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    Method for providing a compliant cantilevered micromold
    1.
    发明授权
    Method for providing a compliant cantilevered micromold 有权
    用于提供柔性悬臂微型显微镜的方法

    公开(公告)号：US07465419B1

    公开(公告)日：2008-12-16

    申请号：US11440867

    申请日：2006-05-24

    申请人： Alfredo M. Morales ,  Linda A. Domeier ,  Marcela G. Gonzales ,  Patrick N. Keifer ,  Terry J. Garino

    发明人： Alfredo M. Morales ,  Linda A. Domeier ,  Marcela G. Gonzales ,  Patrick N. Keifer ,  Terry J. Garino

    IPC分类号： B29C33/00

    CPC分类号： C25D1/10 ,  B29C33/3857 ,  B29C33/52 ,  B29C2045/0094 ,  Y10T29/49984 ,  Y10T29/49988

    摘要： A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.

    摘要翻译： 提供了符合标准的悬臂三维微镜。 柔性悬臂微型适用于复制悬臂微型零件，大大简化了这种悬臂零件的复制。 柔性悬臂微型金属可用于使用铸造或电铸技术制造微型材料。 当柔性微型金属用于制造电铸悬臂部件时，微型金属还将包括由多孔金属基底形成的导电基底，该多孔金属基底嵌入柔性悬臂式微型显微镜。 还提供了制造柔性悬臂微型金刚石的方法以及使用柔性悬臂微型重复复制悬臂微型零件的方法。

    Castable plastic mold with electroplatable base
    2.
    发明授权
    Castable plastic mold with electroplatable base 有权
    铸造塑料模具，电镀基座

    公开(公告)号：US06679471B2

    公开(公告)日：2004-01-20

    申请号：US10052948

    申请日：2002-01-17

    申请人： Linda A. Domeier ,  Alfredo M. Morales ,  Marcela G. Gonzales ,  Patrick M. Keifer

    发明人： Linda A. Domeier ,  Alfredo M. Morales ,  Marcela G. Gonzales ,  Patrick M. Keifer

    IPC分类号： B22D2540

    CPC分类号： C25D1/10 ,  B29C33/3857 ,  B29C33/52 ,  B29C2045/0094 ,  Y10T29/49984 ,  Y10T29/49988

    摘要： A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold. Upon casting and demolding, the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool. The plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate, which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved, leaving the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

    摘要翻译： 提供具有可电镀背衬的牺牲塑料模具，其方法是通过经由多孔金属基材（片材，筛网，网孔或泡沫）注入浇注液体制剂而制成这种模具的方法，并且进入微尺度主体的特征 模子。 在铸造和脱模时，将多孔金属基材嵌入浇注配方中并投射具有由模具确定的特征的塑料结构。 塑料结构提供了机械地结合到多孔金属基底上的牺牲塑料模具，其提供适于电镀连续或不连续金属重复的导电支撑件。 在电镀和研磨之后，牺牲塑料可以溶解，留下所需的金属结构结合到多孔金属基底上。 任选地，电镀结构可以通过多孔基材或其上的涂层的选择性溶解从多孔基材脱粘。

    Sacrificial plastic mold with electroplatable base
    4.
    发明授权
    Sacrificial plastic mold with electroplatable base 有权

    公开(公告)号：US06422528B1

    公开(公告)日：2002-07-23

    申请号：US09765078

    申请日：2001-01-17

    申请人： Linda A. Domeier ,  Jill M. Hruby ,  Alfredo M. Morales

    发明人： Linda A. Domeier ,  Jill M. Hruby ,  Alfredo M. Morales

    IPC分类号： B22D2504

    CPC分类号： C25D1/10 ,  B29C33/3857 ,  B29C33/52 ,  B29C2045/0094 ,  Y10T29/49984 ,  Y10T29/49988

    摘要： A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

    Sacrificial plastic mold with electroplatable base
    6.
    发明授权
    Sacrificial plastic mold with electroplatable base 失效
    牺牲塑料模具与电镀基地

