Asymmetric MOS technology power device

    公开(公告)号:US06326271B2

    公开(公告)日:2001-12-04

    申请号:US09746789

    申请日:2000-12-21

    IPC分类号: H01L21336

    摘要: A MOS technology power device comprises a semiconductor substrate, a semiconductor layer of a first conductivity type superimposed over the semiconductor substrate, an insulated gate layer covering the semiconductor layer, a plurality of substantially rectilinear elongated openings parallel to each other in the insulated gate layer, a respective plurality of elongated body stripes of a second conductivity type formed in the semiconductor layer under the elongated openings, source regions of the first conductivity type included in the body stripes and a metal layer covering the insulated gate layer and contacting the body stripes and the source regions through the elongated openings. Each body stripe comprises first portions substantially aligned with a first edge of the respective elongated opening and extending under a second edge of the elongated opening to form a channel region, each first portion including a source region extending substantially from a longitudinal axis of symmetry of the respective elongated opening to the second edge of the elongated opening, and second portions, longitudinally intercalated with the first portions, substantially aligned with the second edge of the elongated opening and extending under the first edge of the elongated opening to form a channel region, each second portion including a source region extending substantially from the longitudinal axis of symmetry to the first edge of the elongated opening, the first portions and second portions of the body stripes being respectively aligned in a direction transversal to the longitudinal axis.

    Asymmetric MOS technology power device
    2.
    发明授权
    Asymmetric MOS technology power device 失效
    非对称MOS技术功率器件

    公开(公告)号:US06222232B1

    公开(公告)日:2001-04-24

    申请号:US08886836

    申请日:1997-07-01

    IPC分类号: H01L2974

    摘要: A MOS technology power device comprises a semiconductor substrate, a semiconductor layer of a first conductivity type superimposed over the semiconductor substrate, an insulated gate layer covering the semiconductor layer, a plurality of substantially rectilinear elongated openings parallel to each other in the insulated gate layer, a respective plurality of elongated body stripes of a second conductivity type formed in the semiconductor layer under the elongated openings, source regions of the first conductivity type included in the body stripes and a metal layer covering the insulated gate layer and contacting the body stripes and the source regions through the elongated openings. Each body stripe comprises first portions substantially aligned with a first edge of the respective elongated opening and extending under a second edge of the elongated opening to form a channel region, each first portion including a source region extending substantially from a longitudinal axis of symmetry of the respective elongated opening to the second edge of the elongated opening, and second portions, longitudinally intercalated with the first portions, substantially aligned with the second edge of the elongated opening and extending under the first edge of the elongated opening to form a channel region, each second portion including a source region extending substantially from the longitudinal axis of symmetry to the first edge of the elongated opening, the first portions and second portions of the body stripes being respectively aligned in a direction transversal to the longitudinal axis.

    摘要翻译: MOS技术功率器件包括半导体衬底,叠加在半导体衬底上的第一导电类型的半导体层,覆盖半导体层的绝缘栅极层,在绝缘栅极层中彼此平行的多个基本上直线的细长开口, 形成在细长开口下方的半导体层中的相应的多个细长体条带,包括在主体条中的第一导电类型的源极区域和覆盖绝缘栅极层的金属层并接触主体条纹和 源区域通过细长的开口。 每个主体条带包括基本上与相应细长开口的第一边缘对准的第一部分,并且在细长开口的第二边缘下方延伸以形成通道区域,每个第一部分包括基本上从纵向对称轴线延伸的源区域 与细长开口的第二边缘相对的细长开口,以及纵向插入第一部分的第二部分,基本上与细长开口的第二边缘对准,并在细长开口的第一边缘下方延伸以形成通道区域, 第二部分包括基本上从纵向对称轴延伸到细长开口的第一边缘的源区域,主体条纹的第一部分和第二部分分别在与纵轴相交的方向上对齐。

    Integrated electronic device with edge-termination structure and manufacturing method thereof
    3.
    发明授权
    Integrated electronic device with edge-termination structure and manufacturing method thereof 有权
    具有边缘终端结构的集成电子装置及其制造方法

