公开(公告)号：US20160279756A1

公开(公告)日：2016-09-29

申请号：US15173491

申请日：2016-06-03

Applicant: Applied Materials, Inc.

Inventor： Shou-Sung Chang ,  Takashi Fujikawa ,  Hung Chih Chen ,  Paul D. Butterfield

IPC: B24B37/005 ,  B24B37/10

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/16 ,  B24B37/32 ,  B24B49/16

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract translation: 抛光装置包括具有支撑抛光垫的第一表面和第二表面的压板，用于将衬底保持在抛光垫上的载体头，限定在压板中的多个通孔和相邻的衬垫压力控制组件 在压板的与承载头相对的一侧。

公开(公告)号：US09308623B2

公开(公告)日：2016-04-12

申请号：US14256704

申请日：2014-04-18

Applicant: Applied Materials, Inc.

Inventor： Hung Chen ,  Shou-Sung Chang ,  Jason Garcheung Fung ,  Matthew A. Gallelli ,  Paul D. Butterfield ,  Kevin Chou

IPC: B24B53/017

CPC classification number: B24B53/017

Abstract: A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.

Abstract translation: 衬垫调节器可以包括多个独立安装的调节元件，其被配置为调节在例如化学机械抛光（CMP）工艺中使用的抛光垫。 在一些实施例中，垫调节器可以包括主组件盘和通过万向接头连接到主组件盘的主组件底板。 多个垫调节器组件可以附接到主组件基板。 在一些实施例中，每个垫调节器组件可以包括附接到主组件基板的垫调节器盘，通过万向接头连接到垫调节盘的垫调节器基座和附接到垫调节器基座的调节元件。 还提供了调整抛光垫的方法，以及其它方面。

公开(公告)号：US20140315473A1

公开(公告)日：2014-10-23

申请号：US14256704

申请日：2014-04-18

Applicant: Applied Materials, Inc.

Inventor： Hung Chen ,  Shou-Sung Chang ,  Jason Garcheung Fung ,  Matthew A. Gallelli ,  Paul D. Butterfield ,  Kevin Chou

IPC: B24B53/017

CPC classification number: B24B53/017

Abstract: A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.

Abstract translation: 衬垫调节器可以包括多个独立安装的调节元件，其被配置为调节在例如化学机械抛光（CMP）工艺中使用的抛光垫。 在一些实施例中，垫调节器可以包括主组件盘和通过万向接头连接到主组件盘的主组件底板。 多个垫调节器组件可以附接到主组件基板。 在一些实施例中，每个垫调节器组件可以包括附接到主组件基板的垫调节器盘，通过万向接头连接到垫调节盘的垫调节器基座和附接到垫调节器基座的调节元件。 还提供了调整抛光垫的方法，以及其它方面。

公开(公告)号：US20230256562A1

公开(公告)日：2023-08-17

申请号：US18305793

申请日：2023-04-24

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher

IPC: B24B53/017 ,  B24B53/00 ,  B24B57/02

CPC classification number: B24B53/017 ,  B24B53/005 ,  B24B57/02 ,  B24B41/061

Abstract: A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

公开(公告)号：US20220410335A1

公开(公告)日：2022-12-29

申请号：US17896008

申请日：2022-08-25

Applicant: Applied Materials, Inc.

Inventor： Paul D. Butterfield ,  Thomas H. Osterheld ,  Jeonghoon Oh ,  Shou-Sung Chang ,  Steven M. Zuniga ,  Fred C. Redeker

IPC: B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  B24B37/20 ,  B24B41/02 ,  B24B53/02

Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

公开(公告)号：US20220388041A1

公开(公告)日：2022-12-08

申请号：US17889330

申请日：2022-08-16

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/10 ,  H01L21/67 ,  B24B37/34

Abstract: An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US11511388B2

公开(公告)日：2022-11-29

申请号：US16706465

申请日：2019-12-06

Applicant: Applied Materials, Inc.

Inventor： Paul D. Butterfield ,  Thomas H. Osterheld ,  Jeonghoon Oh ,  Shou-Sung Chang ,  Steven M. Zuniga ,  Fred C. Redeker

IPC: B24B37/30 ,  B24B41/02 ,  B24B37/00 ,  B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  B24B37/20 ,  B24B53/02

Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

公开(公告)号：US11077536B2

公开(公告)日：2021-08-03

申请号：US15626936

申请日：2017-06-19

Applicant: Applied Materials, Inc.

Inventor： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC: B24B57/02 ,  B24B37/10 ,  H01L21/67

Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.

公开(公告)号：US20210205953A1

公开(公告)日：2021-07-08

申请号：US17209034

申请日：2021-03-22

Applicant: Applied Materials, Inc.

Inventor： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC: B24B57/02 ,  B24B37/10

Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.

公开(公告)号：US20200376522A1

公开(公告)日：2020-12-03

申请号：US16886567

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/10 ,  H01L21/02 ,  B08B1/00 ,  B24B37/20 ,  B24B53/017

Abstract: A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.