公开(公告)号：US20180062071A1

公开(公告)日：2018-03-01

申请号：US15681904

申请日：2017-08-21

Applicant: Analog Devices Global

Inventor： David Frank Bolognia ,  Christopher W. Hyde ,  Jochen Schmitt ,  Vikram Venkatadri

IPC: H01L43/02 ,  H01L23/538 ,  H01L25/04 ,  H01L23/31 ,  H01L43/08 ,  H01L25/16 ,  G01R33/09 ,  G01R33/00 ,  A61B5/00 ,  A61B5/06

CPC classification number: H01L43/02 ,  A61B5/062 ,  A61B5/063 ,  A61B5/6852 ,  A61B2017/00526 ,  A61B2034/2048 ,  A61B2034/2051 ,  A61B2090/064 ,  A61B2090/397 ,  G01R33/0047 ,  G01R33/091 ,  H01L23/3121 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/04 ,  H01L25/16 ,  H01L43/08

Abstract: An integrated device package sized and shaped to fit in a small space, such as within a body lumen or cavity of a human patient, is disclosed. The integrated device package includes a package substrate and integrated device dies. The first and second integrated device dies are angled relative to one another about the longitudinal axis by a fixed non-parallel angle.