公开(公告)号：US12113039B2

公开(公告)日：2024-10-08

申请号：US17245397

申请日：2021-04-30

申请人： ALPHA ASSEMBLY SOLUTIONS INC.

发明人： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC分类号： H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

CPC分类号： H01L24/29 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K2101/40 ,  B23K2103/56 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H10K50/8426 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2224/29339 ,  H01L2924/0105 ,  H01L2224/29339 ,  H01L2924/01046 ,  H01L2224/29339 ,  H01L2924/01047 ,  H01L2224/29339 ,  H01L2924/01029 ,  H01L2224/29339 ,  H01L2924/01028 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/29387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/2949 ,  H01L2924/00012 ,  H01L2224/2939 ,  H01L2924/0665 ,  H01L2224/271 ,  H01L2924/00014 ,  H01L2224/27436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/83447 ,  H01L2924/01074 ,  H01L2224/8321 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/13339 ,  H01L2924/0105 ,  H01L2224/13339 ,  H01L2924/01046 ,  H01L2224/13339 ,  H01L2924/01047 ,  H01L2224/13339 ,  H01L2924/01029 ,  H01L2224/13339 ,  H01L2924/01028 ,  H01L2224/13439 ,  H01L2924/00014 ,  H01L2224/13355 ,  H01L2924/00014 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/13387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/1349 ,  H01L2924/00012 ,  H01L2224/1339 ,  H01L2924/0665 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2224/11436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/8121 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： A sintering powder comprising:



a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US20180043451A1

公开(公告)日：2018-02-15

申请号：US15793318

申请日：2017-10-25

申请人： GENERAL ELECTRIC COMPANY

发明人： Yan CUI ,  Srikanth Chandrudu KOTTILINGAM ,  Brian Lee TOLLISON

IPC分类号： B23K1/00 ,  B23K26/34 ,  B23K15/00 ,  B22F5/00 ,  B23K9/04 ,  B22F5/04 ,  B22F7/06 ,  B32B15/01 ,  B23K10/02 ,  B22F7/04

CPC分类号： B23K1/0018 ,  B22F5/009 ,  B22F5/04 ,  B22F7/062 ,  B22F2007/047 ,  B22F2007/068 ,  B23K9/04 ,  B23K10/027 ,  B23K15/0086 ,  B23K26/34 ,  B32B15/01

摘要： A hybrid article is disclosed including a coating disposed on and circumscribing the lateral surface of a core having a core material. The coating includes about 35% to about 95% of a first metallic material having a first melting point, and about 5% to about 65% of a second metallic material having a second melting point lower than the first melting point. A method for forming the hybrid article is disclosed including disposing the core in a die, forming a gap between the lateral surface and the die, introducing a slurry having the metallic materials into the gap, and sintering the slurry, forming the coating. A method for closing an aperture of an article is disclosed including inserting the hybrid article into the aperture. Closing the aperture includes brazing the hybrid article to the article, welding the aperture with the hybrid article serving as weld filler, or a combination thereof.

公开(公告)号：US20170294404A1

公开(公告)日：2017-10-12

申请号：US15631282

申请日：2017-06-23

申请人： HENKEL AG & GO. KGAA ,  HENKEL IP & HOLDING GMBH

发明人： Hajime INOUE ,  Tadashi Takano

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  B22F1/0055 ,  B22F1/0059 ,  B22F1/0074 ,  B22F3/22 ,  B22F7/04 ,  B22F7/064 ,  B22F7/08 ,  B22F2007/047 ,  B23K35/0244 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83222 ,  H01L2224/83411 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/8384 ,  H05K3/32 ,  H05K2203/1131 ,  H01L2924/00014

摘要： An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.

公开(公告)号：US09751997B2

公开(公告)日：2017-09-05

申请号：US14433202

申请日：2013-09-27

申请人： DAI NIPPON PRINTING CO., LTD.

