 任选地，电镀结构可以通过多孔基材或其上的涂层的选择性溶解从多孔基材脱粘。
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公开(公告)号：US06810104B2
公开(公告)日：2004-10-26
申请号：US10146391
申请日：2002-05-14
申请人： Alfredo M. Morales
发明人： Alfredo M. Morales
IPC分类号： G21K500
摘要： The present invention describes a method for fabricating an x-ray mask tool which is a contact lithographic mask which can provide an x-ray exposure dose which is adjustable from point-to-point. The tool is useful in the preparation of LIGA plating molds made from PMMA, or similar materials. In particular the tool is useful for providing an ability to apply a graded, or “stepped” x-ray exposure dose across a photosensitive substrate. By controlling the x-ray radiation dose from point-to-point, it is possible to control the development process for removing exposed portions of the substrate; adjusting it such that each of these portions develops at a more or less uniformly rate regardless of feature size or feature density distribution.
摘要翻译： 本发明描述了一种用于制造x射线掩模工具的方法，该工具是可以提供从点对点调节的x射线曝光剂量的接触光刻掩模。 该工具可用于制备由PMMA或类似材料制成的LIGA电镀模具。 特别地，该工具可用于提供在感光基底上施加分级或“阶梯式”x射线曝光剂量的能力。 通过从点到点控制x射线辐射剂量，可以控制用于去除衬底的暴露部分的显影过程; 调整它们使得这些部分中的每一个以或多或少均匀的速率发展，而与特征尺寸或特征密度分布无关。
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公开(公告)号：US06841339B2
公开(公告)日：2005-01-11
申请号：US10072394
申请日：2002-02-05
申请人： Alfredo M. Morales
发明人： Alfredo M. Morales
CPC分类号： B81C99/009 , B29C33/3842 , G03F7/0017
摘要： The present invention describes a method for rapidly fabricating a robust 3-dimensional silicon micro-mold for use in preparing complex metal micro-components. The process begins by depositing a conductive metal layer onto one surface of a silicon wafer. A thin photoresist and a standard lithographic mask are then used to transfer a trace image pattern onto the opposite surface of the wafer by exposing and developing the resist. The exposed portion of the silicon substrate is anisotropically etched through the wafer thickness down to conductive metal layer to provide an etched pattern consisting of a series of rectilinear channels and recesses in the silicon which serve as the silicon micro-mold. Microcomponents are prepared with this mold by first filling the mold channels and recesses with a metal deposit, typically by electroplating, and then removing the silicon micro-mold by chemical etching.
摘要翻译： 本发明描述了用于快速制造用于制备复合金属微组件的坚固的三维硅微型模具的方法。 该过程开始于在硅晶片的一个表面上沉积导电金属层。 然后使用薄的光致抗蚀剂和标准光刻掩模通过曝光和显影抗蚀剂将痕迹图案转印到晶片的相对表面上。 将硅衬底的暴露部分通过晶片厚度各向异性地蚀刻到导电金属层，以提供由用作硅微型模的硅中的一系列直线通道和凹槽组成的蚀刻图案。 通过首先用金属沉积物（通常通过电镀）填充模具通道和凹槽，然后通过化学蚀刻去除硅微型模具，用该模具制备微组件。
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