公开(公告)号：US20060152326A1

公开(公告)日：2006-07-13

申请号：US11034323

申请日：2005-01-12

申请人： Andreas Fenner ,  John Anderson ,  Mohsen Askarinya ,  Tina Abnoosi

发明人： Andreas Fenner ,  John Anderson ,  Mohsen Askarinya ,  Tina Abnoosi

IPC分类号： H01F27/28

CPC分类号： H01F27/2804 ,  A61N1/3956 ,  H01F2027/2819

摘要： Method and apparatus are provided for fabricating a planar transformer assembly for use in an implantable medical device. The planar transformer assembly includes a board, a first core, and a second core. The board has a first side, a second side, and an embedded winding, wherein the embedded winding includes a primary winding and a secondary winding and is at least partially embedded in the board between the first and second sides.

摘要翻译： 提供了用于制造用于可植入医疗装置的平面变压器组件的方法和装置。 平面变压器组件包括板，第一芯和第二芯。 该板具有第一面，第二面和嵌入式绕组，其中嵌入式绕组包括初级绕组和次级绕组，并且至少部分地嵌入在第一和第二侧之间的板中。

公开(公告)号：US08084841B2

公开(公告)日：2011-12-27

申请号：US12435831

申请日：2009-05-05

申请人： MarkondeyaRaj Pulugurtha ,  Andreas Fenner ,  Anna Malin ,  Dasharatham Janagama Goud ,  Rao Tummala

发明人： MarkondeyaRaj Pulugurtha ,  Andreas Fenner ,  Anna Malin ,  Dasharatham Janagama Goud ,  Rao Tummala

IPC分类号： H01L21/02 ,  H01G4/005

CPC分类号： H01G4/33 ,  B82Y10/00 ,  H01G4/005 ,  H01G4/236 ,  H01G9/15 ,  H01L23/5223 ,  H01L23/5328 ,  H01L23/642 ,  H01L25/0657 ,  H01L28/84 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2224/0401

摘要： The present invention describes systems and methods for providing high-density capacitors. An exemplary embodiment of the present invention provides a high-density capacitor system comprising a substrate and a porous conductive layer formed on the substrate, wherein the porous conductive layer is formed in accordance with a predetermined pattern. Furthermore, the high-density capacitor system includes a dielectric material formed on the porous conductive layer and a second conductive layer formed on the dielectric material. Additionally, the high-density capacitor system includes a plurality of conductive pads configured in communication with the second conductive layer.

摘要翻译： 本发明描述了用于提供高密度电容器的系统和方法。 本发明的示例性实施例提供了一种高密度电容器系统，其包括基板和形成在基板上的多孔导电层，其中多孔导电层根据预定图案形成。 此外，高密度电容器系统包括形成在多孔导电层上的电介质材料和形成在电介质材料上的第二导电层。 此外，高密度电容器系统包括被配置为与第二导电层连通的多个导电焊盘。

公开(公告)号：US20100284123A1

公开(公告)日：2010-11-11

申请号：US12435971

申请日：2009-05-05

申请人： MarkondeyaRaj Pulugurtha ,  Andreas Fenner ,  Anna Malin ,  Kanika Sethi ,  Himani Sharma ,  Dasharatham Janagama Goud ,  Rao Tummala

发明人： MarkondeyaRaj Pulugurtha ,  Andreas Fenner ,  Anna Malin ,  Kanika Sethi ,  Himani Sharma ,  Dasharatham Janagama Goud ,  Rao Tummala

IPC分类号： H01G2/00 ,  B05D5/12

CPC分类号： H01L27/0805 ,  B82Y10/00 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/33 ,  H01L23/5223 ,  H01L28/84 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/0401

摘要： The present invention describes systems and methods for fabricating high-density capacitors. An exemplary embodiment of the present invention provides a method for fabricating a high-density capacitor system including the steps of providing a substrate and depositing a nanoelectrode particulate paste layer onto the substrate. The method for fabricating a high-density capacitor system further includes sintering the nanoelectrode particulate paste layer to form a bottom electrode. Additionally, the method for fabricating a high-density capacitor system includes depositing a dielectric material onto the bottom electrode with an atomic layer deposition process. Furthermore, the method for fabricating a high-density capacitor system includes depositing a conductive material on the dielectric material to form a top electrode.

摘要翻译： 本发明描述了用于制造高密度电容器的系统和方法。 本发明的一个示例性实施例提供了一种用于制造高密度电容器系统的方法，包括以下步骤：提供衬底并将纳米电极颗粒糊层层沉积到衬底上。 制造高密度电容器系统的方法还包括烧结纳米电极颗粒糊层以形成底电极。 此外，用于制造高密度电容器系统的方法包括用原子层沉积工艺将电介质材料沉积到底部电极上。 此外，制造高密度电容器系统的方法包括在电介质材料上沉积导电材料以形成顶部电极。

公开(公告)号：US20050131482A1

公开(公告)日：2005-06-16

申请号：US10732990

申请日：2003-12-11

申请人： Michael Mattes ,  Ralph Danzl ,  Andreas Fenner ,  Lary Larson

发明人： Michael Mattes ,  Ralph Danzl ,  Andreas Fenner ,  Lary Larson

IPC分类号： A61N1/365 ,  G01P15/08 ,  G01P15/125 ,  A61N1/362

CPC分类号： G01P15/125 ,  A61N1/36542 ,  G01P15/0802 ,  G01P2015/0828

摘要： Methods and apparatus are provided for an accelerometer. The apparatus includes first, second, and third substrates. The first substrate includes the first plate of a first capacitor. The second substrate includes a moveable mass that is coupled to the second substrate by at least one spring. The moveable mass is the second plate of the first capacitor and the first plate of a second capacitor. The third substrate includes the second plate of the second capacitor. The moveable mass is prevented from moving in any direction where the at least one spring is inelastically flexed. The first substrate couples to the second substrate. The third substrate couples to the second substrate. The method includes forming a moveable mass in a substrate. The moveable mass is formed having a plurality of springs coupling the moveable mass to the substrate. The moveable mass is released using a dry etch.

摘要翻译： 为加速度计提供了方法和装置。 该装置包括第一，第二和第三基板。 第一基板包括第一电容器的第一板。 第二基板包括通过至少一个弹簧联接到第二基板的可移动质量块。 可移动质量是第一电容器的第二板和第二电容器的第一板。 第三基板包括第二电容器的第二板。 防止可移动质量块在至少一个弹簧非弹性弯曲的任何方向上移动。 第一衬底耦合到第二衬底。 第三衬底耦合到第二衬底。 该方法包括在基板中形成可移动质量块。 可移动质量体形成有多个弹簧，将弹性体联接到基底上。 使用干蚀刻释放可移动质量。

公开(公告)号：US20210178518A1

公开(公告)日：2021-06-17

申请号：US17118283

申请日：2020-12-10

申请人： David A. Ruben ,  Andreas Fenner ,  Andrew J. Ries ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Mark E. Henschel

发明人： David A. Ruben ,  Andreas Fenner ,  Andrew J. Ries ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Mark E. Henschel

IPC分类号： B23K26/20 ,  H05K5/06 ,  A61N1/39 ,  H01L23/522 ,  B23K26/32

摘要： Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.