发明人： Michihiro Ogura ,  Tomoki Murata ,  Yoshinobu Omori ,  Naonobu Yoshi ,  Mikiko Hojo ,  Masanori Sawada ,  Shigehiro Ueno ,  Shinsuke Nagino

IPC分类号： C08K3/08 ,  C08K3/22 ,  C08K3/30 ,  C08J5/18 ,  C08F265/06 ,  B22F1/00 ,  C08F290/04 ,  C08F290/06 ,  C09D155/00 ,  C08L55/00 ,  H01B1/22 ,  C08F8/44 ,  B22F7/04

CPC分类号： C08J5/18 ,  B22F1/0022 ,  B22F7/04 ,  B22F2007/047 ,  C08F8/44 ,  C08F265/06 ,  C08F290/046 ,  C08F290/062 ,  C08K3/08 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/30 ,  C08K2003/0806 ,  C08K2003/2227 ,  C08K2003/2231 ,  C08K2003/3009 ,  C08L55/005 ,  C09D155/005 ,  H01B1/22 ,  C08F220/34

摘要： The present invention is to provide a metal particle dispersion which has low viscosity and excellent dispersibility and dispersion stability, and in which the precipitation of the metal particles is inhibited. Disclosed is a metal particle dispersion comprising metal particles, a dispersant and a solvent, wherein the metal particles contain one or more selected from the group consisting of gold, silver, copper, nickel, platinum, palladium, molybdenum, aluminum, antimony, tin, chromium, lanthanum, indium, gallium and germanium, and wherein the dispersant is a graft copolymer having at least one constitutional unit represented by the following general formula (I) and at least one constitutional unit represented by the following general formula (II), and in which at least part of nitrogen sites of the constitutional units represented by the general formula (I) each form a salt with at least one selected from the group consisting of a halogenated hydrocarbon, an acidic phosphorus compound represented by the following general formula (V), and a sulfonic acid compound represented by the following general formula (VI): (symbols shown in the general formulae (I), (II), (V) and (VI) are as described in the Description.)

公开(公告)号：US20170209932A1

公开(公告)日：2017-07-27

申请号：US15460677

申请日：2017-03-16

申请人： Taiho Kogyo Co., Ltd.

发明人： Takahiro KURONO ,  Kazunori KONDO ,  Hirofumi SEI ,  Eichi SATO

IPC分类号： B22F7/04 ,  B22F3/105 ,  B32B3/30 ,  B22F3/10 ,  F16C33/02 ,  B32B15/01

CPC分类号： B22F7/04 ,  B22F3/10 ,  B22F3/105 ,  B22F3/162 ,  B22F3/24 ,  B22F7/08 ,  B22F2003/1054 ,  B22F2007/047 ,  B22F2302/45 ,  B22F2998/10 ,  B32B3/30 ,  B32B15/01 ,  F16C33/02 ,  F16C33/103 ,  F16C33/124 ,  F16C33/14 ,  F16C2202/04 ,  F16C2220/20 ,  F16C2220/70 ,  F16C2220/82 ,  F16C2223/06 ,  F16C2223/08 ,  F16C2223/10 ,  F16C2223/32 ,  F16C2226/12 ,  Y10T428/12063

摘要： First, in a primary sintering step, a manufacturing system 1 for a sliding member 2 laminates and thereby forms a sintered alloy layer 4 on back metal 3. Subsequently, a large number of indents 5 are formed on a front surface of the sintered alloy layer 4 by an indent-forming mechanism 14. Next, the back metal 3 and sintered alloy layer 4 are rolled by a reduction roll 15 and a secondary sintering process is applied to the sintered alloy layer 4. Consequently, the sliding member 2 is manufactured with the large number of indents 5 provided on a front surface. Since the indents 5 are formed on the sintered alloy layer 4 after the primary sintering step, it is possible to inhibit work hardening from occurring in the indents 5 and surrounding areas.

公开(公告)号：US09676060B2

公开(公告)日：2017-06-13

申请号：US14032699

申请日：2013-09-20

申请人： NGK INSULATORS, LTD.

