PROCESS OF FORMING AN ELECTRODE ON THE FRONT-SIDE OF A NON-TEXTURED SILICON WAFER
    5.
    发明申请
    PROCESS OF FORMING AN ELECTRODE ON THE FRONT-SIDE OF A NON-TEXTURED SILICON WAFER 审中-公开
    在非纹理硅膜的正面形成电极的工艺

    公开(公告)号:US20110088769A1

    公开(公告)日:2011-04-21

    申请号:US12905375

    申请日:2010-10-15

    IPC分类号: H01L31/0224 H01L31/18

    摘要: A process for the production of a front-side electrode on a non-textured silicon wafer having an ARC layer on its front-side, wherein the front-side electrode is printed from a silver paste and fired, wherein the silver paste comprises (i) an inorganic content comprising (a) 93 to 95 wt.-% of electrically conductive metal powder comprising 90 to 100 wt.-% of silver powder, (b) 1 to 7 wt.-% of at least one glass frit, (c) 0 to 6 wt.-% of at least one solid inorganic oxide and (d) 0 to 6 wt.-% of at least one compound capable of forming a solid inorganic oxide on firing and (ii) an organic vehicle, wherein the weight ratio between the electrically conductive metal powder and the glass frit plus solid inorganic oxide is >13 to 19 in the fired state.

    摘要翻译: 一种用于在其前侧具有ARC层的非织构化硅晶片上制造前侧电极的方法,其中所述前侧电极由银膏印刷并烧制,其中所述银膏包括(i )无机含量,其包含(a)93至95重量%的导电金属粉末,其包含90至100重量%的银粉,(b)1至7重量%的至少一种玻璃料,( c)0至6重量%的至少一种固体无机氧化物和(d)0至6重量%的至少一种能够在烧制时形成固体无机氧化物的化合物和(ii)有机载体,其中 导电金属粉末与玻璃料加上固体无机氧化物的重量比在烧成状态下> 13〜19。

    PROCESS FOR THE FORMATION OF A SILVER BACK ANODE OF A SILICON SOLAR CELL
    6.
    发明申请
    PROCESS FOR THE FORMATION OF A SILVER BACK ANODE OF A SILICON SOLAR CELL 审中-公开
    形成硅太阳能电池的阳极阳极的方法

    公开(公告)号:US20120160314A1

    公开(公告)日:2012-06-28

    申请号:US13168049

    申请日:2011-06-24

    IPC分类号: H01L31/0224 H01L31/18

    摘要: A process for the formation of a silver back anode of a silicon solar cell wherein a silver paste comprising particulate silver, an organic vehicle and glass frit comprising at least one antimony oxide is applied in a silver back anode pattern on the back-side of a p-type silicon wafer having an aluminum back-side metallization and fired.

    摘要翻译: 用于形成硅太阳能电池的银背阳极的方法,其中将包含颗粒状银,有机载体和包含至少一种氧化锑的玻璃料的银膏施加到银背阳极图案的背面 具有铝背面金属化的p型硅晶片并烧制。