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公开(公告)号:US20080141939A1
公开(公告)日:2008-06-19
申请号:US11610075
申请日:2006-12-13
申请人: Andrew Gillard , Anthony Vesci , Keith A. Miller
发明人: Andrew Gillard , Anthony Vesci , Keith A. Miller
IPC分类号: C23C16/513 , H01F41/04 , H01F7/20
CPC分类号: H01J37/3266 , H01F7/128 , H01F7/20 , H01F27/16 , H01J37/32623 , H01J37/3458 , H01J37/347 , Y10T29/4902
摘要: A electromagnet array structure including multiple electromagnetic coils captured in a rigid encapsulant, for example, of cured epoxy resin, to form a unitary free-standing structure which can be placed around the walls of a plasma processing chamber. A liquid cooling coil may also be captured in the encapsulant between the electromagnetic coils. The structure may additionally include water fittings, locating pins, through tubes for chamber bolts, and lifting brackets.
摘要翻译: 一种电磁体阵列结构,其包括捕获在例如固化环氧树脂的刚性密封剂中的多个电磁线圈,以形成可放置在等离子体处理室的壁周围的整体式独立结构。 液体冷却盘管也可以被捕获在电磁线圈之间的密封剂中。 该结构还可以包括水配件,定位销,通过用于室螺栓的管和提升支架。
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公开(公告)号:US07846310B2
公开(公告)日:2010-12-07
申请号:US11610075
申请日:2006-12-13
申请人: Andrew Gillard , Anthony Vesci , Keith A. Miller
发明人: Andrew Gillard , Anthony Vesci , Keith A. Miller
IPC分类号: C23C14/35
CPC分类号: H01J37/3266 , H01F7/128 , H01F7/20 , H01F27/16 , H01J37/32623 , H01J37/3458 , H01J37/347 , Y10T29/4902
摘要: A electromagnet array structure including multiple electromagnetic coils captured in a rigid encapsulant, for example, of cured epoxy resin, to form a unitary free-standing structure which can be placed around the walls of a plasma processing chamber. A liquid cooling coil may also be captured in the encapsulant between the electromagnetic coils. The structure may additionally include water fittings, locating pins, through tubes for chamber bolts, and lifting brackets.
摘要翻译: 一种电磁体阵列结构,其包括捕获在例如固化环氧树脂的刚性密封剂中的多个电磁线圈,以形成可放置在等离子体处理室的壁周围的整体式独立结构。 液体冷却盘管也可以被捕获在电磁线圈之间的密封剂中。 该结构还可以包括水配件,定位销,通过用于室螺栓的管和提升支架。
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公开(公告)号:US07527713B2
公开(公告)日:2009-05-05
申请号:US10950349
申请日:2004-09-23
申请人: Tza-Jing Gung , Mark A. Perrin , Andrew Gillard
发明人: Tza-Jing Gung , Mark A. Perrin , Andrew Gillard
CPC分类号: H01J37/3408 , H01J37/32688
摘要: A quadruple electromagnetic coil array coaxially arranged in a rectangular array about a chamber axis outside the sidewalls of a plasma sputter reactor, preferably in back of an RF coil within the chamber. The coil currents can be separately controlled to produce different magnetic field distributions, for example, between a sputter deposition mode in which the sputter target is powered to sputter target material onto a wafer and a sputter etch mode in which the RF coil supports the gas sputtering the wafer. The coil array may include a tubular magnetic core, particularly useful for suppressing stray fields. A water cooling coil may be wrapped around the coil array to cool all the coils. The electromagnets can be powered in different relative polarities in a multi-step process.
摘要翻译: 一个四重电磁线圈阵列,其围绕室等离子体溅射反应器的侧壁外部的腔室轴线同轴布置,优选地在室内的RF线圈的背面。 可以单独控制线圈电流以产生不同的磁场分布,例如在溅射靶被驱动以将靶材料溅射到晶片上的溅射沉积模式和溅射蚀刻模式之间,其中RF线圈支撑气体溅射 晶圆。 线圈阵列可以包括管状磁芯,特别适用于抑制杂散磁场。 水冷盘管可缠绕在线圈阵列上以冷却所有线圈。 电磁铁可以在多步骤过程中以不同的相对极性供电。
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4.
