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公开(公告)号:US11495479B2
公开(公告)日:2022-11-08
申请号:US16553778
申请日:2019-08-28
Applicant: Applied Materials, Inc.
Inventor: Joseph M. Ranish , Aaron Muir Hunter , Anzhong Chang
Abstract: A processing chamber is described. The processing chamber includes a chamber having an interior volume, a light pipe window structure coupled to the chamber, the light pipe window structure having a first transparent plate disposed within the interior volume of the chamber, and a radiant heat source coupled to a second transparent plate of the light pipe window structure in a position outside of the interior volume of the chamber, wherein the light pipe window structure includes a plurality of light pipe structures disposed between the first transparent plate and the second transparent plate.
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公开(公告)号:US10119192B2
公开(公告)日:2018-11-06
申请号:US15136119
申请日:2016-04-22
Applicant: Applied Materials, Inc.
Inventor: Steve Aboagye , Paul Brillhart , Surajit Kumar , Anzhong Chang , Satheesh Kuppurao , Mehmet Tugrul Samir , David K. Carlson
IPC: C23C16/455 , C23C16/44 , C23C16/458 , C23C16/48
Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.
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公开(公告)号:US09322097B2
公开(公告)日:2016-04-26
申请号:US13846355
申请日:2013-03-18
Applicant: Applied Materials, Inc.
Inventor: Steve Aboagye , Paul Brillhart , Surajit Kumar , Anzhong Chang , Satheesh Kuppurao , Mehmet Tugrul Samir , David K. Carlson
IPC: C23C16/44 , C23C16/455 , C23C16/458 , C23C16/48
CPC classification number: C23C16/45502 , C23C16/4411 , C23C16/45504 , C23C16/45563 , C23C16/458 , C23C16/4584 , C23C16/481
Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.
Abstract translation: 本文所述的实施例涉及用于衬底处理室中的基座环组件。 在一个实施例中,基环组件包括尺寸适于容纳在基板处理室的内圆周内的环体,环体包括用于通过基板的装载口,气体入口和气体出口,其中, 气体入口和气体出口设置在环体的相对端,并且配置成设置在环体的顶表面上的上环和被配置为设置在环体的底表面上的下环,其中, 一旦组装,上环,下环和环体大致同心或同轴。
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公开(公告)号:US10269614B2
公开(公告)日:2019-04-23
申请号:US14885016
申请日:2015-10-16
Applicant: Applied Materials, Inc.
Inventor: Schubert S. Chu , Kartik Shah , Anhthu Ngo , Karthik Ramanathan , Nitin Pathak , Nyi O. Myo , Paul Brillhart , Richard O. Collins , Kevin Joseph Bautista , Edric Tong , Zhepeng Cong , Anzhong Chang , Kin Pong Lo , Manish Hemkar
IPC: H01L21/687 , H01L21/67 , C23C16/458
Abstract: Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region.
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公开(公告)号:US09845550B2
公开(公告)日:2017-12-19
申请号:US14613186
申请日:2015-02-03
Applicant: Applied Materials, Inc.
Inventor: Paul Brillhart , Anzhong Chang , Edric Tong , Kin Pong Lo , James Francis Mack , Zhiyuan Ye , Kartik Shah , Errol Antonio C. Sanchez , David K. Carlson , Satheesh Kuppurao , Joseph M. Ranish
CPC classification number: C30B25/14 , C30B25/08 , C30B25/10 , H01L21/67115
Abstract: Embodiments provided herein generally relate to an apparatus for delivering gas to a semiconductor processing chamber. An upper quartz dome of an epitaxial semiconductor processing chamber has a plurality of holes formed therein and precursor gases are provided into a processing volume of the chamber through the holes of the upper dome. Gas delivery tubes extend from the holes in the dome to a flange plate where the tubes are coupled to gas delivery lines. The gas delivery apparatus enables gases to be delivered to the processing volume above a substrate through the quartz upper dome.
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公开(公告)号:US20140261185A1
公开(公告)日:2014-09-18
申请号:US13846355
申请日:2013-03-18
Applicant: Applied Materials, Inc.
