公开(公告)号：US20190189566A1

公开(公告)日：2019-06-20

申请号：US16197328

申请日：2018-11-20

申请人： Amkor Technology, Inc.

发明人： Hee Sung Kim ,  Yeong Beom Ko ,  Joon Dong Kim ,  Dong Jean Kim ,  Sang Seon Oh

IPC分类号： H01L23/552 ,  H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/78 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/214 ,  H01L2924/3025

摘要： An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

公开(公告)号：US10134687B1

公开(公告)日：2018-11-20

申请号：US15841892

申请日：2017-12-14

申请人： Amkor Technology, Inc.

发明人： Hee Sung Kim ,  Yeong Beom Ko ,  Joon Dong Kim ,  Dong Jean Kim ,  Sang Seon Oh

IPC分类号： H01L23/552 ,  H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/78 ,  H01L23/00 ,  H01L21/56

摘要： An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

公开(公告)号：US10037949B1

公开(公告)日：2018-07-31

申请号：US15447831

申请日：2017-03-02

申请人： Amkor Technology, Inc.

发明人： Hee Sung Kim ,  Yeoung Beom Ko ,  Dae Byoung Kang ,  Jae Jin Lee ,  Joon Dong Kim ,  Dong Jean Kim

IPC分类号： H01L23/552 ,  H01L21/78 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/81

摘要： A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.

公开(公告)号：US10381313B2

公开(公告)日：2019-08-13

申请号：US16197328

申请日：2018-11-20

申请人： Amkor Technology, Inc.

发明人： Hee Sung Kim ,  Yeong Beom Ko ,  Joon Dong Kim ,  Dong Jean Kim ,  Sang Seon Oh

IPC分类号： H01L21/50 ,  H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L21/78 ,  H01L21/48 ,  H01L23/31 ,  H01L23/538

摘要： An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.