发明人： Naokuni Muramatsu ,  Shoju Aoshima

IPC分类号： B23K26/32 ,  B23K35/00 ,  B23K35/02 ,  C23C24/10 ,  C22C9/00 ,  C22C9/06 ,  C22C16/00 ,  C22C19/05 ,  C22C19/07 ,  C22C45/10 ,  B23K35/30 ,  B23K26/342 ,  B23K103/12 ,  B22F7/04 ,  C22C1/04 ,  C22C32/00 ,  B23K103/18 ,  B23K103/04

CPC分类号： B23K26/32 ,  B22F7/04 ,  B22F2007/047 ,  B22F2998/00 ,  B22F2998/10 ,  B23K26/342 ,  B23K35/007 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3033 ,  B23K2103/05 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/26 ,  C22C1/0433 ,  C22C1/0458 ,  C22C9/00 ,  C22C9/06 ,  C22C16/00 ,  C22C19/056 ,  C22C19/058 ,  C22C19/07 ,  C22C32/0052 ,  C22C45/10 ,  C23C24/10 ,  B22F3/22 ,  B22F3/105 ,  C22C29/06 ,  C22C29/16 ,  C22C29/14

摘要： A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters D50 of both DBA and RM employed fall within 0.1 to 100 μm, the median diameter D50 of DBA is larger than the median diameter D50 of RM, and both the distribution ratio D90/D10 of DBA and the distribution ratio D90/D10 of RM are 4.0 or less.

公开(公告)号：US20160236280A1

公开(公告)日：2016-08-18

申请号：US15023961

申请日：2014-09-24

申请人： HERAEUS DEUTSCHLAND GMBH & CO. KG

发明人： Susanne BEHL ,  Kai-Ulrich BOLDT

IPC分类号： B22F7/04 ,  B22F9/24 ,  B22F1/00

CPC分类号： B22F7/04 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0074 ,  B22F9/24 ,  B22F2007/042 ,  B22F2007/047 ,  B22F2009/245 ,  B22F2301/255 ,  B22F2304/054 ,  B22F2998/10

摘要： Process for producing a layer structure (2), which comprises the steps: E1. provision of a composition (6) comprising i. gold (Au) particles in an amount in the range from 0.1 to 50% by weight; ii. a balance to 100% by weight of a polar, protic organic solvent; iii. less than 5% by weight of water, where the % by weight, in each case based on the total mass of the composition (6), add up to 100% by weight; E2. application of the composition (6) to a substrate (4) to give a precursor (12); E3. heating of the precursor (12) to a temperature in the range from 25 to 200° C. to give the layer structure (2).

摘要翻译： 用于制造层结构（2）的方法，包括以下步骤：E1。 提供组合物（6），包括i。 金（Au）颗粒的量为0.1至50重量％; ii。 余量为100重量％的极性质子有机溶剂; iii。 小于5重量％的水，其中基于组合物（6）的总质量的每种情况下的重量％加起来为100重量％ E2。 将组合物（6）施用于基材（4）以得到前体（12）; E3。 将前体（12）加热至25〜200℃的温度，得到层结构（2）。

公开(公告)号：US20160045987A1

公开(公告)日：2016-02-18

申请号：US14782820

申请日：2015-03-09

申请人： FUKUDA METAL FOIL & POWDER CO., LTD.

发明人： Yukitaka Hamada ,  Shinichi Nishimura

IPC分类号： B23K35/30 ,  C22C19/05

CPC分类号： B23K35/304 ,  B22F1/0059 ,  B22F9/082 ,  B22F2007/047 ,  B23K35/0244 ,  B23K35/30 ,  B23K35/3033 ,  C22C1/0433 ,  C22C19/002 ,  C22C19/03 ,  C22C19/055 ,  C22C19/056 ,  F28F21/082 ,  F28F2275/04

摘要： Provided is a nickel brazing material having a melting temperature of 1000° C. or less and acid corrosion resistance. It includes 15.0 to 30.0 mass % of Cr, 6.0 to 18.0 mass % of Cu, 1.0 to 5.0 mass % of Mo. 5.0 to 7.0 mass % of P, 3.0 to 5.0 mass % of Si, and 0.1 to 1.5 mass % of Sn, the remainder being Ni and inevitable impurities. and the total of Si and P being 9.5 mass % to 11.0 mass %. It can include additional element selected from the group consisting of Co, Fe, Mn, C, B, Al, and Ti. The content of Co is 5.0 mass % or less, the content of Fe is 5.0 mass % or less, the content of Mn is 3.0 mass % or less, the total content of C, B, Al, and Ti is 0.5 mass % or less, and the total content of these elements is 10.0 mass % or less.

