公开(公告)号：US07465419B1

公开(公告)日：2008-12-16

申请号：US11440867

申请日：2006-05-24

申请人： Alfredo M. Morales ,  Linda A. Domeier ,  Marcela G. Gonzales ,  Patrick N. Keifer ,  Terry J. Garino

发明人： Alfredo M. Morales ,  Linda A. Domeier ,  Marcela G. Gonzales ,  Patrick N. Keifer ,  Terry J. Garino

IPC分类号： B29C33/00

CPC分类号： C25D1/10 ,  B29C33/3857 ,  B29C33/52 ,  B29C2045/0094 ,  Y10T29/49984 ,  Y10T29/49988

摘要： A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.

摘要翻译： 提供了符合标准的悬臂三维微镜。 柔性悬臂微型适用于复制悬臂微型零件，大大简化了这种悬臂零件的复制。 柔性悬臂微型金属可用于使用铸造或电铸技术制造微型材料。 当柔性微型金属用于制造电铸悬臂部件时，微型金属还将包括由多孔金属基底形成的导电基底，该多孔金属基底嵌入柔性悬臂式微型显微镜。 还提供了制造柔性悬臂微型金刚石的方法以及使用柔性悬臂微型重复复制悬臂微型零件的方法。

公开(公告)号：US08262950B1

公开(公告)日：2012-09-11

申请号：US12727353

申请日：2010-03-19

申请人： Tina M. Nenoff ,  James L. Krumhansl ,  Terry J. Garino ,  Nathan W. Ockwig

发明人： Tina M. Nenoff ,  James L. Krumhansl ,  Terry J. Garino ,  Nathan W. Ockwig

IPC分类号： C09K11/04 ,  C09K3/00 ,  G21F9/00

CPC分类号： G21F9/305 ,  C03C14/004 ,  C03C2214/14 ,  C03C2214/34 ,  C09K11/04

摘要： Materials and methods of making low-sintering-temperature glass waste forms that sequester radioactive iodine in a strong and durable structure. First, the iodine is captured by an adsorbant, which forms an iodine-loaded material, e.g., AgI, AgI-zeolite, AgI-mordenite, Ag-silica aerogel, ZnI2, CuI, or Bi5O7I. Next, particles of the iodine-loaded material are mixed with powdered frits of low-sintering-temperature glasses (comprising various oxides of Si, B, Bi, Pb, and Zn), and then sintered at a relatively low temperature, ranging from 425° C. to 550° C. The sintering converts the mixed powders into a solid block of a glassy waste form, having low iodine leaching rates. The vitrified glassy waste form can contain as much as 60 wt % AgI. A preferred glass, having a sintering temperature of 500° C. (below the silver iodide sublimation temperature of 500° C.) was identified that contains oxides of boron, bismuth, and zinc, while containing essentially no lead or silicon.

摘要翻译： 制造低烧结温度玻璃废物的材料和方法形成了强大耐用的结构中的放射性碘。 首先，碘被吸附剂捕获，该吸附剂形成碘负载材料，例如AgI，AgI-沸石，Ag1-丝光沸石，Ag-二氧化硅气凝胶，ZnI 2，CuI或Bi 5 O 7。 接下来，将负载碘的材料的颗粒与低烧结温度玻璃（包括各种Si，B，Bi，Pb和Zn的氧化物）的粉状玻璃料混合，然后在比较低的温度下从425 ℃至550℃。烧结将混合粉末转化为具有低碘浸出速率的玻璃状废物形式的固体块。 玻璃化玻璃废物形式可含有多达60重量％的AgI。 确定了烧结温度为500℃（低于碘化银升华温度为500℃）的玻璃，其含有硼，铋和锌的氧化物，同时基本上不含铅或硅。

公开(公告)号：US06375759B1

公开(公告)日：2002-04-23

申请号：US09452321

申请日：1999-11-30

申请人： Todd R. Christenson ,  Terry J. Garino ,  Eugene L. Venturini

发明人： Todd R. Christenson ,  Terry J. Garino ,  Eugene L. Venturini

IPC分类号： H01F1053

CPC分类号： H01F1/0533 ,  H01F41/0266 ,  H01F41/0273 ,  H01F41/16

摘要： A new class of processes for fabrication of precision miniature rare earth permanent magnets is disclosed. Such magnets typically have sizes in the range 0.1 to 10 millimeters, and dimensional tolerances as small as one micron. Very large magnetic fields can be produced by such magnets, lending to their potential application in MEMS and related electromechanical applications, and in miniature millimeter-wave vacuum tubes. This abstract contains simplifications, and is supplied only for purposes of searching, not to limit or alter the scope or meaning of any claims herein.

摘要翻译： 公开了一类用于制造精密微型稀土永磁体的新工艺。 这种磁体通常具有在0.1至10毫米范围内的尺寸，以及小到1微米的尺寸公差。 可以通过这样的磁体产生非常大的磁场，从而在MEMS和相关的机电应用中以及在微型毫米波真空管中潜在地应用它们。 该摘要包含简化，并且仅为了搜索而提供，而不是限制或改变本文中任何权利要求的范围或含义。

公开(公告)号：US5950292A

公开(公告)日：1999-09-14

申请号：US811305

申请日：1997-03-04

申请人： Duane B. Dimos ,  Terry J. Garino

发明人： Duane B. Dimos ,  Terry J. Garino

IPC分类号： H01L21/60 ,  H01L21/68 ,  H05K1/16 ,  H05K3/20 ,  H01G4/06

CPC分类号： H01L24/82 ,  H01L21/6835 ,  H01L24/24 ,  H05K1/162 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2203/016 ,  H05K3/20 ,  Y10T29/435 ,  Y10T29/49812

摘要： Applique circuits suitable for advanced packaging applications are introduced. These structures are particularly suited for the simple integration of large amounts (many nanoFarads) of capacitance into conventional integrated circuit and multichip packaging technology. In operation, applique circuits are bonded to the integrated circuit or other appropriate structure at the point where the capacitance is required, thereby minimizing the effects of parasitic coupling. An immediate application is to problems of noise reduction and control in modern high-frequency circuitry.

摘要翻译： 引入适用于先进封装应用的Appliqu + E，acu e + EE电路。 这些结构特别适用于将大量（许多nanoFarads）电容简单集成到传统的集成电路和多芯片封装技术中。 在操作中，贴片+ E，acu e + EE电路在需要电容的位置被结合到集成电路或其他适当的结构，从而最小化寄生耦合的影响。 一个立即的应用是现代高频电路中降噪和控制的问题。

公开(公告)号：US5639296A

公开(公告)日：1997-06-17

申请号：US328625

申请日：1994-10-25

申请人： Terry J. Garino

发明人： Terry J. Garino

IPC分类号： C09C1/36 ,  C09C1/40 ,  C09C3/08 ,  C09C3/10 ,  C09C3/12 ,  C09C1/22

CPC分类号： B82Y30/00 ,  C09C1/36 ,  C09C1/407 ,  C09C3/08 ,  C09C3/10 ,  C09C3/12 ,  C01P2002/88 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2004/80 ,  C01P2006/12 ,  C01P2006/22

摘要： Thixotropic particle suspensions are prepared by controlling the quantity of dispersant composition used for particle coating to an amount which is less than that quantity that would provide a full coating of dispersant on all particles suspended.

摘要翻译： 触变颗粒悬浮液是通过将用于颗粒涂层的分散剂组合物的量控制在小于在悬浮的所有颗粒上提供全涂层分散剂的量来制备的。