    公开(公告)号：US06929733B2

    公开(公告)日：2005-08-16

    申请号：US10134060

    申请日：2002-04-24

    申请人： Linda A. Domeier ,  Jill M. Hruby ,  Alfredo M. Morales

    发明人： Linda A. Domeier ,  Jill M. Hruby ,  Alfredo M. Morales

    IPC分类号： B29C33/00 ,  B29C33/38 ,  B29C33/52 ,  C25D1/10 ,  C25D1/00 ,  B29B7/00 ,  B29C43/00 ,  C25D1/08

    CPC分类号： C25D1/10 ,  B29C33/3857 ,  B29C33/52 ,  B29C2045/0094 ,  Y10T29/49984 ,  Y10T29/49988

    摘要： A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

    摘要翻译： 提供具有电镀背衬的牺牲塑料模具。 一个实施方案包括通过多孔金属基材（片，筛，网或泡沫）将软化或熔融的热塑性塑料注入到与多孔金属基底接触的微尺度模制工具的特征中。 在脱模时，多孔金属基材将嵌入热塑性塑料中，并且将塑造具有由模具确定的特征的塑料结构。 这种塑料结构反过来又提供了机械地结合到多孔金属基底上的牺牲性塑料模具，其提供适于电镀连续或不连续金属重复的导电支撑体。 在电镀和研磨之后，牺牲塑料可以溶解以留下结合到多孔金属基底的所需金属结构。 任选地，电镀结构可以通过多孔基材或其上的涂层的选择性溶解从多孔基材脱粘。

    X-ray mask and method for making
    7.
    发明授权
    X-ray mask and method for making 有权
    X射线掩模和制作方法

    公开(公告)号：US06810104B2

    公开(公告)日：2004-10-26

    申请号：US10146391

    申请日：2002-05-14

    申请人： Alfredo M. Morales

    发明人： Alfredo M. Morales

    IPC分类号： G21K500

    CPC分类号： G03F1/22 ,  G03F1/50 ,  G03F7/00

    摘要： The present invention describes a method for fabricating an x-ray mask tool which is a contact lithographic mask which can provide an x-ray exposure dose which is adjustable from point-to-point. The tool is useful in the preparation of LIGA plating molds made from PMMA, or similar materials. In particular the tool is useful for providing an ability to apply a graded, or “stepped” x-ray exposure dose across a photosensitive substrate. By controlling the x-ray radiation dose from point-to-point, it is possible to control the development process for removing exposed portions of the substrate; adjusting it such that each of these portions develops at a more or less uniformly rate regardless of feature size or feature density distribution.

    摘要翻译： 本发明描述了一种用于制造x射线掩模工具的方法，该工具是可以提供从点对点调节的x射线曝光剂量的接触光刻掩模。 该工具可用于制备由PMMA或类似材料制成的LIGA电镀模具。 特别地，该工具可用于提供在感光基底上施加分级或“阶梯式”x射线曝光剂量的能力。 通过从点到点控制x射线辐射剂量，可以控制用于去除衬底的暴露部分的显影过程; 调整它们使得这些部分中的每一个以或多或少均匀的速率发展，而与特征尺寸或特征密度分布无关。

    Silicon micro-mold and method for fabrication
    8.
    发明授权
    Silicon micro-mold and method for fabrication 有权
    硅微模和制造方法

    公开(公告)号：US06841339B2

    公开(公告)日：2005-01-11

    申请号：US10072394

    申请日：2002-02-05

    申请人： Alfredo M. Morales

    发明人： Alfredo M. Morales

    IPC分类号： B29C33/38 ,  B81C1/00 ,  G03F7/00 ,  C23F1/00 ,  B29C33/40

    CPC分类号： B81C99/009 ,  B29C33/3842 ,  G03F7/0017

    摘要： The present invention describes a method for rapidly fabricating a robust 3-dimensional silicon micro-mold for use in preparing complex metal micro-components. The process begins by depositing a conductive metal layer onto one surface of a silicon wafer. A thin photoresist and a standard lithographic mask are then used to transfer a trace image pattern onto the opposite surface of the wafer by exposing and developing the resist. The exposed portion of the silicon substrate is anisotropically etched through the wafer thickness down to conductive metal layer to provide an etched pattern consisting of a series of rectilinear channels and recesses in the silicon which serve as the silicon micro-mold. Microcomponents are prepared with this mold by first filling the mold channels and recesses with a metal deposit, typically by electroplating, and then removing the silicon micro-mold by chemical etching.

