公开(公告)号：US10037949B1

公开(公告)日：2018-07-31

申请号：US15447831

申请日：2017-03-02

申请人： Amkor Technology, Inc.

发明人： Hee Sung Kim ,  Yeoung Beom Ko ,  Dae Byoung Kang ,  Jae Jin Lee ,  Joon Dong Kim ,  Dong Jean Kim

IPC分类号： H01L23/552 ,  H01L21/78 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/81

摘要： A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.