公开(公告)号：US20230282544A1

公开(公告)日：2023-09-07

申请号：US17653633

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Simon J. TRIVETT ,  Brett W. DEGNER ,  Mahesh S. HARDIKAR ,  Michael E. LECLERC ,  Eric R. PRATHER ,  Kevin J. RYAN

IPC: H01L23/40 ,  G06F1/20 ,  H05K1/02 ,  H05K7/20

CPC classification number: H01L23/4093 ,  G06F1/206 ,  H05K1/0203 ,  H05K7/2039 ,  H05K2201/10515

Abstract: This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.