公开(公告)号：US20140064658A1

公开(公告)日：2014-03-06

申请号：US13597711

申请日：2012-08-29

申请人： ANAND RAMASWAMY ,  Jonathane E. Roth ,  Erik Norberg ,  Brian Koch

发明人： ANAND RAMASWAMY ,  Jonathane E. Roth ,  Erik Norberg ,  Brian Koch

IPC分类号： G02B6/12 ,  G02B6/136 ,  H01L21/02 ,  G02B6/132

CPC分类号： G02B6/122 ,  G02B6/12004 ,  G02B6/13 ,  G02B6/4269 ,  G02B2006/12061 ,  G02B2006/12135

摘要： Embodiments of the invention describe apparatuses, systems, and methods of thermal management for photonic integrated circuits (PICs). Embodiments include a first device and a second device comprising including waveguides, wherein the first and second devices have different thermal operating conditions. A first region is adjacent to a waveguide of the first device, wherein its optical mode is to be substantially confined by the first region, and wherein the first region has a first thermal conductivity to dissipate heat based on the thermal operating condition of the first device. A second region is adjacent to a waveguide of the second device, wherein its optical mode is to be substantially confined by the second region, and wherein the second region has a second thermal conductivity to dissipate heat based on the thermal operating condition of the second device. In some embodiments, thermal cross talk is reduced without significantly affecting optical performance.

摘要翻译： 本发明的实施例描述了用于光子集成电路（PIC）的热管理的装置，系统和方法。 实施例包括第一装置和包括波导的第二装置，其中第一和第二装置具有不同的热操作条件。 第一区域与第一器件的波导相邻，其中其光学模式基本上被第一区域限制，并且其中第一区域具有第一导热性，以便基于第一器件的热操作条件来散热 。 第二区域与第二装置的波导相邻，其中其光学模式基本上被第二区域限制，并且其中第二区域具有第二导热性，以便基于第二装置的热操作条件来散热 。 在一些实施例中，减少热串扰而不显着影响光学性能。

公开(公告)号：US09509122B1

公开(公告)日：2016-11-29

申请号：US13597701

申请日：2012-08-29

申请人： Erik Norberg ,  Anand Ramaswamy ,  Brian Koch

发明人： Erik Norberg ,  Anand Ramaswamy ,  Brian Koch

IPC分类号： H01L31/0328 ,  H01S5/32

CPC分类号： H01L31/0304 ,  H01L31/02327 ,  H01L31/0328 ,  H01L31/109 ,  H01S5/021 ,  H01S5/02461 ,  H01S5/026 ,  H01S5/1032 ,  H01S5/3211 ,  H01S5/3213 ,  Y02E10/544

摘要： Embodiments of the invention describe apparatuses, optical systems, and methods related to utilizing optical cladding layers. According to one embodiment, a hybrid optical device includes a silicon semiconductor layer and a III-V semiconductor layer having an overlapping region, wherein a majority of a field of an optical mode in the overlapping region is to be contained in the III-V semiconductor layer. A cladding region between the silicon semiconductor layer and the III-V semiconductor layer has a spatial property to substantially confine the optical mode to the III-V semiconductor layer and enable heat dissipation through the silicon semiconductor layer.

摘要翻译： 本发明的实施例描述了与使用光学包层相关的装置，光学系统和方法。 根据一个实施例，混合光学器件包括硅半导体层和具有重叠区域的III-V半导体层，其中重叠区域中的光学模式的大部分场域将包含在III-V半导体中 层。 硅半导体层和III-V半导体层之间的包层区域具有空间特性，以将光学模式基本上限制于III-V半导体层，并且能够通过硅半导体层进行散热。

公开(公告)号：US20170205577A1

公开(公告)日：2017-07-20

申请号：US15478715

申请日：2017-04-04

申请人： Anand Ramaswamy ,  Jonathan Edgar Roth ,  Erik Norberg ,  Brian Koch

发明人： Anand Ramaswamy ,  Jonathan Edgar Roth ,  Erik Norberg ,  Brian Koch

IPC分类号： G02B6/122 ,  G02B6/42 ,  G02B6/13

CPC分类号： G02B6/122 ,  G02B6/12004 ,  G02B6/13 ,  G02B6/4269 ,  G02B2006/12061 ,  G02B2006/12135

摘要： Embodiments of the invention describe apparatuses, systems, and methods of thermal management for photonic integrated circuits (PICs). Embodiments include a first device and a second device comprising including waveguides, wherein the first and second devices have different thermal operating conditions. A first region is adjacent to a waveguide of the first device, wherein its optical mode is to be substantially confined by the first region, and wherein the first region has a first thermal conductivity to dissipate heat based on the thermal operating condition of the first device. A second region is adjacent to a waveguide of the second device, wherein its optical mode is to be substantially confined by the second region, and wherein the second region has a second thermal conductivity to dissipate heat based on the thermal operating condition of the second device. In some embodiments, thermal cross talk is reduced without significantly affecting optical performance.

