公开(公告)号：US11342209B2

公开(公告)日：2022-05-24

申请号：US16707945

申请日：2019-12-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Ji-Dih Hu ,  Wolfgang R. Aderhold ,  Dongming Iu

IPC: G01J5/00 ,  G01K1/00 ,  H01L21/67 ,  G01K7/01

Abstract: An apparatus for measuring a temperature of an assembly that is internal to a process chamber. The apparatus may include a light pipe positioned between a lamp radiation filtering window and the assembly, the light pipe has a first end with a bevel configured to redirect infrared radiation emitted from the assembly through the light pipe and has a second end distal to the first end, an optical assembly configured to collimate, filter, and focus infrared radiation from the second end of the light pipe, an optical detector configured to receive an output from the optical assembly and generate at least one signal representative of the infrared radiation, a temperature circuit that transforms the at least one signal into a temperature value, and a controller that is configured to receive the temperature value and to make adjustments to other process parameters of process chamber based on the temperature value.

公开(公告)号：US10770272B2

公开(公告)日：2020-09-08

申请号：US15480187

申请日：2017-04-05

Applicant: Applied Materials, Inc.

Inventor： Lara Hawrylchak ,  Matthew D. Scotney-Castle ,  Norman L. Tam ,  Matthew Spuller ,  Kong Lung Samuel Chan ,  Dongming Iu

IPC: H01J37/32

Abstract: Implementations described herein provide for thermal substrate processing apparatus including two thermal process chambers, each defining a process volume, and a substrate support disposed within each process volume. One or more remote plasma sources may be in fluid communication with the process volumes and the remote plasma sources may be configured to deliver a plasma to the process volumes. Various arrangements of remote plasma sources and chambers are described.

公开(公告)号：US10405375B2

公开(公告)日：2019-09-03

申请号：US14175821

申请日：2014-02-07

Applicant: Applied Materials, Inc.

Inventor： Joseph M. Ranish ,  Oleg Serebryanov ,  Dongming Iu

IPC: H05B3/00 ,  H01L21/67

Abstract: The embodiments described herein generally relate to a flexible standoff for use with a lamphead assembly in a thermal processing chamber. In one embodiment, the lamphead assembly can include a lamphead with one or more fixed lamphead positions, a lamp bulb, a lamp base with a standoff contact adaptor and a flexible standoff capable of attaching and positioning the lamp assembly. The flexible standoff can include a socket configured to receive a lamp base of a lamp assembly, a housing configured to position a lamp bulb of a lamp assembly in thermal connection with a processing chamber, a contact adaptor configured to electrically connect to a power supply and a conductive material to electrically connect the socket and the contact adaptor.

公开(公告)号：US11901195B2

公开(公告)日：2024-02-13

申请号：US17569238

申请日：2022-01-05

Applicant: Applied Materials, Inc.

Inventor： Pradeep Sampath Kumar ,  Norman L. Tam ,  Dongming Iu ,  Shashank Sharma ,  Eric R. Rieske ,  Michael P. Kamp

IPC: H01L21/324 ,  H01L21/321 ,  H01L21/67

CPC classification number: H01L21/324 ,  H01L21/321 ,  H01L21/67098 ,  H01L21/67201

Abstract: Aspects of the present disclosure relate to methods, systems, and apparatus for conducting a radical treatment operation on a substrate prior to conducting an annealing operation on the substrate. In one implementation, a method of processing semiconductor substrates includes pre-heating a substrate, and exposing the substrate to species radicals. The exposing of the substrate to the species radicals includes a treatment temperature that is less than 300 degrees Celsius, a treatment pressure that is less than 1.0 Torr, and a treatment time that is within a range of 8.0 minutes to 12.0 minutes. The method includes annealing the substrate after the exposing of the substrate to the species radicals. The annealing includes exposing the substrate to molecules, an anneal temperature that is 300 degrees Celsius or greater, an anneal pressure that is within a range of 500 Torr to 550 Torr, and an anneal time that is less than 4.0 minutes.

公开(公告)号：US20230297740A1

公开(公告)日：2023-09-21

申请号：US17695619

申请日：2022-03-15

Applicant: Applied Materials, Inc.

