-
公开(公告)号：US20200042050A1
公开(公告)日：2020-02-06
申请号：US16654793
申请日：2019-10-16
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20160378147A1
公开(公告)日：2016-12-29
申请号：US15263222
申请日：2016-09-12
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20180246548A1
公开(公告)日：2018-08-30
申请号：US15965272
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20180246547A1
公开(公告)日：2018-08-30
申请号：US15964973
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20230251694A1
公开(公告)日：2023-08-10
申请号：US18131983
申请日：2023-04-07
Applicant: APPLE INC.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
CPC classification number: G06F1/181 , G06F1/20 , H05K7/20145 , H05K7/20163 , H05K7/20172 , H05K7/2049 , H01L23/4093 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , H05K5/03 , H05K1/0203 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H05K7/20154 , H05K7/20209 , H05K7/2039 , H05K7/20009
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
Patent Agency Ranking
公开(公告)号：US20220155830A1
公开(公告)日：2022-05-19
申请号：US17649661
申请日：2022-02-01
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20170300095A1
公开(公告)日：2017-10-19
申请号：US15637981
申请日：2017-06-29
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20230282544A1
公开(公告)日：2023-09-07
申请号：US17653633
申请日：2022-03-04
Applicant: Apple Inc.
Inventor： Simon J. TRIVETT , Brett W. DEGNER , Mahesh S. HARDIKAR , Michael E. LECLERC , Eric R. PRATHER , Kevin J. RYAN
CPC classification number: H01L23/4093 , G06F1/206 , H05K1/0203 , H05K7/2039 , H05K2201/10515
Abstract: This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.
-
公开(公告)号：US20220354031A1
公开(公告)日：2022-11-03
申请号：US17398941
申请日：2021-08-10
Applicant: Apple Inc.
Inventor： Michael E. LECLERC , Kevin J. RYAN , Brett W. DEGNER
Abstract: This application relates to display devices and the layout/architecture of various internal components to enhance thermal energy management. A display device described herein may include one or more fan assemblies that drive ambient air into the display device to cool heat-generating components of the display device, and also to drive the ambient air, once heated through convectively cooling the heat-generating components, out of the display device. Further, the location of the heat-generating components is such that the heat-generating components upstream relative to the one or more fan assemblies. In this manner, the ambient air can pass over or through the heat-generating components prior to reaching the one or more fan assemblies. Additionally, heat-generating components, such as a backlit device and a power supply unit, are positioned relatively close to vent inlets in the display device. As a result, these heat-generating devices are immediately cooled with the ambient air.
-
公开(公告)号：US20170308134A1
公开(公告)日：2017-10-26
申请号：US15637940
申请日：2017-06-29
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , H05K7/20 , H05K5/03 , H05K1/02 , G08B21/18 , G08B5/36 , G06F3/00 , G06F1/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.019 seconds)
