公开(公告)号：US20230282544A1

公开(公告)日：2023-09-07

申请号：US17653633

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Simon J. TRIVETT ,  Brett W. DEGNER ,  Mahesh S. HARDIKAR ,  Michael E. LECLERC ,  Eric R. PRATHER ,  Kevin J. RYAN

IPC: H01L23/40 ,  G06F1/20 ,  H05K1/02 ,  H05K7/20

CPC classification number: H01L23/4093 ,  G06F1/206 ,  H05K1/0203 ,  H05K7/2039 ,  H05K2201/10515

Abstract: This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.

公开(公告)号：US20220354031A1

公开(公告)日：2022-11-03

申请号：US17398941

申请日：2021-08-10

Applicant: Apple Inc.

Inventor： Michael E. LECLERC ,  Kevin J. RYAN ,  Brett W. DEGNER

IPC: H05K7/20 ,  H04R1/02 ,  H05K5/02 ,  G06F1/20

Abstract: This application relates to display devices and the layout/architecture of various internal components to enhance thermal energy management. A display device described herein may include one or more fan assemblies that drive ambient air into the display device to cool heat-generating components of the display device, and also to drive the ambient air, once heated through convectively cooling the heat-generating components, out of the display device. Further, the location of the heat-generating components is such that the heat-generating components upstream relative to the one or more fan assemblies. In this manner, the ambient air can pass over or through the heat-generating components prior to reaching the one or more fan assemblies. Additionally, heat-generating components, such as a backlit device and a power supply unit, are positioned relatively close to vent inlets in the display device. As a result, these heat-generating devices are immediately cooled with the ambient air.