公开(公告)号：US09360620B2

公开(公告)日：2016-06-07

申请号：US13597711

申请日：2012-08-29

申请人： Anand Ramaswamy ,  Jonathan E. Roth ,  Erik Norberg ,  Brian Koch

发明人： Anand Ramaswamy ,  Jonathan E. Roth ,  Erik Norberg ,  Brian Koch

IPC分类号： G02B6/12 ,  G02B6/42

CPC分类号： G02B6/122 ,  G02B6/12004 ,  G02B6/13 ,  G02B6/4269 ,  G02B2006/12061 ,  G02B2006/12135

摘要： Embodiments of the invention describe apparatuses, systems, and methods of thermal management for photonic integrated circuits (PICs). Embodiments include a first device and a second device comprising including waveguides, wherein the first and second devices have different thermal operating conditions. A first region is adjacent to a waveguide of the first device, wherein its optical mode is to be substantially confined by the first region, and wherein the first region has a first thermal conductivity to dissipate heat based on the thermal operating condition of the first device. A second region is adjacent to a waveguide of the second device, wherein its optical mode is to be substantially confined by the second region, and wherein the second region has a second thermal conductivity to dissipate heat based on the thermal operating condition of the second device. In some embodiments, thermal cross talk is reduced without significantly affecting optical performance.

摘要翻译： 本发明的实施例描述了用于光子集成电路（PIC）的热管理的装置，系统和方法。 实施例包括第一装置和包括波导的第二装置，其中第一和第二装置具有不同的热操作条件。 第一区域与第一器件的波导相邻，其中其光学模式基本上被第一区域限制，并且其中第一区域具有第一导热性，以便基于第一器件的热操作条件来散热 。 第二区域与第二装置的波导相邻，其中其光学模式基本上被第二区域限制，并且其中第二区域具有第二导热性，以便基于第二装置的热操作条件来散热 。 在一些实施例中，减少热串扰而不显着影响光学性能。

公开(公告)号：US20140254978A1

公开(公告)日：2014-09-11

申请号：US13789440

申请日：2013-03-07

申请人： Brian Koch ,  Erik Norberg ,  Alexander W. Fang ,  Jae Shin ,  Gregory Alan Fish

发明人： Brian Koch ,  Erik Norberg ,  Alexander W. Fang ,  Jae Shin ,  Gregory Alan Fish

IPC分类号： H01L21/822 ,  G02B6/13

CPC分类号： G02B6/13 ,  G02B6/12 ,  G02B6/12004 ,  G02F1/0018 ,  G02F2001/212 ,  H01L21/822

摘要： Embodiments of the invention describe photonic integrated circuits (PICs) formed using simultaneous fabrication operations performed on photonic device layers. Each device of a PIC may be made from different optimized materials by growing the materials separately, cutting pieces of the different materials and bonding these pieces to a shared wafer. Embodiments of the invention bond photonic device layers so that shared (i.e., common) processing operations may be utilized to make more than one device simultaneously. Embodiments of the invention allow for simpler, more cost effective fabrication of PICs and improve photonic device performance and reliability.

摘要翻译： 本发明的实施例描述了使用在光子器件层上执行的同时制造操作形成的光子集成电路（PIC）。 PIC的每个装置可以通过分别生长材料而不同的优化材料制成，切割不同材料的片并将这些片粘合到共享的晶片上。 本发明的实施例将光子器件层结合起来，使得可以利用共享的（即共同的）处理操作来同时制造多个器件。 本发明的实施例允许PIC的更简单，更经济有效的制造并且提高光子器件的性能和可靠性。

公开(公告)号：US20170077325A1

公开(公告)日：2017-03-16

申请号：US15361865

申请日：2016-11-28

申请人： Erik Johan Norberg ,  Anand Ramaswamy ,  Brian Koch

发明人： Erik Johan Norberg ,  Anand Ramaswamy ,  Brian Koch

IPC分类号： H01L31/0304 ,  H01L31/0232

CPC分类号： H01L31/0304 ,  H01L31/02327 ,  H01L31/0328 ,  H01L31/109 ,  H01S5/021 ,  H01S5/02461 ,  H01S5/026 ,  H01S5/1032 ,  H01S5/3211 ,  H01S5/3213 ,  Y02E10/544

