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公开(公告)号:US5539186A
公开(公告)日:1996-07-23
申请号:US988078
申请日:1992-12-09
申请人: Anthony J. Abrami , Maurizio Arienzo , Giulio DiGiacomo , Gene J. Gaudenzi , Paul V. McLaughlin
发明人: Anthony J. Abrami , Maurizio Arienzo , Giulio DiGiacomo , Gene J. Gaudenzi , Paul V. McLaughlin
CPC分类号: H01L24/98 , H01L23/34 , H01L23/345 , H05B3/20 , H05K1/0212 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H05K1/0306 , H05K1/167 , H05K2201/10151 , H05K2201/10674 , H05K2203/1115 , H05K2203/165 , H05K2203/176 , H05K3/3436 , H05K3/3494 , H05K3/4611 , H05K3/4629
摘要: A multi-layer module that has incorporated therein an additional sheet with a heat generating film resistor formed thereon. A temperature responsive controller regulates the film resistor current in order to regulate the temperature at the surface of the module. The invention is applicable to both single chip and multiple chip modules, and for multi-chip modules a plurality of discrete film resistors on a single may be used.
摘要翻译: 一种多层模块,其中结合有附加的片材,其上形成有发热膜电阻器。 温度响应控制器调节薄膜电阻器电流,以调节模块表面的温度。 本发明可应用于单芯片和多芯片模块,并且对于多芯片模块,可以使用单个多个分立的薄膜电阻器。