Inventor: STEVE ABOAGYE , Paul Brillhart , Surajit Kumar , Anzhong Chang , Satheesh Kuppurao , Mehmet Tugrul Samir , David K. Carlson
IPC: C23C16/455
CPC classification number: C23C16/45502 , C23C16/4411 , C23C16/45504 , C23C16/45563 , C23C16/458 , C23C16/4584 , C23C16/481
Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.
Abstract translation: 本文所述的实施例涉及用于衬底处理室中的基座环组件。 在一个实施例中,基环组件包括尺寸适于容纳在基板处理室的内圆周内的环体,环体包括用于通过基板的装载口,气体入口和气体出口,其中, 气体入口和气体出口设置在环体的相对端,并且配置成设置在环体的顶表面上的上环和被配置为设置在环体的底表面上的下环,其中, 一旦组装,上环,下环和环体大致同心或同轴。
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公开(公告)号:US08679956B2
公开(公告)日:2014-03-25
申请号:US13751889
申请日:2013-01-28
Applicant: Applied Materials, Inc.
Inventor: Alexander Tam , Anzhong Chang , Sumedh Acharya
CPC classification number: B05B1/18 , C23C16/45519 , C23C16/45565 , C23C16/52 , C30B25/14 , H01L21/67115
Abstract: A method and apparatus that includes a processing chamber that includes a showerhead with separate inlets and channels for delivering separate processing gases into a processing volume of the chamber without mixing the gases prior to entering the processing volume is provided. The showerhead includes one or more cleaning gas conduits configured to deliver a cleaning gas directly into the processing volume of the chamber while by-passing the processing gas channels. The showerhead may include a plurality of metrology ports configured to deliver a cleaning gas directly into the processing volume of the chamber while by-passing the processing gas channels. As a result, the processing chamber components can be cleaned more efficiently and effectively than by introducing cleaning gas into the chamber only through the processing gas channels.
Abstract translation: 提供了一种包括处理室的方法和装置,该处理室包括具有单独的入口和通道的喷头,用于将不同的处理气体输送到室的处理容积中,而不会在进入处理容积之前混合气体。 淋浴头包括一个或多个清洁气体管道,其配置成在旁路处理气体通道的同时将清洁气体直接输送到室的处理容积中。 淋浴头可以包括多个计量端口,其配置成在旁路处理气体通道的同时将清洁气体直接输送到室的处理容积中。 结果,与仅通过处理气体通道将清洁气体引入室中相比,可以更有效和有效地清洁处理室部件。
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公开(公告)号:US10458040B2
公开(公告)日:2019-10-29
申请号:US15809088
申请日:2017-11-10
Applicant: Applied Materials, Inc.
Inventor: Paul Brillhart , Anzhong Chang , Edric Tong , Kin Pong Lo , James Francis Mack , Zhiyuan Ye , Kartik Shah , Errol Antonio C. Sanchez , David K. Carlson , Satheesh Kuppurao , Joseph M. Ranish
Abstract: Embodiments provided herein generally relate to an apparatus for delivering gas to a semiconductor processing chamber. An upper quartz dome of an epitaxial semiconductor processing chamber has a plurality of holes formed therein and precursor gases are provided into a processing volume of the chamber through the holes of the upper dome. Gas delivery tubes extend from the holes in the dome to a flange plate where the tubes are coupled to gas delivery lines. The gas delivery apparatus enables gases to be delivered to the processing volume above a substrate through the quartz upper dome.
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公开(公告)号:USD711331S1
公开(公告)日:2014-08-19
申请号:US29472048
申请日:2013-11-07
Applicant: Applied Materials, Inc.
Designer: Shu-Kwan Lau , Mehmet Tugrul Samir , Anzhong Chang , Paul Brillhart , Richard O. Collins
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公开(公告)号:US10930543B2
公开(公告)日:2021-02-23
申请号:US16109945
申请日:2018-08-23
Applicant: Applied Materials, Inc.
Inventor: Anhthu Ngo , Zuoming Zhu , Balasubramanian Ramachandran , Paul Brillhart , Edric Tong , Anzhong Chang , Kin Pong Lo , Kartik Shah , Schubert S. Chu , Zhepeng Cong , James Francis Mack , Nyi O. Myo , Kevin Joseph Bautista , Xuebin Li , Yi-Chiau Huang , Zhiyuan Ye
IPC: H01L21/687 , C30B25/12 , B05C13/02 , B05C13/00 , H01L21/673 , C23C16/458
Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.
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