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公开(公告)号：US11211728B2
公开(公告)日：2021-12-28
申请号：US16742596
申请日：2020-01-14
申请人： Amphenol Corporation
发明人： Trent K. Do , Paul R. Taylor , Robert W. Brown
IPC分类号： H01R12/88 , H01R43/20 , H01R12/75 , H01R12/59 , H01R12/62 , H01R13/629 , H01R12/71 , H01R12/79 , H01R13/193 , H01R12/52 , H01R13/639 , H01R12/81 , H01R12/53 , H01R12/87 , H01R13/50 , H01R13/627 , H01R12/70 , H01R12/77 , H01R13/52 , H01R9/05
摘要： A cable termination assembly configured for mounting to an interior portion of a printed circuit board. The cable termination assembly has a frame shaped to receive a paddle card to which a plurality of cables are terminated. A lid, when closed, may force the paddle card into contact with an interposer, which in turn may be pressed into a printed circuit board on which the cable termination assembly is mounted. Electrical signals may pass between the cables and traces in the printed circuit board via the paddle card and interposer. The termination assembly may be mounted near a processor or other high speed component on the printed circuit board, enabling high speed signals to be coupled with low loss between a periphery of the printed circuit board, or even a location off the printed circuit board, and the high speed component.
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公开(公告)号：US20240014584A1
公开(公告)日：2024-01-11
申请号：US18348684
申请日：2023-07-07
申请人： Amphenol Corporation
发明人： Paul R. Taylor
CPC分类号： H01R12/714 , H01R13/2435 , H01R43/205
摘要： A low profile interposer with multiple electrical contacts held in a housing. Each electrical contact is disposed within a respective opening of the housing. The electrical contact includes a base, a first beam extending from the base to a distal end of the first beam, a second beam extending from the base to a distal end of the second beam. When the electrical contact is in an uncompressed state, a first portion of the distal end of the first beam and a first portion of the distal end of the second beam are positioned between the top surface and the bottom surface; and a second portion of the distal end of the first beam extends above the top surface and a second portion of the distal end of the second beam extends below the bottom surface.
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公开(公告)号：US20240006784A1
公开(公告)日：2024-01-04
申请号：US18344110
申请日：2023-06-29
申请人： Amphenol Corporation
发明人： Paul R. Taylor
摘要： A low profile interposer with multiple electrical contacts held in a housing via a process, such as heat staking, that deforms portions of the housing into protuberances that lock the electrical contacts within openings of the housing. The contacts may be arranged in multiple parallel columns and may have an elongated dimension that is aligned at an acute angle with respect to the column direction. Distal tips of the contact portions of the electrical contacts may be bent to extend into an opening in the housing, even when the electrical contact is in an uncompressed state.
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公开(公告)号：US20240178592A1
公开(公告)日：2024-05-30
申请号：US18521856
申请日：2023-11-28
申请人： Amphenol Corporation
IPC分类号： H01R12/71 , H01R13/41 , H01R13/6585 , H01R43/16 , H01R43/20
CPC分类号： H01R12/712 , H01R13/41 , H01R13/6585 , H01R43/16 , H01R43/205
摘要： A compact interposer with shields and multiple electrical contacts held in a housing. Each shield is compact, being disposed in a vertical plane perpendicular to the top and bottom surfaces of the housing and between two adjacent electrical contacts respectively on opposing sides of the shield. The shield includes a plurality of shield contacts extending above the top surface and/or below the bottom surface of the housing. During operation, the shield is configured to reduce crosstalk between high-speed signals carried in the electrical contacts on opposing sides of the shield. Optionally, when in a compressed state, the shield contact may be configured to contact the shield body to shunt a distal end of the shield contact. The shield body and shield contacts may be stamped from the same sheet of metal. The shield contacts may have properties that provide reliable operation of the interposer.
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公开(公告)号：US20230156917A1
公开(公告)日：2023-05-18
申请号：US17983107
申请日：2022-11-08
申请人： Amphenol Corporation
发明人： Paul R. Taylor , Jim Hileman , Trent K. Do
IPC分类号： H05K1/11 , H01L23/498
CPC分类号： H05K1/113 , H01L23/49838 , H05K2201/10378 , H05K2201/0311 , H05K2201/10628 , H05K2201/10325
摘要： An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.