摘要翻译： 本发明提供熔融温度为1000℃以下，耐酸腐蚀性的镍钎焊材料。 其中，Cr为15.0〜30.0质量％，Cu为6.0〜18.0质量％，Mo为1.0〜5.0质量％，P为5.0〜7.0质量％，Si为3.0〜5.0质量％，Sn为0.1〜1.5质量％ ，其余为Ni和不可避免的杂质。 Si和P的合计为9.5质量％〜11.0质量％。 它可以包括选自Co，Fe，Mn，C，B，Al和Ti的另外的元素。 Co的含量为5.0质量％以下，Fe含量为5.0质量％以下，Mn含量为3.0质量％以下，C，B，Al，Ti的总含量为0.5质量％以下， 这些元素的总含量为10.0质量％以下。

公开(公告)号：US08889979B2

公开(公告)日：2014-11-18

申请号：US13100540

申请日：2011-05-04

申请人： Alan Frederick Carroll ,  Kenneth Warren Hang ,  Brian J. Laughlin ,  Kurt Richard Mikeska ,  Carmine Torardi ,  Paul Douglas Vernooy

发明人： Alan Frederick Carroll ,  Kenneth Warren Hang ,  Brian J. Laughlin ,  Kurt Richard Mikeska ,  Carmine Torardi ,  Paul Douglas Vernooy

IPC分类号： H01L31/00 ,  H01L21/44 ,  H01B1/02 ,  H01B1/22 ,  H01L31/0224 ,  B22F1/00 ,  B22F7/04 ,  B22F7/08 ,  C03C8/10 ,  C03C8/12 ,  C04B35/01 ,  H01B1/16 ,  H01L31/18 ,  H01L31/0264

CPC分类号： H01L31/022425 ,  B22F1/0059 ,  B22F1/007 ,  B22F7/04 ,  B22F7/08 ,  B22F2007/047 ,  C03C8/10 ,  C03C8/12 ,  C04B35/01 ,  H01B1/16 ,  H01B1/22 ,  H01L31/0264 ,  H01L31/1884 ,  H01L2924/0002 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00

摘要： The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal, and a lead-tellurium-lithium-titanium-oxide dispersed in an organic medium.

摘要翻译： 本发明提供一种用于印刷具有一个或多个绝缘层的太阳能电池装置的正面的厚膜糊剂。 厚膜糊包含分散在有机介质中的导电金属和铅 - 碲 - 锂 - 二氧化钛。

公开(公告)号：US08415028B2

公开(公告)日：2013-04-09

申请号：US12597270

申请日：2008-02-21

申请人： Chitoshi Mochizuki ,  Takashi Yoshida

发明人： Chitoshi Mochizuki ,  Takashi Yoshida

IPC分类号： B32B15/04 ,  B32B15/18 ,  B05D1/00 ,  B05D3/02

CPC分类号： C22C19/05 ,  B22F7/04 ,  B22F2007/047 ,  B23K35/004 ,  B23K35/0244 ,  B23K35/3033 ,  B23K35/304 ,  B32B15/013 ,  C23C24/02 ,  C23C24/06 ,  C23C24/103 ,  Y10T428/12063 ,  Y10T428/12944 ,  Y10T428/12979

摘要： A method of producing a clad sheet formed by joining a clad layer at least containing nickel, chromium, silicon, and phosphorus to a base material made of a stainless steel or a nickel-based alloy. A step of forming the clad layer includes contact-bonding a mixed powder to the base material, wherein an alloy powder that contains at least one selected from chromium, silicon, and phosphorus as components, and a nickel powder that functions as a binder to have the alloy powder be contact bonded to the base material are mixed in the mixed powder.

摘要翻译： 一种通过将至少含有镍，铬，硅和磷的包覆层接合到由不锈钢或镍基合金制成的基材而形成的复合板的方法。 形成包层的步骤包括将混合粉末与基材接触粘合，其中含有选自铬，硅和磷中的至少一种作为组分的合金粉末和用作粘合剂的镍粉末具有 将与基材接触的合金粉末混合在混合粉末中。