公开(公告)号：US20170207069A1

公开(公告)日：2017-07-20

申请号：US15397883

申请日：2017-01-04

Applicant: Applied Materials, Inc.

Inventor： Sidharth BHATIA ,  Zhili ZUO ,  Hidehiro KOJIRI ,  Anjana M. PATEL ,  Song-Moon SUH ,  Ganesh BALASUBRAMANIAN

IPC: H01J37/32 ,  B08B5/00 ,  C23C16/44 ,  B08B9/00

Abstract: A method of cleaning a remote plasma source includes supplying a first cycle of one or more first cleaning gases to a remote plasma source. The method includes supplying a second cycle of one or more second cleaning gases to the remote plasma source. The method includes supplying one or more cooling fluids to one or more cooling conduits coupled with the remote plasma source.

公开(公告)号：US20230151487A1

公开(公告)日：2023-05-18

申请号：US18099371

申请日：2023-01-20

Applicant: Applied Materials, Inc.

Inventor： Liangfa HU ,  Prashant Kumar KULSHRESHTHA ,  Anjana M. PATEL ,  Abdul Aziz KHAJA ,  Viren KALSEKAR ,  Vinay K. PRABHAKAR ,  Satya Teja Babu THOKACHICHU ,  Byung Seok KWON ,  Ratsamee LIMDULPAIBOON ,  Kwangduk Douglas LEE ,  Ganesh BALASUBRAMANIAN

IPC: C23C16/455 ,  C23C16/505 ,  C23C16/44

CPC classification number: C23C16/455 ,  C23C16/505 ,  C23C16/45597 ,  C23C16/4401 ,  C23C16/4408 ,  C23C16/45519

Abstract: The present disclosure relates to systems and methods for reducing the formation of hardware residue and minimizing secondary plasma formation during substrate processing in a process chamber. The process chamber may include a gas distribution member configured to flow a first gas into a process volume and generate a plasma therefrom. A second gas is supplied into a lower region of the process volume. Further, an exhaust port is disposed in the lower region to remove excess gases or by-products from the process volume during or after processing.

公开(公告)号：US20160314944A1

公开(公告)日：2016-10-27

申请号：US15136788

申请日：2016-04-22

Applicant: Applied Materials, Inc.

Inventor： Sidharth BHATIA ,  Anjana M. PATEL ,  Abdul Aziz KHAJA

IPC: H01J37/32

CPC classification number: H01J37/32963 ,  H01J2237/334

Abstract: Embodiments described herein relate to methods for determining a cleaning endpoint. A first plasma cleaning process may be performed in a clean chamber environment to determine a clean time function defined by a first slope. A second plasma cleaning process may be performed in an unclean chamber environment to determine a clean time function defined by a second slope. The first and second slope may be compared to determine a clean endpoint time.

Abstract translation: 本文描述的实施例涉及用于确定清洁端点的方法。 可以在清洁室环境中执行第一等离子体清洁过程，以确定由第一斜率限定的清洁时间函数。 可以在不洁室的环境中进行第二等离子体清洗过程，以确定由第二斜率限定的清洁时间函数。 可以比较第一和第二斜率以确定干净的端点时间。

公开(公告)号：US20210143005A1

公开(公告)日：2021-05-13

申请号：US17124705

申请日：2020-12-17

Applicant: Applied Materials, Inc.

Inventor： Tuan Anh NGUYEN ,  Jeongmin LEE ,  Anjana M. PATEL ,  Abdul Aziz KHAJA

IPC: H01L21/02 ,  B08B7/00 ,  H01L21/3065 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments described herein generally relate to apparatuses for processing a substrate. In one or more embodiments, a heater support kit includes a heater assembly contains a heater plate having an upper surface and a lower surface, a chuck ring disposed on at least a portion of the upper surface of the heater plate, a heater arm assembly contains a heater arm and supporting the heater assembly, and a heater support plate disposed between the heater plate and the heater arm and in contact with at least a portion of the lower surface of the heater plate.

公开(公告)号：US20190272991A1

公开(公告)日：2019-09-05

申请号：US16419813

申请日：2019-05-22

Applicant: Applied Materials, Inc.

Inventor： Tuan Anh NGUYEN ,  Jeongmin LEE ,  Anjana M. PATEL ,  Abdul Aziz KHAJA

IPC: H01L21/02 ,  B08B7/00 ,  H01L21/3065 ,  H01J37/32 ,  H01L21/67

Abstract: Embodiments described herein generally relate to apparatuses for processing a substrate. In one or more embodiments, a heater support kit includes a heater assembly contains a heater plate having an upper surface and a lower surface, a chuck ring disposed on at least a portion of the upper surface of the heater plate, a heater arm assembly contains a heater arm and supporting the heater assembly, and a heater support plate disposed between the heater plate and the heater arm and in contact with at least a portion of the lower surface of the heater plate.