公开(公告)号：US09360620B2

公开(公告)日：2016-06-07

申请号：US13597711

申请日：2012-08-29

申请人： Anand Ramaswamy ,  Jonathan E. Roth ,  Erik Norberg ,  Brian Koch

发明人： Anand Ramaswamy ,  Jonathan E. Roth ,  Erik Norberg ,  Brian Koch

IPC分类号： G02B6/12 ,  G02B6/42

CPC分类号： G02B6/122 ,  G02B6/12004 ,  G02B6/13 ,  G02B6/4269 ,  G02B2006/12061 ,  G02B2006/12135

摘要： Embodiments of the invention describe apparatuses, systems, and methods of thermal management for photonic integrated circuits (PICs). Embodiments include a first device and a second device comprising including waveguides, wherein the first and second devices have different thermal operating conditions. A first region is adjacent to a waveguide of the first device, wherein its optical mode is to be substantially confined by the first region, and wherein the first region has a first thermal conductivity to dissipate heat based on the thermal operating condition of the first device. A second region is adjacent to a waveguide of the second device, wherein its optical mode is to be substantially confined by the second region, and wherein the second region has a second thermal conductivity to dissipate heat based on the thermal operating condition of the second device. In some embodiments, thermal cross talk is reduced without significantly affecting optical performance.

摘要翻译： 本发明的实施例描述了用于光子集成电路（PIC）的热管理的装置，系统和方法。 实施例包括第一装置和包括波导的第二装置，其中第一和第二装置具有不同的热操作条件。 第一区域与第一器件的波导相邻，其中其光学模式基本上被第一区域限制，并且其中第一区域具有第一导热性，以便基于第一器件的热操作条件来散热 。 第二区域与第二装置的波导相邻，其中其光学模式基本上被第二区域限制，并且其中第二区域具有第二导热性，以便基于第二装置的热操作条件来散热 。 在一些实施例中，减少热串扰而不显着影响光学性能。

公开(公告)号：US20170205577A1

公开(公告)日：2017-07-20

申请号：US15478715

申请日：2017-04-04

申请人： Anand Ramaswamy ,  Jonathan Edgar Roth ,  Erik Norberg ,  Brian Koch

发明人： Anand Ramaswamy ,  Jonathan Edgar Roth ,  Erik Norberg ,  Brian Koch

IPC分类号： G02B6/122 ,  G02B6/42 ,  G02B6/13

CPC分类号： G02B6/122 ,  G02B6/12004 ,  G02B6/13 ,  G02B6/4269 ,  G02B2006/12061 ,  G02B2006/12135

摘要： Embodiments of the invention describe apparatuses, systems, and methods of thermal management for photonic integrated circuits (PICs). Embodiments include a first device and a second device comprising including waveguides, wherein the first and second devices have different thermal operating conditions. A first region is adjacent to a waveguide of the first device, wherein its optical mode is to be substantially confined by the first region, and wherein the first region has a first thermal conductivity to dissipate heat based on the thermal operating condition of the first device. A second region is adjacent to a waveguide of the second device, wherein its optical mode is to be substantially confined by the second region, and wherein the second region has a second thermal conductivity to dissipate heat based on the thermal operating condition of the second device. In some embodiments, thermal cross talk is reduced without significantly affecting optical performance.

公开(公告)号：US20140064658A1

公开(公告)日：2014-03-06

申请号：US13597711

申请日：2012-08-29

申请人： ANAND RAMASWAMY ,  Jonathane E. Roth ,  Erik Norberg ,  Brian Koch

发明人： ANAND RAMASWAMY ,  Jonathane E. Roth ,  Erik Norberg ,  Brian Koch

IPC分类号： G02B6/12 ,  G02B6/136 ,  H01L21/02 ,  G02B6/132

CPC分类号： G02B6/122 ,  G02B6/12004 ,  G02B6/13 ,  G02B6/4269 ,  G02B2006/12061 ,  G02B2006/12135

摘要： Embodiments of the invention describe apparatuses, systems, and methods of thermal management for photonic integrated circuits (PICs). Embodiments include a first device and a second device comprising including waveguides, wherein the first and second devices have different thermal operating conditions. A first region is adjacent to a waveguide of the first device, wherein its optical mode is to be substantially confined by the first region, and wherein the first region has a first thermal conductivity to dissipate heat based on the thermal operating condition of the first device. A second region is adjacent to a waveguide of the second device, wherein its optical mode is to be substantially confined by the second region, and wherein the second region has a second thermal conductivity to dissipate heat based on the thermal operating condition of the second device. In some embodiments, thermal cross talk is reduced without significantly affecting optical performance.