摘要： Embodiments of the invention describe apparatuses, optical systems, and methods related to utilizing optical cladding layers. According to one embodiment, a hybrid optical device includes a silicon semiconductor layer and a III-V semiconductor layer having an overlapping region, wherein a majority of a field of an optical mode in the overlapping region is to be contained in the III-V semiconductor layer. A cladding region between the silicon semiconductor layer and the III-V semiconductor layer has a spatial property to substantially confine the optical mode to the III-V semiconductor layer and enable heat dissipation through the silicon semiconductor layer.

摘要翻译： 本发明的实施例描述了与使用光学包层相关的装置，光学系统和方法。 根据一个实施例，混合光学器件包括硅半导体层和具有重叠区域的III-V半导体层，其中重叠区域中的光学模式的大部分场域将包含在III-V半导体中 层。 硅半导体层和III-V半导体层之间的包层区域具有空间特性，以将光学模式基本上限制于III-V半导体层，并且能够通过硅半导体层进行散热。

公开(公告)号：US09525490B2

公开(公告)日：2016-12-20

申请号：US13559400

申请日：2012-07-26

申请人： Brian Koch ,  Daniel Sparacin ,  Alexander Fang

发明人： Brian Koch ,  Daniel Sparacin ,  Alexander Fang

IPC分类号： H04B10/00 ,  H04B10/50 ,  H04B10/564 ,  H04Q11/00 ,  H04J14/00 ,  H04J14/02

CPC分类号： H04B10/503 ,  H04B10/506 ,  H04B10/564 ,  H04J14/00 ,  H04J14/0212 ,  H04J14/0257 ,  H04J14/0267 ,  H04Q11/0005 ,  H04Q2011/0022 ,  H04Q2011/0032 ,  H04Q2011/0039

摘要： Embodiments of the invention describe apparatuses, optical systems, and methods for utilizing a dynamically reconfigurable optical transmitter. A laser array outputs a plurality of laser signals (which may further be modulated based on electrical signals), each of the plurality of laser signals having a wavelength, wherein the wavelength of each of the plurality of laser signals is tunable based on other electrical signals. An optical router receives the plurality of (modulated) laser signals at input ports and outputs the plurality of received (modulated) laser signals to one or more output ports based on the tuned wavelength of each of the plurality of received laser signals. This reconfigurable transmitter enables dynamic bandwidth allocation for multiple destinations via the tuning of the laser wavelengths.

摘要翻译： 本发明的实施例描述了用于利用动态可重新配置的光发射机的装置，光学系统和方法。 激光器阵列输出多个激光信号（其可以进一步基于电信号进行调制），所述多个激光信号中的每一个具有波长，其中，所述多个激光信号中的每一个的波长可基于其他电信号 。 光路由器在输入端口处接收多个（调制）激光信号，并且基于多个接收的激光信号中的每一个的调谐波长将多个接收的（调制的）激光信号输出到一个或多个输出端口。 该可重新配置的发射器通过调谐激光波长来实现多个目的地的动态带宽分配。

公开(公告)号：US20100221115A1

公开(公告)日：2010-09-02

申请号：US12394588

申请日：2009-02-27

申请人： Brian Jardine ,  Brian Koch ,  Jeff Guymon ,  Craig White

发明人： Brian Jardine ,  Brian Koch ,  Jeff Guymon ,  Craig White

IPC分类号： F01D5/30

CPC分类号： F01D9/047 ,  F01D9/065 ,  F01D21/02 ,  F01D21/045 ,  F05D2230/80 ,  F05D2270/09 ,  F05D2270/304

摘要： A retention structure includes a center body including an outer surface, an enclosed end, an open end, and a contact section, the outer surface adapted to define a first portion of a flowpath, and the contact section extending radially outwardly from a centerline and located on the enclosed end and configured to reduce a radial and a torsional component of a first load that exceeds a first threshold applied to the contact section, when the turbine rotates and applies the first load to the contact section and an energy absorber coupled to the center body, disposed adjacent to the contact section, and having an outer surface adapted to define a second portion of the flowpath, the energy absorber further adapted to collapse, when the turbine rotates and contacts the energy absorber and applies a second load that exceeds a second threshold to the energy absorber.

