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公开(公告)号:US10204732B2
公开(公告)日:2019-02-12
申请号:US15179741
申请日:2016-06-10
Applicant: Analog Devices Global
Inventor: Patrick J. Murphy , Stephen O'Brien , Sarah Carroll , Bernard P. Stenson , Conor John Mcloughlin , Michal J. Osiak
IPC: H01F5/00 , H01F27/28 , H01L33/44 , H01L33/62 , H01B3/12 , H01B3/30 , H01B17/62 , H01B19/04 , H01F41/04
Abstract: An isolator device is provided comprising a body of first dielectric material between the first and second conductors, such as primary and secondary coils of a micro-transformer. A region of second dielectric material is provided between the body of first dielectric material and at least one of the first and second electrodes, wherein the second dielectric material has a higher relative permittivity than the first dielectric material. This provides enhances ability to withstand the Electric fields generated at the edge of a conductor. The body of the first dielectric can be tapered to provide stress relief to prevent the second dielectric material developing stress cracks.
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公开(公告)号:US20170117602A1
公开(公告)日:2017-04-27
申请号:US14922037
申请日:2015-10-23
Applicant: Analog Devices Global
Inventor: Conor John McLoughlin , Michael John Flynn , Laurence B. O'Sullivan , Shane Geary , Stephen O'Brien , Bernard P. Stenson , Baoxing Chen , Sarah Carroll , Michael Morrissey , Patrick M. McGuinness
CPC classification number: H01P1/36 , H01L2224/48137 , H01P5/187
Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.
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公开(公告)号:US20190148229A1
公开(公告)日:2019-05-16
申请号:US15810836
申请日:2017-11-13
Applicant: Analog Devices Global Unlimited Company
Inventor: Jan Kubik , Bernard P. Stenson , Michael Noel Morrissey
IPC: H01L21/768 , H01L49/02 , H01L21/288 , H01L21/033 , H01L23/522
Abstract: The disclosed technology generally relates to forming metallization structures for integrated circuit devices by plating, and more particularly to plating metallization structures that are thicker than masking layers used to define the metallization structures. In one aspect, a method of metallizing an integrated circuit device includes plating a first metal on a substrate in a first opening formed through a first masking layer, where the first opening defines a first region of the substrate, and plating a second metal on the substrate in a second opening formed through a second masking layer, where the second opening defines a second region of the substrate. The second opening is wider than the first opening and the second region encompasses the first region of the substrate.
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公开(公告)号:US10283582B2
公开(公告)日:2019-05-07
申请号:US13776545
申请日:2013-02-25
Applicant: ANALOG DEVICES GLOBAL
Inventor: Bernard P. Stenson , Michael Morrissey , Seamus A. Lynch
Abstract: A microelectronic circuit having at least one component adjacent a carrier that is not a semiconductor or sapphire. The circuit includes a component bearing stack of one or more layers having one or more passive components, which are adjacent or bonded to the carrier. In certain embodiments, the circuit also includes an etch stop layer of a material having a slower etch rate than silicon and a bond layer bonding the carrier and the component bearing one or more layers.
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公开(公告)号:US09748048B2
公开(公告)日:2017-08-29
申请号:US14262188
申请日:2014-04-25
Applicant: Analog Devices Global
Inventor: Padraig L. Fitzgerald , Jo-ey Wong , Raymond C. Goggin , Bernard P. Stenson , Paul Lambkin , Mark Schirmer
CPC classification number: H01H1/0036 , H01H59/0009 , H01H2001/0084 , H01H2059/0018 , H01H2059/0072
Abstract: Several features are disclosed that improve the operating performance of MEMS switches such that they exhibit improved in-service life and better control over switching on and off.
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公开(公告)号:US20180040941A1
公开(公告)日:2018-02-08
申请号:US15226438
申请日:2016-08-02
Applicant: Analog Devices Global
Inventor: Check F. Lee , Bernard P. Stenson , Baoxing Chen
CPC classification number: H01Q1/243 , H01L2224/73265 , H01Q1/38 , H01Q1/48 , H01Q9/065 , H01Q13/02 , H01Q13/06 , H01Q15/14 , H01Q19/30 , H04B5/005
Abstract: Radio frequency (RF) isolators are described, coupling circuit domains operating at different voltages. The RF isolator may include a transmitter which emits a directional signal toward a receiver. Layers of materials having different dielectric constants may be arranged to confine the emission along a path to the receiver. The emitter may be an antenna having an aperture facing the receiver.