    公开(公告)号:US09018635B2

    公开(公告)日:2015-04-28

    申请号:US13221778

    申请日:2011-08-30

    摘要: An embodiment of an integrated electronic device formed in a semiconductor body delimited by a lateral surface, which includes: a substrate made of a first semiconductor material; a first epitaxial region made of a second semiconductor material, which overlies the substrate and defines a first surface; a second epitaxial region made of a third semiconductor material, which overlies the first surface and is in contact with the first epitaxial region, the third semiconductor material having a bandgap narrower than the bandgap of the second semiconductor material; an active area, extending within the second epitaxial region and housing at least one elementary electronic component; and an edge structure, arranged between the active area and the lateral surface, and including a dielectric region arranged laterally with respect to the second epitaxial region, which overlies the first surface and is in contact with the first epitaxial region.

    摘要翻译: 一种形成在由侧面限定的半导体主体中的集成电子器件的实施例,包括:由第一半导体材料制成的衬底; 由第二半导体材料制成的第一外延区,其覆盖在所述基板上并限定第一表面; 由第三半导体材料制成的第二外延区,其覆盖在第一表面上并与第一外延区接触,第三半导体材料具有比第二半导体材料的带隙窄的带隙; 有源区域,在所述第二外延区域内延伸并容纳至少一个基本电子部件; 以及边缘结构,其布置在所述有源区域和所述侧表面之间,并且包括相对于所述第二外延区域横向布置的介质区域,所述介电区域覆盖所述第一表面并与所述第一外延区域接触。

    MOS technology power device
    5.
    发明授权
    MOS technology power device 有权
    MOS技术电源设备

    公开(公告)号:US06404010B2

    公开(公告)日:2002-06-11

    申请号:US09860809

    申请日:2001-05-17

    IPC分类号: H01L2976

    摘要: A MOS technology power device is described which comprises a plurality of elementary active units and a part of said power device which is placed between zones where the elementary active units are formed. The part of the power device comprises at least two heavily doped body regions of a first conductivity type which are formed in a semiconductor layer of a second conductivity type, a first lightly doped semiconductor region of the first conductivity type which is placed laterally between the two body regions. The first semiconductor region is placed under a succession of a thick silicon oxide layer, a polysilicon layer and a metal layer. A plurality of second lightly doped semiconductor regions of the first conductivity type are placed under said at least two heavily doped body regions and under said first lightly doped semiconductor region of the first conductivity type, each region of said plurality of second lightly doped semiconductor regions of the first conductivity type being separated from the other by portions of said semiconductor layer of the second conductivity type.

    摘要翻译: 描述了MOS技术功率器件,其包括多个基本有源单元和放置在形成基本有源单元的区域之间的所述功率器件的一部分。 功率器件的一部分包括形成在第二导电类型的半导体层中的第一导电类型的至少两个重掺杂体区域,第一导电类型的第一轻掺杂半导体区域横向放置在两者之间 身体区域。 第一半导体区域被放置在一连串厚的氧化硅层,多晶硅层和金属层之下。 第一导电类型的多个第二轻掺杂半导体区域被放置在所述至少两个重掺杂体区域的下方,并且在所述第一导电类型的所述第一轻掺杂半导体区域的下方,所述多个第二轻掺杂半导体区域的每个区域 所述第一导电类型通过所述第二导电类型的所述半导体层的一部分与另一个分离。

    Process for integrating, in a single semiconductor chip, MOS technology
devices with different threshold voltages
    6.
    发明授权
    Process for integrating, in a single semiconductor chip, MOS technology devices with different threshold voltages 有权
    在单个半导体芯片中集成具有不同阈值电压的MOS技术器件的工艺

    公开(公告)号:US6040609A

    公开(公告)日:2000-03-21

    申请号:US178369

    申请日:1998-10-23

    摘要: Process for integrating in a same MOS technology devices with different threshold voltages. Simultaneously forming on a semiconductor material layer of at least two gate electrodes for at least two MOS devices, said gate electrodes comprising substantially rectilinear portions and corners, each gate electrode having a respective corner density for unit area. Selectively introducing in the semiconductor material layer a dopant for the simultaneous formation of respective channel regions for said at least two MOS devices, said channel regions extending under the respective gate electrode, said selective introduction using as a mask the respective gate electrodes so that said channel regions have, at the corners of the respective gate electrode, a dopant concentration lower than that at the substantially rectilinear portions. Said two MOS devices consequently have respective threshold voltages that depend on the corner density for unit area and on the aperture angles of the corner of the respective gate electrodes.