Inventor： Preetham Rao ,  Surajit Kumar ,  Dongming Iu ,  Wolfgang Aderhold

IPC: G06F30/27 ,  G06K9/62

CPC classification number: G06F30/27 ,  G06K9/6256 ,  G06F2119/08

Abstract: Embodiments disclosed herein include a method of modeling a rapid thermal processing (RTP) tool. In an embodiment, the method comprises developing a lamp model of an RTP tool, wherein the lamp model comprises a plurality of lamp zones, calculating an irradiance graph for the plurality of lamp zones, multiplying irradiance values of the plurality of lamp zones in the irradiance graph by a power of an existing RTP tool at a given time during a process recipe, summing the multiplied irradiance values for the plurality of lamp zones to form an irradiation graph of the lamp model, using the irradiation graph as an input to a machine learning algorithm, and outputting the temperature across a hypothetical substrate from the machine learning algorithm.

公开(公告)号：USD796562S1

公开(公告)日：2017-09-05

申请号：US29560798

申请日：2016-04-11

Applicant: Applied Materials, Inc.

Designer： Dongming Iu

公开(公告)号：US11664250B2

公开(公告)日：2023-05-30

申请号：US17728461

申请日：2022-04-25

Applicant: APPLIED MATERIALS, INC.

Inventor： Ji-Dih Hu ,  Wolfgang R. Aderhold ,  Dongming Iu

IPC: G01J5/00 ,  H01L21/00 ,  H01L21/67 ,  G01K7/01 ,  G01J5/0802 ,  G01J5/0818 ,  G01J5/0806

CPC classification number: H01L21/67248 ,  G01J5/0802 ,  G01J5/0806 ,  G01J5/0818 ,  G01K7/01 ,  H01L21/67115

Abstract: An apparatus for measuring a temperature of an assembly that is internal to a process chamber. The apparatus may include a light pipe positioned between a lamp radiation filtering window and the assembly, the light pipe has a first end with a bevel configured to redirect infrared radiation emitted from the assembly through the light pipe and has a second end distal to the first end, an optical assembly configured to collimate, filter, and focus infrared radiation from the second end of the light pipe, an optical detector configured to receive an output from the optical assembly and generate at least one signal representative of the infrared radiation, a temperature circuit that transforms the at least one signal into a temperature value, and a controller that is configured to receive the temperature value and to make adjustments to other process parameters of process chamber based on the temperature value.

公开(公告)号：US10202707B2

公开(公告)日：2019-02-12

申请号：US13865672

申请日：2013-04-18

Applicant: APPLIED MATERIALS, INC.

Inventor： Joseph M. Ranish ,  Paul Brillhart ,  Satheesh Kuppurao ,  Dongming Iu

IPC: F21V7/00 ,  C30B25/10

Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a lamphead for use in substrate processing includes a monolithic member having a contoured surface; a plurality of reflector cavities disposed in the contoured surface, wherein each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for a lamp; and a plurality of lamp passages, wherein each lamp passage extends into the monolithic member from one of the plurality of reflector cavities.

公开(公告)号：USD807481S1

公开(公告)日：2018-01-09

申请号：US29560668

申请日：2016-04-08

Applicant: Applied Materials, Inc.

Designer： Dongming Iu ,  Mehran Behdjat

公开(公告)号：US10948353B2

公开(公告)日：2021-03-16

申请号：US16741907

申请日：2020-01-14

Applicant: Applied Materials, Inc.

Inventor： Lara Hawrylchak ,  Samuel C. Howells ,  Wolfgang R. Aderhold ,  Leonid M. Tertitski ,  Michael Liu ,  Dongming Iu ,  Norman L. Tam ,  Ji-Dih Hu

IPC: G01J5/00 ,  H01L21/324 ,  G05D23/19 ,  H01L21/66 ,  H05B1/02 ,  G01J5/60 ,  H01L21/687 ,  H05B3/00 ,  H01L21/67

Abstract: Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. In one or more embodiments, a process chamber includes chamber body, a window disposed on a first portion of the chamber body, a chamber bottom, and a shield disposed on a second portion of the chamber body. The shield has a flat surface facing the window to reduce reflected radiant energy to a back side of a substrate disposed in the process chamber during operation. The process chamber further includes an edge support for supporting the substrate and a cooling member disposed on the chamber bottom. The cooling member is disposed in proximity of the edge support to cool the edge support during low temperature operation in order to improve the temperature uniformity of the substrate.