公开(公告)号:US20050263390A1
公开(公告)日:2005-12-01
申请号:US11119350
申请日:2005-04-29
申请人: Tza-Jing Gung , Xinyu Fu , Arvind Sundarrajan , Edward Hammond , Praburam Gopalraja , John Forster , Mark Perrin , Andrew Gillard
发明人: Tza-Jing Gung , Xinyu Fu , Arvind Sundarrajan , Edward Hammond , Praburam Gopalraja , John Forster , Mark Perrin , Andrew Gillard
IPC分类号: C23C14/04 , C23C14/06 , C23C14/16 , C23C14/32 , C23C14/35 , C23C16/00 , C23F1/02 , C23F4/00 , H01J37/32 , H01J37/34 , H01L21/285 , H01L21/768
CPC分类号: H01J37/3266 , C23C14/046 , C23C14/0641 , C23C14/165 , C23C14/358 , C23F4/00 , H01J37/321 , H01J37/32623 , H01J37/32688 , H01J37/3408 , H01L21/2855 , H01L21/76844 , H01L21/76846 , H01L21/76865
摘要: A multi-step process performed in a plasma sputter chamber including sputter deposition from the target and argon sputter etching of the substrate. The chamber includes a quadruple electromagnetic coil array coaxially arranged in a rectangular array about a chamber axis outside the sidewalls of a plasma sputter reactor in back of an RF coil within the chamber. The coil currents can be separately controlled to produce different magnetic field distributions, for example, between a sputter deposition mode in which the sputter target is powered to sputter target material onto a wafer and a sputter etch mode in which the RF coil supports the argon sputtering plasma. A TaN/Ta barrier is first sputter deposited with high target power and wafer bias. Argon etching is performed with even higher wafer bias. A flash step is applied with reduced target power and wafer bias.
摘要翻译: 在等离子体溅射室中执行的包括从靶的溅射沉积和对衬底的氩溅射蚀刻的多步骤过程。 该腔室包括一个四重电磁线圈阵列,该四极电磁线圈阵列围绕室内RF射频线圈背面的等离子体溅射反应器的侧壁外的腔室轴线同轴地布置。 可以单独控制线圈电流以产生不同的磁场分布,例如在其中溅射靶被驱动以将靶材料溅射到晶片上的溅射沉积模式和其中RF线圈支撑氩溅射的溅射蚀刻模式之间 等离子体。 首先以高目标功率和晶片偏置溅射沉积TaN / Ta势垒。 以更高的晶片偏压进行氩蚀刻。 应用闪光步骤,降低目标功率和晶片偏置。
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公开(公告)号:US20050263389A1
公开(公告)日:2005-12-01
申请号:US10950349
申请日:2004-09-23
申请人: Tza-Jing Gung , Mark Perrin , Andrew Gillard
发明人: Tza-Jing Gung , Mark Perrin , Andrew Gillard
CPC分类号: H01J37/3408 , H01J37/32688
摘要: A quadruple electromagnetic coil array coaxially arranged in a rectangular array about a chamber axis outside the sidewalls of a plasma sputter reactor, preferably in back of an RF coil within the chamber. The coil currents can be separately controlled to produce different magnetic field distributions, for example, between a sputter deposition mode in which the sputter target is powered to sputter target material onto a wafer and a sputter etch mode in which the RF coil supports the gas sputtering the wafer. The coil array may include a tubular magnetic core, particularly useful for suppressing stray fields. A water cooling coil may be wrapped around the coil array to cool all the coils. The electromagnets can be powered in different relative polarities in a multi-step process.
摘要翻译: 一个四重电磁线圈阵列,其围绕室等离子体溅射反应器的侧壁外部的腔室轴线同轴布置,优选地在室内的RF线圈的背面。 可以单独控制线圈电流以产生不同的磁场分布,例如在其中溅射靶被驱动以将靶材料溅射到晶片上的溅射沉积模式和溅射蚀刻模式之间,其中RF线圈支撑气体溅射 晶圆。 线圈阵列可以包括管状磁芯,特别适用于抑制杂散磁场。 水冷盘管可缠绕在线圈阵列上以冷却所有线圈。 电磁铁可以在多步骤过程中以不同的相对极性供电。
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