    摘要翻译： 本发明描述了用于快速制造用于制备复合金属微组件的坚固的三维硅微型模具的方法。 该过程开始于在硅晶片的一个表面上沉积导电金属层。 然后使用薄的光致抗蚀剂和标准光刻掩模通过曝光和显影抗蚀剂将痕迹图案转印到晶片的相对表面上。 将硅衬底的暴露部分通过晶片厚度各向异性地蚀刻到导电金属层，以提供由用作硅微型模的硅中的一系列直线通道和凹槽组成的蚀刻图案。 通过首先用金属沉积物（通常通过电镀）填充模具通道和凹槽，然后通过化学蚀刻去除硅微型模具，用该模具制备微组件。

    System for particle concentration and detection
    9.
    发明授权
    System for particle concentration and detection 有权
    粒子浓度和检测系统

    公开(公告)号：US08398839B1

    公开(公告)日：2013-03-19

    申请号：US12793370

    申请日：2010-06-03

    申请人： Alfredo M. Morales ,  Josh A. Whaley ,  Mark D. Zimmerman ,  Ronald F. Renzi ,  Huu M. Tran ,  Scott M. Maurer ,  William D. Munslow

    发明人： Alfredo M. Morales ,  Josh A. Whaley ,  Mark D. Zimmerman ,  Ronald F. Renzi ,  Huu M. Tran ,  Scott M. Maurer ,  William D. Munslow

    IPC分类号： B03C5/02

    CPC分类号： B03C5/005 ,  B03C5/024 ,  B03C5/026

    摘要： A new microfluidic system comprising an automated prototype insulator-based dielectrophoresis (iDEP) triggering microfluidic device for pathogen monitoring that can eventually be run outside the laboratory in a real world environment has been used to demonstrate the feasibility of automated trapping and detection of particles. The system broadly comprised an aerosol collector for collecting air-borne particles, an iDEP chip within which to temporarily trap the collected particles and a laser and fluorescence detector with which to induce a fluorescence signal and detect a change in that signal as particles are trapped within the iDEP chip.

    摘要翻译： 一种新的微流体系统已经被用于证明自动捕获和检测颗粒的可行性，该自动原型基于绝缘子的介电电泳（iDEP）触发用于病原体监测的微流体装置，其可以在实际环境中最终在实验室外运行。 该系统广泛地包括用于收集空气颗粒的气溶胶收集器，其中临时捕获收集的颗粒的iDEP芯片和用于诱导荧光信号的激光和荧光检测器，并且当颗粒被捕获在其内时，检测该信号的变化 iDEP芯片。

    X-ray mask and method for providing same
    10.
    发明授权
    X-ray mask and method for providing same 有权
    X射线掩模及其提供方法

    公开(公告)号：US06477225B1

    公开(公告)日：2002-11-05

    申请号：US09636002

    申请日：2000-08-09

    申请人： Alfredo M. Morales ,  Dawn M. Skala

    发明人： Alfredo M. Morales ,  Dawn M. Skala

    IPC分类号： G21K500

    CPC分类号： B29C33/3842 ,  G03F7/0017

    摘要： The present invention describes a method for fabricating an x-ray mask tool which can achieve pattern features having lateral dimension of less than 1 micron. The process uses a thin photoresist and a standard lithographic mask to transfer an trace image pattern in the surface of a silicon wafer by exposing and developing the resist. The exposed portion of the silicon substrate is then anisotropically etched to provide an etched image of the trace image pattern consisting of a series of channels in the silicon having a high depth-to-width aspect ratio. These channels are then filled by depositing a metal such as gold to provide an inverse image of the trace image and thereby providing a robust x-ray mask tool.

    摘要翻译： 本发明描述了一种可以实现具有小于1微米的横向尺寸的图案特征的X射线掩模工具的制造方法。 该方法使用薄的光致抗蚀剂和标准光刻掩模，通过曝光和显影抗蚀剂来转移硅晶片的表面中的迹线图案。 然后对硅衬底的暴露部分进行各向异性蚀刻，以提供由具有高深度至宽度纵横比的硅中的一系列通道组成的迹像图案的蚀刻图像。 然后通过沉积诸如金的金属来填充这些通道以提供迹线图像的逆图像，从而提供鲁棒的x射线掩模工具。