公开(公告)号：US10829855B2

公开(公告)日：2020-11-10

申请号：US15492938

申请日：2017-04-20

Applicant: Applied Materials, Inc.

Inventor： Anh N. Nguyen ,  Dmitry Lubomirsky ,  Mehmet Tugrul Samir

IPC: C23C16/455

Abstract: Embodiments disclosed herein generally relate to a gas distribution assembly for providing improved uniform distribution of processing gases into a semiconductor processing chamber. The gas distribution assembly includes a gas distribution plate, a blocker plate, and a dual zone showerhead. The gas distribution assembly provides for independent center to edge flow zonality, independent two precursor delivery, two precursor mixing via a mixing manifold, and recursive mass flow distribution in the gas distribution plate.

公开(公告)号：US20250125181A1

公开(公告)日：2025-04-17

申请号：US18486072

申请日：2023-10-12

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Onkara Swamy Kora Siddaramaiah ,  David Benjaminson ,  Ryan Pakulski ,  Anh N. Nguyen ,  Son T. Nguyen ,  Prashanth Rao

IPC: H01L21/683 ,  H01L21/67

Abstract: Exemplary semiconductor processing chambers may include a chamber body. The chambers may include a showerhead positioned atop the body. The chambers may include an electrostatic chuck assembly disposed within the body. The assembly may include a puck that may include a first plate including an electrically insulating material and that defines a substrate support surface. The puck may include a multi-zone heating assembly thermally coupled with the first plate. The puck may include bipolar electrodes. The puck may include a second plate that defines cooling channels. The assembly may include an insulator beneath the second plate. The assembly may include a base plate beneath the insulator. The assembly may include a shaft that may include a heater rod coupled with the heating assembly. The shaft may include a cooling fluid lumen fluidly coupled with the cooling channels. The shaft may include a power rod electrically coupled with a bipolar electrode.

公开(公告)号：US20230005765A1

公开(公告)日：2023-01-05

申请号：US17366761

申请日：2021-07-02

Applicant: Applied Materials, Inc.

Inventor： Son T. Nguyen ,  Kenneth D. Schatz ,  Anh N. Nguyen ,  Soonwook Jung ,  Ryan Pakulski ,  Anchuan Wang ,  Zihui Li

IPC: H01L21/67 ,  H01J37/32

Abstract: Exemplary semiconductor processing systems may include a processing chamber. The systems may include a remote plasma unit coupled with the processing chamber. The systems may include an adapter coupled between the remote plasma unit and the processing chamber. The adapter may be characterized by a first end and a second end opposite the first end. The remote plasma unit may be coupled with the adapter at the first end. The adapter may define a first central channel extending more than 50% of a length of the adapter from the first end of the adapter. The adapter may define a second central channel extending less than 50% of the length of the adapter from the second end of the adapter. The adapter may define a transition between the first central channel and the second central channel.

公开(公告)号：US09768043B2

公开(公告)日：2017-09-19

申请号：US14132215

申请日：2013-12-18

Applicant: Applied Materials, Inc.

Inventor： Anzhong Chang ,  Paul Brillhart ,  Surajit Kumar ,  Satheesh Kuppurao ,  Mehmet Tugrul Samir ,  David K. Carlson ,  Steve Aboagye ,  Anh N. Nguyen ,  Kailash Kiran Patalay ,  Joseph M. Ranish ,  Oleg Serebryanov ,  Dongming Iu ,  Shu-Kwan Lau ,  Zuoming Zhu ,  Herman Diniz

IPC: A21B2/00 ,  H01L21/67 ,  C23C16/455

CPC classification number: H01L21/67115 ,  C23C16/45504

Abstract: Embodiments of the present disclosure relate to a dome assembly. The dome assembly includes an upper dome including a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.

公开(公告)号：US11322337B2

公开(公告)日：2022-05-03

申请号：US15594297

申请日：2017-05-12

Applicant: APPLIED MATERIALS, INC.

Inventor： Dmitry Lubomirsky ,  Son T. Nguyen ,  Anh N. Nguyen ,  David Palagashvili

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: A workpiece carrier is described for a plasma processing chamber that has isolated heater plate blocks. In one example, a plasma processing system has a plasma chamber, a plasma source electrically coupled with a showerhead included within the plasma chamber, a workpiece holder in a processing region of the plasma chamber having a puck to carry a workpiece, wherein the workpiece holder includes a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, wherein each block includes a heater to heat a respective block of the heater plate, and wherein the workpiece holder includes a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate defining a cooling channel configured to distribute a heat transfer fluid to transfer heat from the cooling plate, and a temperature controller to independently control each heater.

公开(公告)号：US10431435B2

公开(公告)日：2019-10-01

申请号：US14614199

申请日：2015-02-04

Applicant: APPLIED MATERIALS, INC.

Inventor： Dmitry Lubomirsky ,  Son T. Nguyen ,  Anh N. Nguyen ,  David Palagashvill

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: A wafer carrier is described with independent isolated heater zones. In one example, the carrier has a puck to carry a workpiece for fabrication processes, a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, and each having a heater to heat a respective block of the heater plate, and a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate.

公开(公告)号：US10577690B2

公开(公告)日：2020-03-03

申请号：US15492928

申请日：2017-04-20

Applicant: Applied Materials, Inc.

Inventor： Anh N. Nguyen ,  Dmitry Lubomirsky ,  Mehmet Tugrul Samir

IPC: H01J37/00 ,  C23C16/455

Abstract: Embodiments disclosed herein generally relate to a gas distribution assembly for providing improved uniform distribution of processing gases into a semiconductor processing chamber. The gas distribution assembly includes a gas distribution plate, a blocker plate, and a dual zone showerhead. The gas distribution assembly provides for independent center to edge flow zonality, independent two precursor delivery, two precursor mixing via a mixing manifold, and recursive mass flow distribution in the gas distribution plate.