    摘要翻译: 用于集成在具有不同阈值电压的相同MOS技术设备中的过程。 同时在用于至少两个MOS器件的至少两个栅电极的半导体材料层上形成,所述栅电极基本上包括直线部分和拐角,每个栅电极具有单位面积的相应角密度。 在半导体材料层中选择性地引入用于同时形成用于所述至少两个MOS器件的各个沟道区的掺杂剂,所述沟道区在相应的栅极下方延伸,所述选择性引入使用各个栅电极作为掩模,使得所述沟道 区域在各个栅电极的角部处具有低于基本上直线部分处的掺杂浓度。 所述两个MOS器件因此具有取决于单位面积的角密度和各个栅电极的角的孔径角的各自的阈值电压。

    Single feature size MOS technology power device

    公开(公告)号:US5981998A

    公开(公告)日:1999-11-09

    申请号:US739465

    申请日:1996-10-29

    摘要: A MOS technology power device comprises a semiconductor material layer of a first conductivity type, a conductive insulated gate layer covering the semiconductor material layer, and a plurality of elementary functional units. The conductive insulated gate layer includes a first insulating material layer placed above the semiconductor material layer, a conductive material layer placed above the first insulating material layer, and a second insulating material layer placed above the conductive material layer. Each elementary functional unit includes an elongated body region of a second conductivity type formed in the semiconductor material layer. Each elementary functional unit further includes an elongated window in the insulated gate layer extending above the elongated body region. Each elongated body region includes a source region doped with dopants of the first conductivity type, intercalated with a portion of the elongated body region wherein no dopant of the first conductivity type are provided. The MOS technology power device further includes a plurality of insulating material sidewall spacers disposed above the semiconductor material layer along elongated edges of each elongated window to seal the edges of each elongated window in the insulated gate layer from a source metal layer disposed over the insulated gate layer and the semiconductor material layer. The source metal layer contacts each body region and each source region through each elongated window along the length of the elongated body region.

    Insulated gate planar integrated power device with co-integrated Schottky diode and process
    8.
    发明申请
    Insulated gate planar integrated power device with co-integrated Schottky diode and process 有权
    具有共同集成肖特基二极管和工艺的绝缘栅平面集成功率器件

    公开(公告)号:US20070102725A1

    公开(公告)日:2007-05-10

    申请号:US11520210

    申请日:2006-09-12

    IPC分类号: H01L29/74

    摘要: A process for integrating a Schottky contact inside the apertures of the elementary cells that constitute the integrated structure of the insulated gate power device in a totally self-alignment manner does not requires a dedicated masking step. This overcomes the limits to the possibility of increasing the packing density of the cellular structure of the integrated power device, while permitting improved performances of the co-integrated Schottky diode under inverse polarization of the device and producing other advantages. A planar integrated insulated gate power device with high packing density of the elementary cells that compose it, having a Schottky diode electrically in parallel to the co-integrated device, is also disclosed.

    摘要翻译: 以完全自对准的方式将构成绝缘栅功率器件的集成结构的单元的孔内的肖特基接触集成在一起的处理不需要专用的掩蔽步骤。 这克服了增加集成功率器件的蜂窝结构的封装密度的可能性的限制,同时可以在器件的反极化下提高共同集成的肖特基二极管的性能并产生其他优点。 还公开了一种平面集成绝缘栅功率器件,其具有构成该元件的单元的高封装密度,其具有与并联器件并联的肖特基二极管。

    Single feature size MOS technology power device
    9.
    发明授权
    Single feature size MOS technology power device 有权
    单功能尺寸MOS技术电源设备