摘要翻译： 保持结构包括包括外表面，封闭端，开口端和接触部分的中心体，所述外表面适于限定流路的第一部分，并且所述接触部分从中心线径向向外延伸并且定位 并且构造成当涡轮机旋转并且将第一负载施加到接触部分并且耦合到中心的能量吸收器时，减小超过施加到接触部分的第一阈值的第一负载的径向和扭转分量 本体，邻近接触部分设置，并且具有适于限定流路的第二部分的外表面，所述能量吸收器还适于在涡轮旋转并接触能量吸收器并施加超过第二部分的第二负载时折叠 能量吸收器的阈值。

公开(公告)号：US20070029029A1

公开(公告)日：2007-02-08

申请号：US11496610

申请日：2006-07-31

申请人： Brian Koch ,  Gary Burg ,  Scott Ackerman ,  Christopher Dyrlund

发明人： Brian Koch ,  Gary Burg ,  Scott Ackerman ,  Christopher Dyrlund

IPC分类号： B29D30/08

CPC分类号： B29D30/16 ,  B29D30/30 ,  B29D30/60

摘要： A method and apparatus 100 for forming an annular elastomeric tire component has the steps of extruding at least one elastomeric material annularly onto a support surface 60 and shaping the at least one strip 2 of elastomeric material to a predetermined profile by forming the at least one strip 2 of material between a shaping die 84 and the support surface 60 thereby smoothing and spreading the strip to the desired profile. The method may include applying additional strips 2 to form multilayered components. The support surface 60 may be separate from a tire building station 200 or may be integral to a tire building station 200. The formed strips may include any one or more tire components such as a sidewall 20, a chafer 30, a bead apex 10, ply stock coatings 40, an innerliner 50, or a tread 22.

摘要翻译： 用于形成环形弹性体轮胎部件的方法和装置100具有以下步骤：将至少一个弹性体材料环形挤压到支撑表面60上，并将弹性体材料的至少一个带材2成形为预定轮廓，通过形成至少一个条带 2，在成型模具84和支撑表面60之间的材料，从而平滑并将带材铺展到期望的轮廓。 该方法可以包括施加附加条带2以形成多层部件。 支撑表面60可以与轮胎建造工位200分离，或者可以与轮胎建造工位200成一体。 所形成的条可以包括任何一个或多个轮胎部件，例如侧壁20，胎圈包布30，胎圈三角胶10，帘布层涂层40，内衬层50或胎面22。

公开(公告)号：US20160099546A1

公开(公告)日：2016-04-07

申请号：US14870225

申请日：2015-09-30

申请人： Erik Johan Norberg ,  Brian Koch ,  Gregory Alan Fish ,  Hyundai Park ,  Jared Bauters

发明人： Erik Johan Norberg ,  Brian Koch ,  Gregory Alan Fish ,  Hyundai Park ,  Jared Bauters

IPC分类号： H01S5/06 ,  H01S5/10 ,  H01S5/068 ,  G02B6/12 ,  G02B6/293

CPC分类号： H01S5/0612 ,  G02B6/12009 ,  G02B6/29344 ,  G02B6/2938 ,  H01S5/026 ,  H01S5/0261 ,  H01S5/06821 ,  H01S5/14

摘要： Described herein are lasers comprising an output port to output an optical signal, a plurality of waveguide segments forming an optical cavity length, and a resonant optical cavity comprising the optical cavity length, a gain medium included in the resonant optical cavity to amplify the optical signal, and a heating element disposed near at least two of the plurality of waveguide segments, the heating element controllable to adjust the phase of the optical signal by heating the waveguide segments. Described herein are optical devices comprising a first plurality of ports to output a plurality of optical signals, a second plurality of ports to receive the plurality of optical signals, and a plurality of coupling waveguides. The plurality of waveguide may comprise a pair of adjacent waveguides separated by a first distance, each of the pair of adjacent waveguides comprising a different width.

摘要翻译： 这里描述的是包括用于输出光信号的输出端口，形成光腔长度的多个波导段和包括光腔长度的谐振光腔的激光器，包括在谐振光腔中的增益介质，以放大光信号 以及设置在所述多个波导段中的至少两个附近的加热元件，所述加热元件可控制以通过加热所述波导段来调节所述光信号的相位。 这里描述的是包括用于输出多个光信号的第一多个端口，用于接收多个光信号的第二多个端口以及多个耦合波导的光学装置。 多个波导可以包括由第一距离分开的一对相邻波导，该对相邻波导中的每一个包括不同的宽度。