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公开(公告)号:US20150325393A1
公开(公告)日:2015-11-12
申请号:US14667022
申请日:2015-03-24
Applicant: Analog Devices Global
Inventor: Bernard P. Stenson , Darren R. Lee , Padraig L. Fitzgerald , Michael Morrissey
CPC classification number: H01H59/0009 , B81C1/00261 , H01H1/0036
Abstract: A micromachined switch has a cavity with an atmosphere configured to reduce sparking between switch contacts during opening and closing operations.
Abstract translation: 微机械加工的开关具有空腔,其配置为在打开和关闭操作期间减少开关触点之间的火花。
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公开(公告)号:US09941565B2
公开(公告)日:2018-04-10
申请号:US14922037
申请日:2015-10-23
Applicant: Analog Devices Global
Inventor: Conor John McLoughlin , Michael John Flynn , Laurence B. O'Sullivan , Shane Geary , Stephen O'Brien , Bernard P. Stenson , Baoxing Chen , Sarah Carroll , Michael Morrissey , Patrick M. McGuinness
CPC classification number: H01P1/36 , H01L2224/48137 , H01P5/187
Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.
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公开(公告)号:US20170117084A1
公开(公告)日:2017-04-27
申请号:US15179741
申请日:2016-06-10
Applicant: Analog Devices Global
Inventor: Patrick J. Murphy , Stephen O'Brien , Sarah Carroll , Bernard P. Stenson , Conor John Mcloughlin , Michal J. Osiak
CPC classification number: H01F27/2804 , H01B3/12 , H01B3/306 , H01B17/62 , H01B19/04 , H01F5/00 , H01F41/041 , H01L33/44 , H01L33/62
Abstract: An isolator device is provided comprising a body of first dielectric material between the first and second conductors, such as primary and secondary coils of a micro-transformer. A region of second dielectric material is provided between the body of first dielectric material and at least one of the first and second electrodes, wherein the second dielectric material has a higher relative permittivity than the first dielectric material. This provides enhances ability to withstand the Electric fields generated at the edge of a conductor. The body of the first dielectric can be tapered to provide stress relief to prevent the second dielectric material developing stress cracks.
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公开(公告)号:US09583294B2
公开(公告)日:2017-02-28
申请号:US14278362
申请日:2014-05-15
Applicant: Analog Devices Global
Inventor: Check F. Lee , Raymond C. Goggin , Padraig L. Fitzgerald , Bernard P. Stenson , Mark Schirmer , Jo-ey Wong
CPC classification number: H01H59/0009 , B81B7/007 , B81C1/00341 , H01H1/0036 , H01H2001/0084
Abstract: A MEMS switch has a base formed from a substrate with a top surface and an insulator layer formed on at least a portion of the top surface. Bonding material secures a cap to the base to form an interior chamber. The cap effectively forms an exterior region of the base that is exterior to the interior chamber. The MEMS switch also has a movable member (in the interior chamber) having a member contact portion, an internal contact (also in the interior chamber), and an exterior contact at the exterior region of the base. The contact portion of the movable member is configured to alternatively contact the interior contact. A conductor at least partially within the insulator layer electrically connects the interior contact and the exterior contact. The conductor is spaced from and electrically isolated from the bonding material securing the cap to the base.
Abstract translation: MEMS开关具有由具有顶表面的基底和形成在顶表面的至少一部分上的绝缘体形成的基底。 接合材料将盖固定到基部以形成内部室。 盖子有效地形成在内部室外部的基部的外部区域。 MEMS开关还具有可移动构件(在内部室中),其具有构件接触部分,内部接触件(也在内部腔室中)以及在基部的外部区域处的外部接触件。 可动构件的接触部分构造成交替地接触内部触点。 至少部分地在绝缘体层内的导体电连接内部触点和外部触点。 导体与将盖固定到基座的接合材料间隔开并与之电隔离。
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