摘要翻译： 本发明的实施例描述了用于光子集成电路（PIC）的热管理的装置，系统和方法。 实施例包括第一装置和包括波导的第二装置，其中第一和第二装置具有不同的热操作条件。 第一区域与第一器件的波导相邻，其中其光学模式基本上被第一区域限制，并且其中第一区域具有第一导热性，以便基于第一器件的热操作条件来散热 。 第二区域与第二装置的波导相邻，其中其光学模式基本上被第二区域限制，并且其中第二区域具有第二导热性，以便基于第二装置的热操作条件来散热 。 在一些实施例中，减少热串扰而不显着影响光学性能。

公开(公告)号：US09509122B1

公开(公告)日：2016-11-29

申请号：US13597701

申请日：2012-08-29

申请人： Erik Norberg ,  Anand Ramaswamy ,  Brian Koch

发明人： Erik Norberg ,  Anand Ramaswamy ,  Brian Koch

IPC分类号： H01L31/0328 ,  H01S5/32

CPC分类号： H01L31/0304 ,  H01L31/02327 ,  H01L31/0328 ,  H01L31/109 ,  H01S5/021 ,  H01S5/02461 ,  H01S5/026 ,  H01S5/1032 ,  H01S5/3211 ,  H01S5/3213 ,  Y02E10/544

摘要： Embodiments of the invention describe apparatuses, optical systems, and methods related to utilizing optical cladding layers. According to one embodiment, a hybrid optical device includes a silicon semiconductor layer and a III-V semiconductor layer having an overlapping region, wherein a majority of a field of an optical mode in the overlapping region is to be contained in the III-V semiconductor layer. A cladding region between the silicon semiconductor layer and the III-V semiconductor layer has a spatial property to substantially confine the optical mode to the III-V semiconductor layer and enable heat dissipation through the silicon semiconductor layer.

摘要翻译： 本发明的实施例描述了与使用光学包层相关的装置，光学系统和方法。 根据一个实施例，混合光学器件包括硅半导体层和具有重叠区域的III-V半导体层，其中重叠区域中的光学模式的大部分场域将包含在III-V半导体中 层。 硅半导体层和III-V半导体层之间的包层区域具有空间特性，以将光学模式基本上限制于III-V半导体层，并且能够通过硅半导体层进行散热。

公开(公告)号：US20140254978A1

公开(公告)日：2014-09-11

申请号：US13789440

申请日：2013-03-07

申请人： Brian Koch ,  Erik Norberg ,  Alexander W. Fang ,  Jae Shin ,  Gregory Alan Fish

发明人： Brian Koch ,  Erik Norberg ,  Alexander W. Fang ,  Jae Shin ,  Gregory Alan Fish

IPC分类号： H01L21/822 ,  G02B6/13

CPC分类号： G02B6/13 ,  G02B6/12 ,  G02B6/12004 ,  G02F1/0018 ,  G02F2001/212 ,  H01L21/822

摘要： Embodiments of the invention describe photonic integrated circuits (PICs) formed using simultaneous fabrication operations performed on photonic device layers. Each device of a PIC may be made from different optimized materials by growing the materials separately, cutting pieces of the different materials and bonding these pieces to a shared wafer. Embodiments of the invention bond photonic device layers so that shared (i.e., common) processing operations may be utilized to make more than one device simultaneously. Embodiments of the invention allow for simpler, more cost effective fabrication of PICs and improve photonic device performance and reliability.

摘要翻译： 本发明的实施例描述了使用在光子器件层上执行的同时制造操作形成的光子集成电路（PIC）。 PIC的每个装置可以通过分别生长材料而不同的优化材料制成，切割不同材料的片并将这些片粘合到共享的晶片上。 本发明的实施例将光子器件层结合起来，使得可以利用共享的（即共同的）处理操作来同时制造多个器件。 本发明的实施例允许PIC的更简单，更经济有效的制造并且提高光子器件的性能和可靠性。

公开(公告)号：US20170075149A1

公开(公告)日：2017-03-16

申请号：US15363046

申请日：2016-11-29

申请人： Robert Silvio Guzzon ,  Erik Norberg ,  Jonathan Edgar Roth

发明人： Robert Silvio Guzzon ,  Erik Norberg ,  Jonathan Edgar Roth

IPC分类号： G02F1/025 ,  G02F1/01

CPC分类号： G02F1/025 ,  G02F1/0063 ,  G02F1/011 ,  G02F1/0147 ,  G02F2001/0155 ,  G02F2001/212

摘要： Described herein are methods, systems, and apparatuses to utilize an electro-optic modulator including one or more heating elements. The modulator can utilize one or more heating elements to control an absorption or phase shift of the modulated optical signal. At least the active region of the modulator and the one or more heating elements of the modulator are included in a thermal isolation region comprising a low thermal conductivity to thermally isolate the active region and the one or more heating elements from a substrate of the PIC.

摘要翻译： 这里描述了利用包括一个或多个加热元件的电光调制器的方法，系统和装置。 调制器可利用一个或多个加热元件来控制调制光信号的吸收或相移。 至少调制器的有源区域和调制器的一个或多个加热元件被包括在包括低热导率的热隔离区域中，以将活性区域和一个或多个加热元件与PIC的衬底热隔离。