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公开(公告)号：US20200227851A1
公开(公告)日：2020-07-16
申请号：US16742596
申请日：2020-01-14
申请人： Amphenol Corporation
发明人： Trent K. Do , Paul R. Taylor , Robert W. Brown
摘要： A cable termination assembly configured for mounting to an interior portion of a printed circuit board. The cable termination assembly has a frame shaped to receive a paddle card to which a plurality of cables are terminated. A lid, when closed, may force the paddle card into contact with an interposer, which in turn may be pressed into a printed circuit board on which the cable termination assembly is mounted. Electrical signals may pass between the cables and traces in the printed circuit board via the paddle card and interposer. The termination assembly may be mounted near a processor or other high speed component on the printed circuit board, enabling high speed signals to be coupled with low loss between a periphery of the printed circuit board, or even a location off the printed circuit board, and the high speed component.
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公开(公告)号：US20230140379A1
公开(公告)日：2023-05-04
申请号：US17972388
申请日：2022-10-24
申请人： Amphenol Corporation
发明人： Paul R. Taylor
摘要： An interposer configured for connecting arrays of signal pads on parallel surfaces is described. Contacts of the interposer are configured to provide multiple conductive paths. A first conductive path extends through the body of the contact. A second conductive path is formed in parallel to the first conductive path when the contact is compressed between opposed substrates. The contact includes an intermediate portion, a rigid portion laterally extending from the intermediate portion, and a pair of compliant arms extending from the intermediate portion in opposite directions along the mating axis. When the contact is compressed, both arms touch and form an electrical connection with the rigid portion. The presence of the rigid portion allows for a reduction in the length of the beams in tall contacts.
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公开(公告)号：US20220224034A1
公开(公告)日：2022-07-14
申请号：US17559806
申请日：2021-12-22
申请人： Amphenol Corporation
发明人： Trent K. Do , Paul R. Taylor , Robert W. Brown
摘要： A cable termination assembly configured for mounting to an interior portion of a printed circuit board. The cable termination assembly has a frame shaped to receive a paddle card to which a plurality of cables are terminated. A lid, when closed, may force the paddle card into contact with an interposer, which in turn may be pressed into a printed circuit board on which the cable termination assembly is mounted. Electrical signals may pass between the cables and traces in the printed circuit board via the paddle card and interposer. The termination assembly may be mounted near a processor or other high speed component on the printed circuit board, enabling high speed signals to be coupled with low loss between a periphery of the printed circuit board, or even a location off the printed circuit board, and the high speed component.
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公开(公告)号：US20240022011A1
公开(公告)日：2024-01-18
申请号：US18341534
申请日：2023-06-26
申请人： Amphenol Corporation
发明人： Paul R. Taylor , Rodney Grove
CPC分类号： H01R12/85 , G06F1/20 , H05K7/2039
摘要： Compliant lids for processor socket assemblies are described. The compliant lids described herein ensure uniform compression across the contact field notwithstanding the recent trend to continue to increase the physical dimension of the socket and the density of contacts. Compression uniformity can be enhanced by relocating the pressure exerted on the package away from the corners of the package. This can be accomplished by designing the compliant lids to have openings shaped to interrupt the continuous material that would otherwise extend from the corner of the lid to the region where the lid engages the processor. This void of material is shaped so that continual presence of material exists primarily in the region where the force delivery is preferred. Use of such compliant lids can enhance compression uniformity without having to rely on complex curved plates and stepped insulators.
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公开(公告)号：US20200227850A1
公开(公告)日：2020-07-16
申请号：US16742656
申请日：2020-01-14
申请人： Amphenol Corporation
发明人： Trent K. Do , Paul R. Taylor
摘要： A short, high density interposer. The interposer has multiple contacts, with upwards and downwards-facing contact surfaces. Each of the contacts may be formed as a beam stamped from a sheet of metal. Two sheets of metal may be used in forming the interposer. A first sheet may be stamped with upwards facing contacts. A second sheet may be stamped with downwards facing contacts. Bases of the beams on the first sheet may be fused with bases of the beams on the second sheet, creating a conducting path through the interposer, with compliant contacts at each end. The joined contacts may be separated from the sheets from which they are stamped and held together with an insulative base of the interposer. Beams shaped to form contacts in the interposer may be closely spaced when stamped in a sheet of metal and may have a low height.
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