Microwave resonator accelerometer
    1.
    发明授权
    Microwave resonator accelerometer 失效
    微波谐振加速度计

    公开(公告)号:US5351541A

    公开(公告)日:1994-10-04

    申请号:US823866

    申请日:1992-01-22

    CPC分类号: G01P15/097 G01P15/08

    摘要: A microwave resonator accelerometer including a microwave resonant cavity having a predetermined resonant frequency; the cavity including a flexible portion; a proof mass fixed to the flexible portion for changing the geometry and establishing a new resonant frequency of the cavity in response to an acceleration force on the proof mass; a microwave frequency signal at or approximately at the predetermined resonant frequency coupled to the cavity; and a discrimination circuit, responsive to the reflected microwave signal from the cavity, for discriminating a shift in the predetermined resonant frequency of the cavity to a new resonant frequency effected by the change in geometry of the cavity resulting from the acceleration force on the proof mass.

    摘要翻译: 一种微波谐振器加速度计,包括具有预定谐振频率的微波谐振腔; 所述腔包括柔性部分; 固定到所述柔性部分上的用于改变所述几何形状并且响应于所述证明质量块上的加速力建立所述空腔的新的共振频率的校验物质; 微波频率信号处于或接近于耦合到空腔的预定谐振频率; 以及响应于来自空腔的反射的微波信号的鉴别电路,用于将空腔的预定谐振频率的偏移鉴定为新的谐振频率,该谐振频率受到由检测质量块上的加速力引起的空腔几何形状的变化的影响 。

    DUAL MICROWAVE CAVITY ACCELEROMETER
    2.
    发明申请
    DUAL MICROWAVE CAVITY ACCELEROMETER 有权
    双微波加速度计

    公开(公告)号:US20050115319A1

    公开(公告)日:2005-06-02

    申请号:US10341666

    申请日:2003-01-14

    IPC分类号: G01P15/08 G01P15/03 G01P21/00

    CPC分类号: G01P15/08

    摘要: A system and method for compensating for gradients in a dual cavity device such as but not limited to an accelerometer. A first source drives a first cavity at least two different modes, at least one mode varying with changes in cavity length. A second source drives a second cavity at least two different modes, at least one mode varying with changes in cavity length. A processor determines changes in cavity length as a function of both modes in both cavities to compensate for non-uniform behavior between the cavities.

    摘要翻译: 一种用于补偿双腔装置中的梯度的系统和方法,例如但不限于加速度计。 第一源驱动第一腔至少两种不同的模式,至少一种模式随腔长度的变化而变化。 第二源驱动第二腔至少两种不同的模式,至少一种模式随腔长度的变化而变化。 处理器确定腔长度的变化作为两个腔中的两种模式的函数,以补偿腔之间的不均匀行为。

    Flexural plate wave sensor
    3.
    发明申请
    Flexural plate wave sensor 有权
    弯板传感器

    公开(公告)号:US20060260108A1

    公开(公告)日:2006-11-23

    申请号:US11496229

    申请日:2006-07-31

    IPC分类号: H04R17/00

    摘要: A method for manufacturing a flexural plate wave sensor, the method including the steps of depositing an etch-stop layer over a substrate, depositing a membrane layer over said etch stop layer, depositing a piezoelectric layer over said membrane layer, forming a comb pattern with drive teeth which span across an entire length of the piezoelectric layer on said piezoelectric layer, etching a cavity through the substrate, the cavity having substantially parallel interior walls, and removing a portion of the etch stop layer between the cavity and the membrane layer to expose a portion of the membrane layer.

    摘要翻译: 一种用于制造弯曲板波传感器的方法,所述方法包括以下步骤:在衬底上沉积蚀刻停止层,在所述蚀刻停止层上沉积膜层,在所述膜层上沉积压电层,形成具有 驱动齿跨越所述压电层上的压电层的整个长度,通过衬底蚀刻空腔,空腔具有基本上平行的内壁,以及去除腔和膜层之间的一部分蚀刻停止层以暴露 膜层的一部分。

    Method for fabricating micro-mechanical devices
    4.
    发明申请
    Method for fabricating micro-mechanical devices 有权
    微机械装置的制造方法

    公开(公告)号:US20060134818A1

    公开(公告)日:2006-06-22

    申请号:US11014415

    申请日:2004-12-16

    IPC分类号: H01L21/461

    摘要: A method of fabricating micro-mechanical devices. A mesa is etched in a homogeneous wafer. The wafer is bonded to a patterned substrate with the mesa defining device elements suspended above the substrate. A portion of the wafer is removed until a desired device thickness is achieved. Discrete elements of the device are then formed by performing a structural etch on the remaining wafer material.

    摘要翻译: 一种制造微机械装置的方法。 在均匀晶片中蚀刻台面。 晶片被结合到图案化衬底,其中台面限定器件元件悬置在衬底上。 去除晶片的一部分直到实现所需的器件厚度。 然后通过对剩余的晶片材料进行结构蚀刻来形成器件的离散元件。

    MEMS vibration isolation system and method
    10.
    发明授权
    MEMS vibration isolation system and method 有权
    MEMS振动隔离系统及方法

    公开(公告)号:US08896074B2

    公开(公告)日:2014-11-25

    申请号:US13358744

    申请日:2012-01-26

    IPC分类号: H01L29/84 H01L21/00

    CPC分类号: B81B7/0016

    摘要: A microelectromechanical vibration isolation system includes a microelectromechanical structure having a plurality of fin apertures etched therethrough, and a plurality of fins each disposed within a respective one of the plurality of fin apertures and spaced apart from the microelectromechanical structure so as to define a fluid gap therebetween. The fluid gap is configured to provide squeeze film damping of vibrations imparted upon the microelectromechanical structure in at least two dimensions. The system further includes a frame surrounding the microelectromechanical structure, and a plurality of springs each coupled to the microelectromechanical structure and to the frame. The plurality of springs is configured to support the micromechanical structure in relation to the frame.

    摘要翻译: 微机电振动隔离系统包括具有蚀刻穿过其中的多个翅片孔的微机电结构,以及多个翅片,每个翅片均设置在多个翅片孔中的相应一个翅片孔内并与微机电结构间隔开,以便限定其间的流体间隙 。 流体间隙构造成在至少两个维度上提供施加在微机电结构上的振动的挤压膜阻尼。 该系统还包括围绕微电子机械结构的框架,以及多个弹簧,每个弹簧联接到微机电结构和框架。 多个弹簧构造成相对于框架支撑微机械结构。