    公开(公告)号:US06566690B2

    公开(公告)日:2003-05-20

    申请号:US09427236

    申请日:1999-10-26

    IPC分类号: H01L2974

    摘要: A MOS technology power device includes a semiconductor material layer of a first conductivity type, a conductive insulated gate layer covering the semiconductor material layer, and a plurality of elementary functional units. The conductive insulated gate layer includes a first insulating material layer placed above the semiconductor material layer, a conductive material layer placed above the first insulating material layer, and a second insulating material layer placed above the conductive material layer. Each elementary functional unit includes an elongated body region of a second conductivity type formed in the semiconductor material layer. Each elementary functional unit further includes an elongated window in the insulated gate layer extending above the elongated body region. Each elongated body region includes a source region doped with dopants of the first conductivity type, intercalated with a portion of the elongated body region wherein no dopant of the first conductivity type are provided. The MOS technology power device further includes a plurality of insulating material sidewall spacers disposed above the semiconductor material layer along elongated edges of each elongated window to seal the edges of each elongated window in the insulated gate layer from a source metal layer disposed over the insulated gate layer and the semiconductor material layer. The source metal layer contacts each body region and each source region through each elongated window along the length of the elongated body region.

    摘要翻译: MOS技术功率器件包括第一导电类型的半导体材料层,覆盖半导体材料层的导电绝缘栅极层和多个基本功能单元。 导电绝缘栅层包括置于半导体材料层上方的第一绝缘材料层,位于第一绝缘材料层上方的导电材料层和置于导电材料层上方的第二绝缘材料层。 每个基本功能单元包括形成在半导体材料层中的第二导电类型的细长体区域。 每个基本功能单元还包括在细长体区域上方延伸的绝缘栅极层中的细长窗口。 每个细长体区域包括掺杂有第一导电类型的掺杂剂的源区,插入有细长体区的一部分,其中不提供第一导电类型的掺杂剂。 MOS技术功率器件还包括多个绝缘材料侧壁间隔物,其沿着每个细长窗口的细长边缘设置在半导体材料层之上,以密封绝缘栅极层中每个细长窗口的边缘与设置在绝缘栅极上的源极金属层 层和半导体材料层。 源极金属层沿着细长主体区域的长度通过每个细长窗口接触每个体区域和每个源极区域。

    High density MOS technology power device
    10.
    发明授权
    High density MOS technology power device 有权
    高密度MOS技术电源设备

    公开(公告)号:US06548864B2

    公开(公告)日:2003-04-15

    申请号:US09426510

    申请日:1999-10-26

    IPC分类号: H01L2994

    摘要: A MOS technology power device comprises a semiconductor material layer of a first conductivity type, a plurality of elementary functional units, a first insulating material layer placed above the semiconductor material layer and a conductive material layer placed above the first insulating material layer. Each elementary functional unit includes an elongated body region of a second conductivity type formed in the semiconductor material layer. Each elementary functional unit further includes a first elongated window in the conductive material layer extending above the elongated body region. Each elongated body region includes a source region doped with dopants of the first conductivity type, intercalated with a portion of the elongated body region wherein no dopant of the first conductivity type are provided. The MOS technology power device further includes a second insulating material layer disposed above the conductive material layer and disposed along elongated edges of the first elongated window. The second insulating material layer includes a second elongated window extending above each elongated body region. The second insulating material layer seals the edges of the conductive material layer from a source metal layer disposed over the second insulating material layer. The source metal layer contacts each body region and each source region through each second elongated window along the length of the elongated body region.

    摘要翻译: MOS技术功率器件包括第一导电类型的半导体材料层,多个基本功能单元,放置在半导体材料层上方的第一绝缘材料层和放置在第一绝缘材料层上方的导电材料层。 每个基本功能单元包括形成在半导体材料层中的第二导电类型的细长体区域。 每个基本功能单元还包括在细长主体区域上方延伸的导电材料层中的第一细长窗口。 每个细长体区域包括掺杂有第一导电类型的掺杂剂的源区,插入有细长体区的一部分,其中不提供第一导电类型的掺杂剂。 MOS技术功率器件还包括设置在导电材料层上方并沿着第一细长窗的细长边缘设置的第二绝缘材料层。 第二绝缘材料层包括在每个细长体区域之上延伸的第二细长窗口。 第二绝缘材料层将导电材料层的边缘与设置在第二绝缘材料层上的源极金属层密封。 源金属层沿着细长主体区域的长度通过每个第二细长窗口接触每个体区域和每个源区域。