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公开(公告)号：US20160095204A1
公开(公告)日：2016-03-31
申请号：US14574191
申请日：2014-12-17
Applicant: Apple Inc.
Inventor： Richard A. BESEN , Eric W. BATES , Gregory N. STEPHENS
CPC classification number: H05K1/189 , H01R12/00 , H05K3/3431 , H05K3/3436 , H05K2201/10189 , H05K2201/10333 , H05K2201/2036 , Y02P70/613
Abstract: In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.
Abstract translation: 在某些设计中，使柔性电路（flex）呈现弯曲状态可有助于有效地布线导电通路。 在回流操作期间实现弯曲状态下的弯曲焊接的一种有效方式是操纵镶板，其将多个弯曲部分保持在可弯曲的位置，以可靠地保持弯曲。 在一些实施例中，柔性件可以在回流操作期间表面安装到电气设备的一部分或全部，在此期间，弯曲状态通过至少部分地附接到柔性件的周边的镶板来保持。 另一个解决方案是在表面安装和回流操作期间利用真空或热胶装置来保持弯曲。
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公开(公告)号：US20180109659A1
公开(公告)日：2018-04-19
申请号：US15593252
申请日：2017-05-11
Applicant: Apple Inc.
Inventor： Xiao Ying ZHAO , Timothy S. LUI , Tyler B. CATER , Rasamy PHOUTHAVONG , Scott A. MYERS , Benjamin J. POPE , David A. HURRELL , Christopher R. XYDIS , Edward S. HUO , Richard Hung Minh DINH , Michael W. FIRKA , Martin J. AUCLAIR , Kurtis J. MUNDELL , Salome BAVETTA , Paul LEUTHEUSER , Hani ESMAEILI , Kevin M. FROESE , Ihtesham H. CHOWDHURY , Tang Yew TAN , Eric W. BATES , Yaocheng ZHANG
CPC classification number: H05K5/0217 , G06F1/1626 , G06F1/1633 , G06F1/1684 , G06F1/1698 , H01H9/04 , H04B1/3816 , H04M1/0249 , H04M1/026 , H04M1/18 , H04R1/025 , H04R1/44 , H04R2499/11 , H05K7/1461
Abstract: An electronic device having liquid-resistant modifications that prevent liquid ingress into an opening (or openings) in an enclosure of the electronic device is disclosed. For example, the electronic device may include a coating formed from a liquid-resistant material that is applied internally to the enclosure. The electronic device may further include a frame that carries a protective transparent layer designed to cover a display assembly. In order to secure the frame with the enclosure, the electronic device may include an adhesive assembly disposed over an outer perimeter of the coating. The adhesive assembly may include several adhesive parts initially separate from one another. However, with the adhesive parts between the frame and the enclosure, the adhesive parts can be compressed by the frame and the enclosure, causing the adhesive parts to expand and engage each other. As a result, the coating and the adhesive parts provide a seal against liquid.
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公开(公告)号：US20180110143A1
公开(公告)日：2018-04-19
申请号：US15593253
申请日：2017-05-11
Applicant: Apple Inc.
Inventor： Xiao Ying ZHAO , Timothy S. LUI , Tyler B. CATER , Rasamy PHOUTHAVONG , Scott A. MYERS , Benjamin J. POPE , David A. HURRELL , Christopher R. XYDIS , Edward S. HUO , Richard Hung Minh DINH , Michael W. FIRKA , Martin J. AUCLAIR , Kurtis J. MUNDELL , Salome BAVETTA , Paul LEUTHEUSER , Hani ESMAEILI , Kevin M. FROESE , Ihtesham H. CHOWDHURY , Tang Yew TAN , Eric W. BATES , Yaocheng ZHANG
CPC classification number: H05K5/0217 , G06F1/1626 , G06F1/1633 , G06F1/1684 , G06F1/1698 , H01H9/04 , H04B1/3816 , H04M1/0249 , H04M1/026 , H04M1/18 , H04R1/025 , H04R1/44 , H04R2499/11 , H05K7/1461
Abstract: An electronic device having several modifications designed to prevent liquid ingress into an opening (or openings) of the electronic device is disclosed. For example, the electronic device includes a SIM tray having a sealing element designed to provide a seal at an opening that receives the SIM tray. The sealing element may include a first section and a second section extending from the first section, with the first section designed to bend with respect to (and in some cases collapse onto) the second section. The electronic device may further include an audio module fitted with a sealing element. The sealing element may include extensions extending away from a main body of the sealing element, with some extension designed to engage the audio module, and other extensions designed to engage an audio module interface. The sealing element provides a seal against liquid ingress into the audio module.
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